A high-density interconnect (HDI) is a fastest growing technology used in the printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards. These HDI PCBs have finer lines and spaces ( 100 m), smaller vias ( 150 m), and capture pads ( 400 m). Moreover, HDI PCBs have a relatively higher connection pad density over conventional PCBs that is over 20 pads/cm2. Hence, they are widely adopted in the consumer electronics sector and have a high growth potential in the automotive industry.
The global High Density Interconnect PCB market is projected to grow from US$ 9062.1 million in 2024 to US$ 13600 million by 2030, at a Compound Annual Growth Rate (CAGR) of 7.0% during the forecast period.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
In terms of production side, this report researches the High Density Interconnect PCB production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of High Density Interconnect PCB by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for High Density Interconnect PCB, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of High Density Interconnect PCB, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for High Density Interconnect PCB, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the High Density Interconnect PCB sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global High Density Interconnect PCB market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for High Density Interconnect PCB sales, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
TTM Technologies (US)
PCBCART (China)
Millennium Circuits Limited (US)
RAYMING (China)
Mistral Solutions Pvt. Ltd. (India)
SIERRA CIRCUITS INC. (US)
Advanced Circuits (US)
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
FINELINE Ltd. (Israel)
Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
Segment by Type
Smartphone & Tablet
Laptop & PC
Smart Wearables
Others
Segment by Application
Consumer Electronics
Military And Defense
Telecom And IT
Automotive
Production by Region
North America
Europe
China
Japan
South Korea
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: High Density Interconnect PCB production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of High Density Interconnect PCB in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of High Density Interconnect PCB manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, High Density Interconnect PCB sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 High Density Interconnect PCB Product Introduction
1.2 Market by Type
1.2.1 Global High Density Interconnect PCB Market Size by Type, 2019 VS 2023 VS 2030
1.2.2 Smartphone & Tablet
1.2.3 Laptop & PC
1.2.4 Smart Wearables
1.2.5 Others
1.3 Market by Application
1.3.1 Global High Density Interconnect PCB Market Size by Application, 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Military And Defense
1.3.4 Telecom And IT
1.3.5 Automotive
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global High Density Interconnect PCB Production
2.1 Global High Density Interconnect PCB Production Capacity (2019-2030)
2.2 Global High Density Interconnect PCB Production by Region: 2019 VS 2023 VS 2030
2.3 Global High Density Interconnect PCB Production by Region
2.3.1 Global High Density Interconnect PCB Historic Production by Region (2019-2024)
2.3.2 Global High Density Interconnect PCB Forecasted Production by Region (2025-2030)
2.3.3 Global High Density Interconnect PCB Production Market Share by Region (2019-2030)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global High Density Interconnect PCB Revenue Estimates and Forecasts 2019-2030
3.2 Global High Density Interconnect PCB Revenue by Region
3.2.1 Global High Density Interconnect PCB Revenue by Region: 2019 VS 2023 VS 2030
3.2.2 Global High Density Interconnect PCB Revenue by Region (2019-2024)
3.2.3 Global High Density Interconnect PCB Revenue by Region (2025-2030)
3.2.4 Global High Density Interconnect PCB Revenue Market Share by Region (2019-2030)
3.3 Global High Density Interconnect PCB Sales Estimates and Forecasts 2019-2030
3.4 Global High Density Interconnect PCB Sales by Region
3.4.1 Global High Density Interconnect PCB Sales by Region: 2019 VS 2023 VS 2030
3.4.2 Global High Density Interconnect PCB Sales by Region (2019-2024)
3.4.3 Global High Density Interconnect PCB Sales by Region (2025-2030)
3.4.4 Global High Density Interconnect PCB Sales Market Share by Region (2019-2030)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global High Density Interconnect PCB Sales by Manufacturers
4.1.1 Global High Density Interconnect PCB Sales by Manufacturers (2019-2024)
4.1.2 Global High Density Interconnect PCB Sales Market Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of High Density Interconnect PCB in 2023
4.2 Global High Density Interconnect PCB Revenue by Manufacturers
4.2.1 Global High Density Interconnect PCB Revenue by Manufacturers (2019-2024)
4.2.2 Global High Density Interconnect PCB Revenue Market Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by High Density Interconnect PCB Revenue in 2023
4.3 Global High Density Interconnect PCB Sales Price by Manufacturers
4.4 Global Key Players of High Density Interconnect PCB, Industry Ranking, 2022 VS 2023 VS 2024
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global High Density Interconnect PCB Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of High Density Interconnect PCB, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of High Density Interconnect PCB, Product Offered and Application
4.8 Global Key Manufacturers of High Density Interconnect PCB, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global High Density Interconnect PCB Sales by Type
5.1.1 Global High Density Interconnect PCB Historical Sales by Type (2019-2024)
5.1.2 Global High Density Interconnect PCB Forecasted Sales by Type (2025-2030)
5.1.3 Global High Density Interconnect PCB Sales Market Share by Type (2019-2030)
5.2 Global High Density Interconnect PCB Revenue by Type
5.2.1 Global High Density Interconnect PCB Historical Revenue by Type (2019-2024)
5.2.2 Global High Density Interconnect PCB Forecasted Revenue by Type (2025-2030)
5.2.3 Global High Density Interconnect PCB Revenue Market Share by Type (2019-2030)
5.3 Global High Density Interconnect PCB Price by Type
5.3.1 Global High Density Interconnect PCB Price by Type (2019-2024)
5.3.2 Global High Density Interconnect PCB Price Forecast by Type (2025-2030)
6 Market Size by Application
6.1 Global High Density Interconnect PCB Sales by Application
6.1.1 Global High Density Interconnect PCB Historical Sales by Application (2019-2024)
6.1.2 Global High Density Interconnect PCB Forecasted Sales by Application (2025-2030)
6.1.3 Global High Density Interconnect PCB Sales Market Share by Application (2019-2030)
6.2 Global High Density Interconnect PCB Revenue by Application
6.2.1 Global High Density Interconnect PCB Historical Revenue by Application (2019-2024)
6.2.2 Global High Density Interconnect PCB Forecasted Revenue by Application (2025-2030)
6.2.3 Global High Density Interconnect PCB Revenue Market Share by Application (2019-2030)
6.3 Global High Density Interconnect PCB Price by Application
6.3.1 Global High Density Interconnect PCB Price by Application (2019-2024)
6.3.2 Global High Density Interconnect PCB Price Forecast by Application (2025-2030)
7 US & Canada
7.1 US & Canada High Density Interconnect PCB Market Size by Type
7.1.1 US & Canada High Density Interconnect PCB Sales by Type (2019-2030)
7.1.2 US & Canada High Density Interconnect PCB Revenue by Type (2019-2030)
7.2 US & Canada High Density Interconnect PCB Market Size by Application
7.2.1 US & Canada High Density Interconnect PCB Sales by Application (2019-2030)
7.2.2 US & Canada High Density Interconnect PCB Revenue by Application (2019-2030)
7.3 US & Canada High Density Interconnect PCB Sales by Country
7.3.1 US & Canada High Density Interconnect PCB Revenue by Country: 2019 VS 2023 VS 2030
7.3.2 US & Canada High Density Interconnect PCB Sales by Country (2019-2030)
7.3.3 US & Canada High Density Interconnect PCB Revenue by Country (2019-2030)
7.3.4 U.S.
7.3.5 Canada
8 Europe
8.1 Europe High Density Interconnect PCB Market Size by Type
8.1.1 Europe High Density Interconnect PCB Sales by Type (2019-2030)
8.1.2 Europe High Density Interconnect PCB Revenue by Type (2019-2030)
8.2 Europe High Density Interconnect PCB Market Size by Application
8.2.1 Europe High Density Interconnect PCB Sales by Application (2019-2030)
8.2.2 Europe High Density Interconnect PCB Revenue by Application (2019-2030)
8.3 Europe High Density Interconnect PCB Sales by Country
8.3.1 Europe High Density Interconnect PCB Revenue by Country: 2019 VS 2023 VS 2030
8.3.2 Europe High Density Interconnect PCB Sales by Country (2019-2030)
8.3.3 Europe High Density Interconnect PCB Revenue by Country (2019-2030)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China High Density Interconnect PCB Market Size by Type
9.1.1 China High Density Interconnect PCB Sales by Type (2019-2030)
9.1.2 China High Density Interconnect PCB Revenue by Type (2019-2030)
9.2 China High Density Interconnect PCB Market Size by Application
9.2.1 China High Density Interconnect PCB Sales by Application (2019-2030)
9.2.2 China High Density Interconnect PCB Revenue by Application (2019-2030)
10 Asia (excluding China)
10.1 Asia High Density Interconnect PCB Market Size by Type
10.1.1 Asia High Density Interconnect PCB Sales by Type (2019-2030)
10.1.2 Asia High Density Interconnect PCB Revenue by Type (2019-2030)
10.2 Asia High Density Interconnect PCB Market Size by Application
10.2.1 Asia High Density Interconnect PCB Sales by Application (2019-2030)
10.2.2 Asia High Density Interconnect PCB Revenue by Application (2019-2030)
10.3 Asia High Density Interconnect PCB Sales by Region
10.3.1 Asia High Density Interconnect PCB Revenue by Region: 2019 VS 2023 VS 2030
10.3.2 Asia High Density Interconnect PCB Revenue by Region (2019-2030)
10.3.3 Asia High Density Interconnect PCB Sales by Region (2019-2030)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America High Density Interconnect PCB Market Size by Type
11.1.1 Middle East, Africa and Latin America High Density Interconnect PCB Sales by Type (2019-2030)
11.1.2 Middle East, Africa and Latin America High Density Interconnect PCB Revenue by Type (2019-2030)
11.2 Middle East, Africa and Latin America High Density Interconnect PCB Market Size by Application
11.2.1 Middle East, Africa and Latin America High Density Interconnect PCB Sales by Application (2019-2030)
11.2.2 Middle East, Africa and Latin America High Density Interconnect PCB Revenue by Application (2019-2030)
11.3 Middle East, Africa and Latin America High Density Interconnect PCB Sales by Country
11.3.1 Middle East, Africa and Latin America High Density Interconnect PCB Revenue by Country: 2019 VS 2023 VS 2030
11.3.2 Middle East, Africa and Latin America High Density Interconnect PCB Revenue by Country (2019-2030)
11.3.3 Middle East, Africa and Latin America High Density Interconnect PCB Sales by Country (2019-2030)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 TTM Technologies (US)
12.1.1 TTM Technologies (US) Company Information
12.1.2 TTM Technologies (US) Overview
12.1.3 TTM Technologies (US) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.1.4 TTM Technologies (US) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 TTM Technologies (US) Recent Developments
12.2 PCBCART (China)
12.2.1 PCBCART (China) Company Information
12.2.2 PCBCART (China) Overview
12.2.3 PCBCART (China) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.2.4 PCBCART (China) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 PCBCART (China) Recent Developments
12.3 Millennium Circuits Limited (US)
12.3.1 Millennium Circuits Limited (US) Company Information
12.3.2 Millennium Circuits Limited (US) Overview
12.3.3 Millennium Circuits Limited (US) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.3.4 Millennium Circuits Limited (US) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Millennium Circuits Limited (US) Recent Developments
12.4 RAYMING (China)
12.4.1 RAYMING (China) Company Information
12.4.2 RAYMING (China) Overview
12.4.3 RAYMING (China) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.4.4 RAYMING (China) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 RAYMING (China) Recent Developments
12.5 Mistral Solutions Pvt. Ltd. (India)
12.5.1 Mistral Solutions Pvt. Ltd. (India) Company Information
12.5.2 Mistral Solutions Pvt. Ltd. (India) Overview
12.5.3 Mistral Solutions Pvt. Ltd. (India) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.5.4 Mistral Solutions Pvt. Ltd. (India) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Mistral Solutions Pvt. Ltd. (India) Recent Developments
12.6 SIERRA CIRCUITS INC. (US)
12.6.1 SIERRA CIRCUITS INC. (US) Company Information
12.6.2 SIERRA CIRCUITS INC. (US) Overview
12.6.3 SIERRA CIRCUITS INC. (US) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.6.4 SIERRA CIRCUITS INC. (US) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 SIERRA CIRCUITS INC. (US) Recent Developments
12.7 Advanced Circuits (US)
12.7.1 Advanced Circuits (US) Company Information
12.7.2 Advanced Circuits (US) Overview
12.7.3 Advanced Circuits (US) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.7.4 Advanced Circuits (US) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Advanced Circuits (US) Recent Developments
12.8 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
12.8.1 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) Company Information
12.8.2 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) Overview
12.8.3 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.8.4 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) Recent Developments
12.9 FINELINE Ltd. (Israel)
12.9.1 FINELINE Ltd. (Israel) Company Information
12.9.2 FINELINE Ltd. (Israel) Overview
12.9.3 FINELINE Ltd. (Israel) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.9.4 FINELINE Ltd. (Israel) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 FINELINE Ltd. (Israel) Recent Developments
12.10 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
12.10.1 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) Company Information
12.10.2 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) Overview
12.10.3 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) High Density Interconnect PCB Sales, Price, Revenue and Gross Margin (2019-2024)
12.10.4 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) High Density Interconnect PCB Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 High Density Interconnect PCB Industry Chain Analysis
13.2 High Density Interconnect PCB Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 High Density Interconnect PCB Production Mode & Process
13.4 High Density Interconnect PCB Sales and Marketing
13.4.1 High Density Interconnect PCB Sales Channels
13.4.2 High Density Interconnect PCB Distributors
13.5 High Density Interconnect PCB Customers
14 High Density Interconnect PCB Market Dynamics
14.1 High Density Interconnect PCB Industry Trends
14.2 High Density Interconnect PCB Market Drivers
14.3 High Density Interconnect PCB Market Challenges
14.4 High Density Interconnect PCB Market Restraints
15 Key Finding in The Global High Density Interconnect PCB Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
TTM Technologies (US)
PCBCART (China)
Millennium Circuits Limited (US)
RAYMING (China)
Mistral Solutions Pvt. Ltd. (India)
SIERRA CIRCUITS INC. (US)
Advanced Circuits (US)
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
FINELINE Ltd. (Israel)
Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
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*If Applicable.
