The global market for IC Chip Packaging and Testing was valued at US$ 509 million in the year 2024 and is projected to reach a revised size of US$ 905 million by 2031, growing at a CAGR of 8.7% during the forecast period.
IC chip packages refer to materials that contain semiconductor devices. Encapsulation is an enclosure that surrounds circuit material to protect it from corrosion or physical damage and to allow mounting of electrical contacts that connect it to a printed circuit board (PCB). IC chip packaging is capable of providing more and more I/O interconnects to smaller and smaller dies (bare chips).
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Chip Packaging and Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Chip Packaging and Testing.
The IC Chip Packaging and Testing market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global IC Chip Packaging and Testing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Chip Packaging and Testing manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE
Amkor Technology
SPIL
Powertech Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
J-Devices
ITEQ
HT-Tech
JCET
TongFu Microelectronics
Chipmore Technology
China Resources Microelectronics
Forehope Electronic
Wafer Level CSP
Chizhou HISEMI Electronic Technology
Keyang
Leadyo IC Testing
by Type
BGA
LGA
SiP
FC
Others
by Application
Communications
Consumer Electronics
Electric Vehicles
Aerospace
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Chip Packaging and Testing manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Chip Packaging and Testing by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Chip Packaging and Testing in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 IC Chip Packaging and Testing Market Overview
1.1 Product Definition
1.2 IC Chip Packaging and Testing by Type
1.2.1 Global IC Chip Packaging and Testing Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 BGA
1.2.3 LGA
1.2.4 SiP
1.2.5 FC
1.2.6 Others
1.3 IC Chip Packaging and Testing by Application
1.3.1 Global IC Chip Packaging and Testing Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Communications
1.3.3 Consumer Electronics
1.3.4 Electric Vehicles
1.3.5 Aerospace
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Chip Packaging and Testing Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global IC Chip Packaging and Testing Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global IC Chip Packaging and Testing Production Estimates and Forecasts (2020-2031)
1.4.4 Global IC Chip Packaging and Testing Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Chip Packaging and Testing Production Market Share by Manufacturers (2020-2025)
2.2 Global IC Chip Packaging and Testing Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of IC Chip Packaging and Testing, Industry Ranking, 2023 VS 2024
2.4 Global IC Chip Packaging and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global IC Chip Packaging and Testing Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of IC Chip Packaging and Testing, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Chip Packaging and Testing, Product Offered and Application
2.8 Global Key Manufacturers of IC Chip Packaging and Testing, Date of Enter into This Industry
2.9 IC Chip Packaging and Testing Market Competitive Situation and Trends
2.9.1 IC Chip Packaging and Testing Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Chip Packaging and Testing Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Chip Packaging and Testing Production by Region
3.1 Global IC Chip Packaging and Testing Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global IC Chip Packaging and Testing Production Value by Region (2020-2031)
3.2.1 Global IC Chip Packaging and Testing Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of IC Chip Packaging and Testing by Region (2026-2031)
3.3 Global IC Chip Packaging and Testing Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global IC Chip Packaging and Testing Production Volume by Region (2020-2031)
3.4.1 Global IC Chip Packaging and Testing Production by Region (2020-2025)
3.4.2 Global Forecasted Production of IC Chip Packaging and Testing by Region (2026-2031)
3.5 Global IC Chip Packaging and Testing Market Price Analysis by Region (2020-2025)
3.6 Global IC Chip Packaging and Testing Production and Value, Year-over-Year Growth
3.6.1 North America IC Chip Packaging and Testing Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe IC Chip Packaging and Testing Production Value Estimates and Forecasts (2020-2031)
3.6.3 China IC Chip Packaging and Testing Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan IC Chip Packaging and Testing Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea IC Chip Packaging and Testing Production Value Estimates and Forecasts (2020-2031)
4 IC Chip Packaging and Testing Consumption by Region
4.1 Global IC Chip Packaging and Testing Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global IC Chip Packaging and Testing Consumption by Region (2020-2031)
4.2.1 Global IC Chip Packaging and Testing Consumption by Region (2020-2025)
4.2.2 Global IC Chip Packaging and Testing Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America IC Chip Packaging and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America IC Chip Packaging and Testing Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Chip Packaging and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe IC Chip Packaging and Testing Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific IC Chip Packaging and Testing Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific IC Chip Packaging and Testing Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Chip Packaging and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa IC Chip Packaging and Testing Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global IC Chip Packaging and Testing Production by Type (2020-2031)
5.1.1 Global IC Chip Packaging and Testing Production by Type (2020-2025)
5.1.2 Global IC Chip Packaging and Testing Production by Type (2026-2031)
5.1.3 Global IC Chip Packaging and Testing Production Market Share by Type (2020-2031)
5.2 Global IC Chip Packaging and Testing Production Value by Type (2020-2031)
5.2.1 Global IC Chip Packaging and Testing Production Value by Type (2020-2025)
5.2.2 Global IC Chip Packaging and Testing Production Value by Type (2026-2031)
5.2.3 Global IC Chip Packaging and Testing Production Value Market Share by Type (2020-2031)
5.3 Global IC Chip Packaging and Testing Price by Type (2020-2031)
6 Segment by Application
6.1 Global IC Chip Packaging and Testing Production by Application (2020-2031)
6.1.1 Global IC Chip Packaging and Testing Production by Application (2020-2025)
6.1.2 Global IC Chip Packaging and Testing Production by Application (2026-2031)
6.1.3 Global IC Chip Packaging and Testing Production Market Share by Application (2020-2031)
6.2 Global IC Chip Packaging and Testing Production Value by Application (2020-2031)
6.2.1 Global IC Chip Packaging and Testing Production Value by Application (2020-2025)
6.2.2 Global IC Chip Packaging and Testing Production Value by Application (2026-2031)
6.2.3 Global IC Chip Packaging and Testing Production Value Market Share by Application (2020-2031)
6.3 Global IC Chip Packaging and Testing Price by Application (2020-2031)
7 Key Companies Profiled
7.1 ASE
7.1.1 ASE IC Chip Packaging and Testing Company Information
7.1.2 ASE IC Chip Packaging and Testing Product Portfolio
7.1.3 ASE IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.1.4 ASE Main Business and Markets Served
7.1.5 ASE Recent Developments/Updates
7.2 Amkor Technology
7.2.1 Amkor Technology IC Chip Packaging and Testing Company Information
7.2.2 Amkor Technology IC Chip Packaging and Testing Product Portfolio
7.2.3 Amkor Technology IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Amkor Technology Main Business and Markets Served
7.2.5 Amkor Technology Recent Developments/Updates
7.3 SPIL
7.3.1 SPIL IC Chip Packaging and Testing Company Information
7.3.2 SPIL IC Chip Packaging and Testing Product Portfolio
7.3.3 SPIL IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.3.4 SPIL Main Business and Markets Served
7.3.5 SPIL Recent Developments/Updates
7.4 Powertech Technology
7.4.1 Powertech Technology IC Chip Packaging and Testing Company Information
7.4.2 Powertech Technology IC Chip Packaging and Testing Product Portfolio
7.4.3 Powertech Technology IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Powertech Technology Main Business and Markets Served
7.4.5 Powertech Technology Recent Developments/Updates
7.5 UTAC
7.5.1 UTAC IC Chip Packaging and Testing Company Information
7.5.2 UTAC IC Chip Packaging and Testing Product Portfolio
7.5.3 UTAC IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.5.4 UTAC Main Business and Markets Served
7.5.5 UTAC Recent Developments/Updates
7.6 Chipbond Technology
7.6.1 Chipbond Technology IC Chip Packaging and Testing Company Information
7.6.2 Chipbond Technology IC Chip Packaging and Testing Product Portfolio
7.6.3 Chipbond Technology IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Chipbond Technology Main Business and Markets Served
7.6.5 Chipbond Technology Recent Developments/Updates
7.7 Hana Micron
7.7.1 Hana Micron IC Chip Packaging and Testing Company Information
7.7.2 Hana Micron IC Chip Packaging and Testing Product Portfolio
7.7.3 Hana Micron IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Hana Micron Main Business and Markets Served
7.7.5 Hana Micron Recent Developments/Updates
7.8 OSE
7.8.1 OSE IC Chip Packaging and Testing Company Information
7.8.2 OSE IC Chip Packaging and Testing Product Portfolio
7.8.3 OSE IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.8.4 OSE Main Business and Markets Served
7.8.5 OSE Recent Developments/Updates
7.9 Walton Advanced Engineering
7.9.1 Walton Advanced Engineering IC Chip Packaging and Testing Company Information
7.9.2 Walton Advanced Engineering IC Chip Packaging and Testing Product Portfolio
7.9.3 Walton Advanced Engineering IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Walton Advanced Engineering Main Business and Markets Served
7.9.5 Walton Advanced Engineering Recent Developments/Updates
7.10 NEPES
7.10.1 NEPES IC Chip Packaging and Testing Company Information
7.10.2 NEPES IC Chip Packaging and Testing Product Portfolio
7.10.3 NEPES IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.10.4 NEPES Main Business and Markets Served
7.10.5 NEPES Recent Developments/Updates
7.11 Unisem
7.11.1 Unisem IC Chip Packaging and Testing Company Information
7.11.2 Unisem IC Chip Packaging and Testing Product Portfolio
7.11.3 Unisem IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Unisem Main Business and Markets Served
7.11.5 Unisem Recent Developments/Updates
7.12 ChipMOS Technologies
7.12.1 ChipMOS Technologies IC Chip Packaging and Testing Company Information
7.12.2 ChipMOS Technologies IC Chip Packaging and Testing Product Portfolio
7.12.3 ChipMOS Technologies IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.12.4 ChipMOS Technologies Main Business and Markets Served
7.12.5 ChipMOS Technologies Recent Developments/Updates
7.13 Signetics
7.13.1 Signetics IC Chip Packaging and Testing Company Information
7.13.2 Signetics IC Chip Packaging and Testing Product Portfolio
7.13.3 Signetics IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Signetics Main Business and Markets Served
7.13.5 Signetics Recent Developments/Updates
7.14 Carsem
7.14.1 Carsem IC Chip Packaging and Testing Company Information
7.14.2 Carsem IC Chip Packaging and Testing Product Portfolio
7.14.3 Carsem IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Carsem Main Business and Markets Served
7.14.5 Carsem Recent Developments/Updates
7.15 KYEC
7.15.1 KYEC IC Chip Packaging and Testing Company Information
7.15.2 KYEC IC Chip Packaging and Testing Product Portfolio
7.15.3 KYEC IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.15.4 KYEC Main Business and Markets Served
7.15.5 KYEC Recent Developments/Updates
7.16 J-Devices
7.16.1 J-Devices IC Chip Packaging and Testing Company Information
7.16.2 J-Devices IC Chip Packaging and Testing Product Portfolio
7.16.3 J-Devices IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.16.4 J-Devices Main Business and Markets Served
7.16.5 J-Devices Recent Developments/Updates
7.17 ITEQ
7.17.1 ITEQ IC Chip Packaging and Testing Company Information
7.17.2 ITEQ IC Chip Packaging and Testing Product Portfolio
7.17.3 ITEQ IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.17.4 ITEQ Main Business and Markets Served
7.17.5 ITEQ Recent Developments/Updates
7.18 HT-Tech
7.18.1 HT-Tech IC Chip Packaging and Testing Company Information
7.18.2 HT-Tech IC Chip Packaging and Testing Product Portfolio
7.18.3 HT-Tech IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.18.4 HT-Tech Main Business and Markets Served
7.18.5 HT-Tech Recent Developments/Updates
7.19 JCET
7.19.1 JCET IC Chip Packaging and Testing Company Information
7.19.2 JCET IC Chip Packaging and Testing Product Portfolio
7.19.3 JCET IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.19.4 JCET Main Business and Markets Served
7.19.5 JCET Recent Developments/Updates
7.20 TongFu Microelectronics
7.20.1 TongFu Microelectronics IC Chip Packaging and Testing Company Information
7.20.2 TongFu Microelectronics IC Chip Packaging and Testing Product Portfolio
7.20.3 TongFu Microelectronics IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.20.4 TongFu Microelectronics Main Business and Markets Served
7.20.5 TongFu Microelectronics Recent Developments/Updates
7.21 Chipmore Technology
7.21.1 Chipmore Technology IC Chip Packaging and Testing Company Information
7.21.2 Chipmore Technology IC Chip Packaging and Testing Product Portfolio
7.21.3 Chipmore Technology IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.21.4 Chipmore Technology Main Business and Markets Served
7.21.5 Chipmore Technology Recent Developments/Updates
7.22 China Resources Microelectronics
7.22.1 China Resources Microelectronics IC Chip Packaging and Testing Company Information
7.22.2 China Resources Microelectronics IC Chip Packaging and Testing Product Portfolio
7.22.3 China Resources Microelectronics IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.22.4 China Resources Microelectronics Main Business and Markets Served
7.22.5 China Resources Microelectronics Recent Developments/Updates
7.23 Forehope Electronic
7.23.1 Forehope Electronic IC Chip Packaging and Testing Company Information
7.23.2 Forehope Electronic IC Chip Packaging and Testing Product Portfolio
7.23.3 Forehope Electronic IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.23.4 Forehope Electronic Main Business and Markets Served
7.23.5 Forehope Electronic Recent Developments/Updates
7.24 Wafer Level CSP
7.24.1 Wafer Level CSP IC Chip Packaging and Testing Company Information
7.24.2 Wafer Level CSP IC Chip Packaging and Testing Product Portfolio
7.24.3 Wafer Level CSP IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.24.4 Wafer Level CSP Main Business and Markets Served
7.24.5 Wafer Level CSP Recent Developments/Updates
7.25 Chizhou HISEMI Electronic Technology
7.25.1 Chizhou HISEMI Electronic Technology IC Chip Packaging and Testing Company Information
7.25.2 Chizhou HISEMI Electronic Technology IC Chip Packaging and Testing Product Portfolio
7.25.3 Chizhou HISEMI Electronic Technology IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.25.4 Chizhou HISEMI Electronic Technology Main Business and Markets Served
7.25.5 Chizhou HISEMI Electronic Technology Recent Developments/Updates
7.26 Keyang
7.26.1 Keyang IC Chip Packaging and Testing Company Information
7.26.2 Keyang IC Chip Packaging and Testing Product Portfolio
7.26.3 Keyang IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.26.4 Keyang Main Business and Markets Served
7.26.5 Keyang Recent Developments/Updates
7.27 Leadyo IC Testing
7.27.1 Leadyo IC Testing IC Chip Packaging and Testing Company Information
7.27.2 Leadyo IC Testing IC Chip Packaging and Testing Product Portfolio
7.27.3 Leadyo IC Testing IC Chip Packaging and Testing Production, Value, Price and Gross Margin (2020-2025)
7.27.4 Leadyo IC Testing Main Business and Markets Served
7.27.5 Leadyo IC Testing Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Chip Packaging and Testing Industry Chain Analysis
8.2 IC Chip Packaging and Testing Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Chip Packaging and Testing Production Mode & Process Analysis
8.4 IC Chip Packaging and Testing Sales and Marketing
8.4.1 IC Chip Packaging and Testing Sales Channels
8.4.2 IC Chip Packaging and Testing Distributors
8.5 IC Chip Packaging and Testing Customer Analysis
9 IC Chip Packaging and Testing Market Dynamics
9.1 IC Chip Packaging and Testing Industry Trends
9.2 IC Chip Packaging and Testing Market Drivers
9.3 IC Chip Packaging and Testing Market Challenges
9.4 IC Chip Packaging and Testing Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
ASE
Amkor Technology
SPIL
Powertech Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
J-Devices
ITEQ
HT-Tech
JCET
TongFu Microelectronics
Chipmore Technology
China Resources Microelectronics
Forehope Electronic
Wafer Level CSP
Chizhou HISEMI Electronic Technology
Keyang
Leadyo IC Testing
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*If Applicable.
