The global market for IC Organic Package Substrate was valued at US$ 2739 million in the year 2024 and is projected to reach a revised size of US$ 3786 million by 2031, growing at a CAGR of 4.8% during the forecast period.
North American market for IC Organic Package Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for IC Organic Package Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of IC Organic Package Substrate include Unimicron, Ibiden, Semco, Nan Ya PCB Corporation, Shinko, Simmtech, Kinsus, Daeduck, LG Innotek, Kyocera, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Organic Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Organic Package Substrate.
The IC Organic Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global IC Organic Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Organic Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron
Ibiden
Semco
Nan Ya PCB Corporation
Shinko
Simmtech
Kinsus
Daeduck
LG Innotek
Kyocera
ASE Material
Shennan Circuit
AT&S
Korea Circuit
Toppan Circuit
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
by Type
Rigid
Flexible
by Application
Smart Phone
PC(Tablet and Laptop)
Wearable Device
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Organic Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Organic Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Organic Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 IC Organic Package Substrate Market Overview
1.1 Product Definition
1.2 IC Organic Package Substrate by Type
1.2.1 Global IC Organic Package Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Rigid
1.2.3 Flexible
1.3 IC Organic Package Substrate by Application
1.3.1 Global IC Organic Package Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phone
1.3.3 PC(Tablet and Laptop)
1.3.4 Wearable Device
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Organic Package Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global IC Organic Package Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global IC Organic Package Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global IC Organic Package Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Organic Package Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global IC Organic Package Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of IC Organic Package Substrate, Industry Ranking, 2023 VS 2024
2.4 Global IC Organic Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global IC Organic Package Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of IC Organic Package Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Organic Package Substrate, Product Offered and Application
2.8 Global Key Manufacturers of IC Organic Package Substrate, Date of Enter into This Industry
2.9 IC Organic Package Substrate Market Competitive Situation and Trends
2.9.1 IC Organic Package Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Organic Package Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Organic Package Substrate Production by Region
3.1 Global IC Organic Package Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global IC Organic Package Substrate Production Value by Region (2020-2031)
3.2.1 Global IC Organic Package Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of IC Organic Package Substrate by Region (2026-2031)
3.3 Global IC Organic Package Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global IC Organic Package Substrate Production Volume by Region (2020-2031)
3.4.1 Global IC Organic Package Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of IC Organic Package Substrate by Region (2026-2031)
3.5 Global IC Organic Package Substrate Market Price Analysis by Region (2020-2025)
3.6 Global IC Organic Package Substrate Production and Value, Year-over-Year Growth
3.6.1 North America IC Organic Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe IC Organic Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China IC Organic Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan IC Organic Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea IC Organic Package Substrate Production Value Estimates and Forecasts (2020-2031)
4 IC Organic Package Substrate Consumption by Region
4.1 Global IC Organic Package Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global IC Organic Package Substrate Consumption by Region (2020-2031)
4.2.1 Global IC Organic Package Substrate Consumption by Region (2020-2025)
4.2.2 Global IC Organic Package Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America IC Organic Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America IC Organic Package Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Organic Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe IC Organic Package Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific IC Organic Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific IC Organic Package Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Organic Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa IC Organic Package Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global IC Organic Package Substrate Production by Type (2020-2031)
5.1.1 Global IC Organic Package Substrate Production by Type (2020-2025)
5.1.2 Global IC Organic Package Substrate Production by Type (2026-2031)
5.1.3 Global IC Organic Package Substrate Production Market Share by Type (2020-2031)
5.2 Global IC Organic Package Substrate Production Value by Type (2020-2031)
5.2.1 Global IC Organic Package Substrate Production Value by Type (2020-2025)
5.2.2 Global IC Organic Package Substrate Production Value by Type (2026-2031)
5.2.3 Global IC Organic Package Substrate Production Value Market Share by Type (2020-2031)
5.3 Global IC Organic Package Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global IC Organic Package Substrate Production by Application (2020-2031)
6.1.1 Global IC Organic Package Substrate Production by Application (2020-2025)
6.1.2 Global IC Organic Package Substrate Production by Application (2026-2031)
6.1.3 Global IC Organic Package Substrate Production Market Share by Application (2020-2031)
6.2 Global IC Organic Package Substrate Production Value by Application (2020-2031)
6.2.1 Global IC Organic Package Substrate Production Value by Application (2020-2025)
6.2.2 Global IC Organic Package Substrate Production Value by Application (2026-2031)
6.2.3 Global IC Organic Package Substrate Production Value Market Share by Application (2020-2031)
6.3 Global IC Organic Package Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron IC Organic Package Substrate Company Information
7.1.2 Unimicron IC Organic Package Substrate Product Portfolio
7.1.3 Unimicron IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 Ibiden
7.2.1 Ibiden IC Organic Package Substrate Company Information
7.2.2 Ibiden IC Organic Package Substrate Product Portfolio
7.2.3 Ibiden IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Ibiden Main Business and Markets Served
7.2.5 Ibiden Recent Developments/Updates
7.3 Semco
7.3.1 Semco IC Organic Package Substrate Company Information
7.3.2 Semco IC Organic Package Substrate Product Portfolio
7.3.3 Semco IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Semco Main Business and Markets Served
7.3.5 Semco Recent Developments/Updates
7.4 Nan Ya PCB Corporation
7.4.1 Nan Ya PCB Corporation IC Organic Package Substrate Company Information
7.4.2 Nan Ya PCB Corporation IC Organic Package Substrate Product Portfolio
7.4.3 Nan Ya PCB Corporation IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Nan Ya PCB Corporation Main Business and Markets Served
7.4.5 Nan Ya PCB Corporation Recent Developments/Updates
7.5 Shinko
7.5.1 Shinko IC Organic Package Substrate Company Information
7.5.2 Shinko IC Organic Package Substrate Product Portfolio
7.5.3 Shinko IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Shinko Main Business and Markets Served
7.5.5 Shinko Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech IC Organic Package Substrate Company Information
7.6.2 Simmtech IC Organic Package Substrate Product Portfolio
7.6.3 Simmtech IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Kinsus
7.7.1 Kinsus IC Organic Package Substrate Company Information
7.7.2 Kinsus IC Organic Package Substrate Product Portfolio
7.7.3 Kinsus IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Kinsus Main Business and Markets Served
7.7.5 Kinsus Recent Developments/Updates
7.8 Daeduck
7.8.1 Daeduck IC Organic Package Substrate Company Information
7.8.2 Daeduck IC Organic Package Substrate Product Portfolio
7.8.3 Daeduck IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Daeduck Main Business and Markets Served
7.8.5 Daeduck Recent Developments/Updates
7.9 LG Innotek
7.9.1 LG Innotek IC Organic Package Substrate Company Information
7.9.2 LG Innotek IC Organic Package Substrate Product Portfolio
7.9.3 LG Innotek IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 LG Innotek Main Business and Markets Served
7.9.5 LG Innotek Recent Developments/Updates
7.10 Kyocera
7.10.1 Kyocera IC Organic Package Substrate Company Information
7.10.2 Kyocera IC Organic Package Substrate Product Portfolio
7.10.3 Kyocera IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Kyocera Main Business and Markets Served
7.10.5 Kyocera Recent Developments/Updates
7.11 ASE Material
7.11.1 ASE Material IC Organic Package Substrate Company Information
7.11.2 ASE Material IC Organic Package Substrate Product Portfolio
7.11.3 ASE Material IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 ASE Material Main Business and Markets Served
7.11.5 ASE Material Recent Developments/Updates
7.12 Shennan Circuit
7.12.1 Shennan Circuit IC Organic Package Substrate Company Information
7.12.2 Shennan Circuit IC Organic Package Substrate Product Portfolio
7.12.3 Shennan Circuit IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Shennan Circuit Main Business and Markets Served
7.12.5 Shennan Circuit Recent Developments/Updates
7.13 AT&S
7.13.1 AT&S IC Organic Package Substrate Company Information
7.13.2 AT&S IC Organic Package Substrate Product Portfolio
7.13.3 AT&S IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.13.4 AT&S Main Business and Markets Served
7.13.5 AT&S Recent Developments/Updates
7.14 Korea Circuit
7.14.1 Korea Circuit IC Organic Package Substrate Company Information
7.14.2 Korea Circuit IC Organic Package Substrate Product Portfolio
7.14.3 Korea Circuit IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Korea Circuit Main Business and Markets Served
7.14.5 Korea Circuit Recent Developments/Updates
7.15 Toppan Circuit
7.15.1 Toppan Circuit IC Organic Package Substrate Company Information
7.15.2 Toppan Circuit IC Organic Package Substrate Product Portfolio
7.15.3 Toppan Circuit IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Toppan Circuit Main Business and Markets Served
7.15.5 Toppan Circuit Recent Developments/Updates
7.16 Zhen Ding Technology
7.16.1 Zhen Ding Technology IC Organic Package Substrate Company Information
7.16.2 Zhen Ding Technology IC Organic Package Substrate Product Portfolio
7.16.3 Zhen Ding Technology IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Zhen Ding Technology Main Business and Markets Served
7.16.5 Zhen Ding Technology Recent Developments/Updates
7.17 Shenzhen Fastprint Circuit Tech
7.17.1 Shenzhen Fastprint Circuit Tech IC Organic Package Substrate Company Information
7.17.2 Shenzhen Fastprint Circuit Tech IC Organic Package Substrate Product Portfolio
7.17.3 Shenzhen Fastprint Circuit Tech IC Organic Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
7.17.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Organic Package Substrate Industry Chain Analysis
8.2 IC Organic Package Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Organic Package Substrate Production Mode & Process Analysis
8.4 IC Organic Package Substrate Sales and Marketing
8.4.1 IC Organic Package Substrate Sales Channels
8.4.2 IC Organic Package Substrate Distributors
8.5 IC Organic Package Substrate Customer Analysis
9 IC Organic Package Substrate Market Dynamics
9.1 IC Organic Package Substrate Industry Trends
9.2 IC Organic Package Substrate Market Drivers
9.3 IC Organic Package Substrate Market Challenges
9.4 IC Organic Package Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Unimicron
Ibiden
Semco
Nan Ya PCB Corporation
Shinko
Simmtech
Kinsus
Daeduck
LG Innotek
Kyocera
ASE Material
Shennan Circuit
AT&S
Korea Circuit
Toppan Circuit
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
听
听
*If Applicable.
