IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC) chip and the rest of the electronic system. The choice of substrate material depends on various factors such as the application, performance requirements, and thermal considerations.
The global IC Package Substrate Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for IC Package Substrate Material is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for IC Package Substrate Material is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of IC Package Substrate Material include Ajinomoto, Mitsubishi Gas Chemical, Mitsui Mining & Smelting, Panasonic, TTM Technologies, ASE Metarial, Ibiden, Unimicron and Kinsus, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for IC Package Substrate Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrate Material.
Report Scope
The IC Package Substrate Material market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Package Substrate Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Package Substrate Material manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Ajinomoto
Mitsubishi Gas Chemical
Mitsui Mining & Smelting
Panasonic
TTM Technologies
ASE Metarial
Ibiden
Unimicron
Kinsus
Shennan Circuit
Nanya
Showa Denko
Segment by Type
Copper Foil
Resin Substrate
Dry Film (Solid Photoresist)
Wet Film (Liquid Photoresist)
Metal (Copper, Nickel, Gold Salt)
Others
Segment by Application
Memory Chip Packaging Substrate
Mems Packaging System
Rf Module Packaging Substrate
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Package Substrate Material manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Package Substrate Material by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Package Substrate Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 IC Package Substrate Material Market Overview
1.1 Product Definition
1.2 IC Package Substrate Material Segment by Type
1.2.1 Global IC Package Substrate Material Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Copper Foil
1.2.3 Resin Substrate
1.2.4 Dry Film (Solid Photoresist)
1.2.5 Wet Film (Liquid Photoresist)
1.2.6 Metal (Copper, Nickel, Gold Salt)
1.2.7 Others
1.3 IC Package Substrate Material Segment by Application
1.3.1 Global IC Package Substrate Material Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Memory Chip Packaging Substrate
1.3.3 Mems Packaging System
1.3.4 Rf Module Packaging Substrate
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Package Substrate Material Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global IC Package Substrate Material Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global IC Package Substrate Material Production Estimates and Forecasts (2019-2030)
1.4.4 Global IC Package Substrate Material Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Package Substrate Material Production Market Share by Manufacturers (2019-2024)
2.2 Global IC Package Substrate Material Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of IC Package Substrate Material, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global IC Package Substrate Material Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global IC Package Substrate Material Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of IC Package Substrate Material, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Package Substrate Material, Product Offered and Application
2.8 Global Key Manufacturers of IC Package Substrate Material, Date of Enter into This Industry
2.9 IC Package Substrate Material Market Competitive Situation and Trends
2.9.1 IC Package Substrate Material Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Package Substrate Material Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Package Substrate Material Production by Region
3.1 Global IC Package Substrate Material Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global IC Package Substrate Material Production Value by Region (2019-2030)
3.2.1 Global IC Package Substrate Material Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of IC Package Substrate Material by Region (2025-2030)
3.3 Global IC Package Substrate Material Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global IC Package Substrate Material Production by Region (2019-2030)
3.4.1 Global IC Package Substrate Material Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of IC Package Substrate Material by Region (2025-2030)
3.5 Global IC Package Substrate Material Market Price Analysis by Region (2019-2024)
3.6 Global IC Package Substrate Material Production and Value, Year-over-Year Growth
3.6.1 North America IC Package Substrate Material Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe IC Package Substrate Material Production Value Estimates and Forecasts (2019-2030)
3.6.3 China IC Package Substrate Material Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan IC Package Substrate Material Production Value Estimates and Forecasts (2019-2030)
4 IC Package Substrate Material Consumption by Region
4.1 Global IC Package Substrate Material Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global IC Package Substrate Material Consumption by Region (2019-2030)
4.2.1 Global IC Package Substrate Material Consumption by Region (2019-2024)
4.2.2 Global IC Package Substrate Material Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America IC Package Substrate Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America IC Package Substrate Material Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Package Substrate Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe IC Package Substrate Material Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific IC Package Substrate Material Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific IC Package Substrate Material Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Package Substrate Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa IC Package Substrate Material Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global IC Package Substrate Material Production by Type (2019-2030)
5.1.1 Global IC Package Substrate Material Production by Type (2019-2024)
5.1.2 Global IC Package Substrate Material Production by Type (2025-2030)
5.1.3 Global IC Package Substrate Material Production Market Share by Type (2019-2030)
5.2 Global IC Package Substrate Material Production Value by Type (2019-2030)
5.2.1 Global IC Package Substrate Material Production Value by Type (2019-2024)
5.2.2 Global IC Package Substrate Material Production Value by Type (2025-2030)
5.2.3 Global IC Package Substrate Material Production Value Market Share by Type (2019-2030)
5.3 Global IC Package Substrate Material Price by Type (2019-2030)
6 Segment by Application
6.1 Global IC Package Substrate Material Production by Application (2019-2030)
6.1.1 Global IC Package Substrate Material Production by Application (2019-2024)
6.1.2 Global IC Package Substrate Material Production by Application (2025-2030)
6.1.3 Global IC Package Substrate Material Production Market Share by Application (2019-2030)
6.2 Global IC Package Substrate Material Production Value by Application (2019-2030)
6.2.1 Global IC Package Substrate Material Production Value by Application (2019-2024)
6.2.2 Global IC Package Substrate Material Production Value by Application (2025-2030)
6.2.3 Global IC Package Substrate Material Production Value Market Share by Application (2019-2030)
6.3 Global IC Package Substrate Material Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Ajinomoto
7.1.1 Ajinomoto IC Package Substrate Material Corporation Information
7.1.2 Ajinomoto IC Package Substrate Material Product Portfolio
7.1.3 Ajinomoto IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Ajinomoto Main Business and Markets Served
7.1.5 Ajinomoto Recent Developments/Updates
7.2 Mitsubishi Gas Chemical
7.2.1 Mitsubishi Gas Chemical IC Package Substrate Material Corporation Information
7.2.2 Mitsubishi Gas Chemical IC Package Substrate Material Product Portfolio
7.2.3 Mitsubishi Gas Chemical IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Mitsubishi Gas Chemical Main Business and Markets Served
7.2.5 Mitsubishi Gas Chemical Recent Developments/Updates
7.3 Mitsui Mining & Smelting
7.3.1 Mitsui Mining & Smelting IC Package Substrate Material Corporation Information
7.3.2 Mitsui Mining & Smelting IC Package Substrate Material Product Portfolio
7.3.3 Mitsui Mining & Smelting IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Mitsui Mining & Smelting Main Business and Markets Served
7.3.5 Mitsui Mining & Smelting Recent Developments/Updates
7.4 Panasonic
7.4.1 Panasonic IC Package Substrate Material Corporation Information
7.4.2 Panasonic IC Package Substrate Material Product Portfolio
7.4.3 Panasonic IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Panasonic Main Business and Markets Served
7.4.5 Panasonic Recent Developments/Updates
7.5 TTM Technologies
7.5.1 TTM Technologies IC Package Substrate Material Corporation Information
7.5.2 TTM Technologies IC Package Substrate Material Product Portfolio
7.5.3 TTM Technologies IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.5.4 TTM Technologies Main Business and Markets Served
7.5.5 TTM Technologies Recent Developments/Updates
7.6 ASE Metarial
7.6.1 ASE Metarial IC Package Substrate Material Corporation Information
7.6.2 ASE Metarial IC Package Substrate Material Product Portfolio
7.6.3 ASE Metarial IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.6.4 ASE Metarial Main Business and Markets Served
7.6.5 ASE Metarial Recent Developments/Updates
7.7 Ibiden
7.7.1 Ibiden IC Package Substrate Material Corporation Information
7.7.2 Ibiden IC Package Substrate Material Product Portfolio
7.7.3 Ibiden IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Ibiden Main Business and Markets Served
7.7.5 Ibiden Recent Developments/Updates
7.8 Unimicron
7.8.1 Unimicron IC Package Substrate Material Corporation Information
7.8.2 Unimicron IC Package Substrate Material Product Portfolio
7.8.3 Unimicron IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Unimicron Main Business and Markets Served
7.7.5 Unimicron Recent Developments/Updates
7.9 Kinsus
7.9.1 Kinsus IC Package Substrate Material Corporation Information
7.9.2 Kinsus IC Package Substrate Material Product Portfolio
7.9.3 Kinsus IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Kinsus Main Business and Markets Served
7.9.5 Kinsus Recent Developments/Updates
7.10 Shennan Circuit
7.10.1 Shennan Circuit IC Package Substrate Material Corporation Information
7.10.2 Shennan Circuit IC Package Substrate Material Product Portfolio
7.10.3 Shennan Circuit IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Shennan Circuit Main Business and Markets Served
7.10.5 Shennan Circuit Recent Developments/Updates
7.11 Nanya
7.11.1 Nanya IC Package Substrate Material Corporation Information
7.11.2 Nanya IC Package Substrate Material Product Portfolio
7.11.3 Nanya IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Nanya Main Business and Markets Served
7.11.5 Nanya Recent Developments/Updates
7.12 Showa Denko
7.12.1 Showa Denko IC Package Substrate Material Corporation Information
7.12.2 Showa Denko IC Package Substrate Material Product Portfolio
7.12.3 Showa Denko IC Package Substrate Material Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Showa Denko Main Business and Markets Served
7.12.5 Showa Denko Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Package Substrate Material Industry Chain Analysis
8.2 IC Package Substrate Material Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Package Substrate Material Production Mode & Process
8.4 IC Package Substrate Material Sales and Marketing
8.4.1 IC Package Substrate Material Sales Channels
8.4.2 IC Package Substrate Material Distributors
8.5 IC Package Substrate Material Customers
9 IC Package Substrate Material Market Dynamics
9.1 IC Package Substrate Material Industry Trends
9.2 IC Package Substrate Material Market Drivers
9.3 IC Package Substrate Material Market Challenges
9.4 IC Package Substrate Material Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Ajinomoto
Mitsubishi Gas Chemical
Mitsui Mining & Smelting
Panasonic
TTM Technologies
ASE Metarial
Ibiden
Unimicron
Kinsus
Shennan Circuit
Nanya
Showa Denko
听
听
*If Applicable.
