Global IC Packaging and Packaging Testing Market Research Report 2024

Publication ID:

PB506249520

Publication Date:

June 13, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Packaging and testing belong to the back-end process, its purpose is to complete the semiconductor
The chip is packaged and protected, and the pins are led out. At the same time, the reliability,
Stability is tested, and finally commercialized semiconductor products are formed.
The global IC Packaging and Packaging Testing market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for IC Packaging and Packaging Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging and Packaging Testing.
Report Scope
The IC Packaging and Packaging Testing market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Packaging and Packaging Testing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging and Packaging Testing companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor Technology
UTAC Holdings
Nepes
Unisem
JCET Group
Siliconware Precision Industries
KYEC
TongFu Microelectronics
ITEQ Corporation
Powertech Technology Inc. (PTI)
TSHT
Chipbond Technology
LCSP
Segment by Type
IC Packaging
IC Packaging Testing
Segment by Application
IC
Advanced Packaging
MEMS
LED
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of IC Packaging and Packaging Testing companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global IC Packaging and Packaging Testing Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 IC Packaging
1.2.3 IC Packaging Testing
1.3 Market by Application
1.3.1 Global IC Packaging and Packaging Testing Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 IC
1.3.3 Advanced Packaging
1.3.4 MEMS
1.3.5 LED
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global IC Packaging and Packaging Testing Market Perspective (2019-2030)
2.2 IC Packaging and Packaging Testing Growth Trends by Region
2.2.1 Global IC Packaging and Packaging Testing Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 IC Packaging and Packaging Testing Historic Market Size by Region (2019-2024)
2.2.3 IC Packaging and Packaging Testing Forecasted Market Size by Region (2025-2030)
2.3 IC Packaging and Packaging Testing Market Dynamics
2.3.1 IC Packaging and Packaging Testing Industry Trends
2.3.2 IC Packaging and Packaging Testing Market Drivers
2.3.3 IC Packaging and Packaging Testing Market Challenges
2.3.4 IC Packaging and Packaging Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top IC Packaging and Packaging Testing Players by Revenue
3.1.1 Global Top IC Packaging and Packaging Testing Players by Revenue (2019-2024)
3.1.2 Global IC Packaging and Packaging Testing Revenue Market Share by Players (2019-2024)
3.2 Global IC Packaging and Packaging Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by IC Packaging and Packaging Testing Revenue
3.4 Global IC Packaging and Packaging Testing Market Concentration Ratio
3.4.1 Global IC Packaging and Packaging Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by IC Packaging and Packaging Testing Revenue in 2023
3.5 IC Packaging and Packaging Testing Key Players Head office and Area Served
3.6 Key Players IC Packaging and Packaging Testing Product Solution and Service
3.7 Date of Enter into IC Packaging and Packaging Testing Market
3.8 Mergers & Acquisitions, Expansion Plans
4 IC Packaging and Packaging Testing Breakdown Data by Type
4.1 Global IC Packaging and Packaging Testing Historic Market Size by Type (2019-2024)
4.2 Global IC Packaging and Packaging Testing Forecasted Market Size by Type (2025-2030)
5 IC Packaging and Packaging Testing Breakdown Data by Application
5.1 Global IC Packaging and Packaging Testing Historic Market Size by Application (2019-2024)
5.2 Global IC Packaging and Packaging Testing Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America IC Packaging and Packaging Testing Market Size (2019-2030)
6.2 North America IC Packaging and Packaging Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America IC Packaging and Packaging Testing Market Size by Country (2019-2024)
6.4 North America IC Packaging and Packaging Testing Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe IC Packaging and Packaging Testing Market Size (2019-2030)
7.2 Europe IC Packaging and Packaging Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe IC Packaging and Packaging Testing Market Size by Country (2019-2024)
7.4 Europe IC Packaging and Packaging Testing Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific IC Packaging and Packaging Testing Market Size (2019-2030)
8.2 Asia-Pacific IC Packaging and Packaging Testing Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific IC Packaging and Packaging Testing Market Size by Region (2019-2024)
8.4 Asia-Pacific IC Packaging and Packaging Testing Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America IC Packaging and Packaging Testing Market Size (2019-2030)
9.2 Latin America IC Packaging and Packaging Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America IC Packaging and Packaging Testing Market Size by Country (2019-2024)
9.4 Latin America IC Packaging and Packaging Testing Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa IC Packaging and Packaging Testing Market Size (2019-2030)
10.2 Middle East & Africa IC Packaging and Packaging Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa IC Packaging and Packaging Testing Market Size by Country (2019-2024)
10.4 Middle East & Africa IC Packaging and Packaging Testing Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor Technology
11.1.1 Amkor Technology Company Detail
11.1.2 Amkor Technology Business Overview
11.1.3 Amkor Technology IC Packaging and Packaging Testing Introduction
11.1.4 Amkor Technology Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.1.5 Amkor Technology Recent Development
11.2 UTAC Holdings
11.2.1 UTAC Holdings Company Detail
11.2.2 UTAC Holdings Business Overview
11.2.3 UTAC Holdings IC Packaging and Packaging Testing Introduction
11.2.4 UTAC Holdings Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.2.5 UTAC Holdings Recent Development
11.3 Nepes
11.3.1 Nepes Company Detail
11.3.2 Nepes Business Overview
11.3.3 Nepes IC Packaging and Packaging Testing Introduction
11.3.4 Nepes Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.3.5 Nepes Recent Development
11.4 Unisem
11.4.1 Unisem Company Detail
11.4.2 Unisem Business Overview
11.4.3 Unisem IC Packaging and Packaging Testing Introduction
11.4.4 Unisem Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.4.5 Unisem Recent Development
11.5 JCET Group
11.5.1 JCET Group Company Detail
11.5.2 JCET Group Business Overview
11.5.3 JCET Group IC Packaging and Packaging Testing Introduction
11.5.4 JCET Group Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.5.5 JCET Group Recent Development
11.6 Siliconware Precision Industries
11.6.1 Siliconware Precision Industries Company Detail
11.6.2 Siliconware Precision Industries Business Overview
11.6.3 Siliconware Precision Industries IC Packaging and Packaging Testing Introduction
11.6.4 Siliconware Precision Industries Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.6.5 Siliconware Precision Industries Recent Development
11.7 KYEC
11.7.1 KYEC Company Detail
11.7.2 KYEC Business Overview
11.7.3 KYEC IC Packaging and Packaging Testing Introduction
11.7.4 KYEC Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.7.5 KYEC Recent Development
11.8 TongFu Microelectronics
11.8.1 TongFu Microelectronics Company Detail
11.8.2 TongFu Microelectronics Business Overview
11.8.3 TongFu Microelectronics IC Packaging and Packaging Testing Introduction
11.8.4 TongFu Microelectronics Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.8.5 TongFu Microelectronics Recent Development
11.9 ITEQ Corporation
11.9.1 ITEQ Corporation Company Detail
11.9.2 ITEQ Corporation Business Overview
11.9.3 ITEQ Corporation IC Packaging and Packaging Testing Introduction
11.9.4 ITEQ Corporation Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.9.5 ITEQ Corporation Recent Development
11.10 Powertech Technology Inc. (PTI)
11.10.1 Powertech Technology Inc. (PTI) Company Detail
11.10.2 Powertech Technology Inc. (PTI) Business Overview
11.10.3 Powertech Technology Inc. (PTI) IC Packaging and Packaging Testing Introduction
11.10.4 Powertech Technology Inc. (PTI) Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.10.5 Powertech Technology Inc. (PTI) Recent Development
11.11 TSHT
11.11.1 TSHT Company Detail
11.11.2 TSHT Business Overview
11.11.3 TSHT IC Packaging and Packaging Testing Introduction
11.11.4 TSHT Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.11.5 TSHT Recent Development
11.12 Chipbond Technology
11.12.1 Chipbond Technology Company Detail
11.12.2 Chipbond Technology Business Overview
11.12.3 Chipbond Technology IC Packaging and Packaging Testing Introduction
11.12.4 Chipbond Technology Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.12.5 Chipbond Technology Recent Development
11.13 LCSP
11.13.1 LCSP Company Detail
11.13.2 LCSP Business Overview
11.13.3 LCSP IC Packaging and Packaging Testing Introduction
11.13.4 LCSP Revenue in IC Packaging and Packaging Testing Business (2019-2024)
11.13.5 LCSP Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Amkor Technology
UTAC Holdings
Nepes
Unisem
JCET Group
Siliconware Precision Industries
KYEC
TongFu Microelectronics
ITEQ Corporation
Powertech Technology Inc. (PTI)
TSHT
Chipbond Technology
LCSP

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