Packaging and testing belong to the back-end process, its purpose is to complete the semiconductor the chip is packaged and protected, and the pins are led out. At the same time, the reliability, stability is tested, and finally commercialized semiconductor products are formed.
The global IC Packaging and Testing Equipment market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for IC Packaging and Testing Equipment is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for IC Packaging and Testing Equipment is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of IC Packaging and Testing Equipment include Amkor Technology, UTAC Holdings, Nepes, Unisem, JCET Group, Siliconware Precision Industries, KYEC, TongFu Microelectronics and ITEQ Corporation, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Packaging and Testing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging and Testing Equipment.
The IC Packaging and Testing Equipment market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global IC Packaging and Testing Equipment market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging and Testing Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Amkor Technology
UTAC Holdings
Nepes
Unisem
JCET Group
Siliconware Precision Industries
KYEC
TongFu Microelectronics
ITEQ Corporation
Powertech Technology Inc. (PTI)
TSHT
Chipbond Technology
LCSP
Segment by Type
IC Packaging Equipment
IC Packaging Testing Equipment
Segment by Application
IC
Advanced Packaging
MEMS
LED
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Packaging and Testing Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Packaging and Testing Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Packaging and Testing Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 IC Packaging and Testing Equipment Market Overview
1.1 Product Definition
1.2 IC Packaging and Testing Equipment Segment by Type
1.2.1 Global IC Packaging and Testing Equipment Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 IC Packaging Equipment
1.2.3 IC Packaging Testing Equipment
1.3 IC Packaging and Testing Equipment Segment by Application
1.3.1 Global IC Packaging and Testing Equipment Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 IC
1.3.3 Advanced Packaging
1.3.4 MEMS
1.3.5 LED
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global IC Packaging and Testing Equipment Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global IC Packaging and Testing Equipment Production Estimates and Forecasts (2018-2029)
1.4.4 Global IC Packaging and Testing Equipment Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging and Testing Equipment Production Market Share by Manufacturers (2018-2023)
2.2 Global IC Packaging and Testing Equipment Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of IC Packaging and Testing Equipment, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global IC Packaging and Testing Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global IC Packaging and Testing Equipment Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of IC Packaging and Testing Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging and Testing Equipment, Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging and Testing Equipment, Date of Enter into This Industry
2.9 IC Packaging and Testing Equipment Market Competitive Situation and Trends
2.9.1 IC Packaging and Testing Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging and Testing Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging and Testing Equipment Production by Region
3.1 Global IC Packaging and Testing Equipment Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global IC Packaging and Testing Equipment Production Value by Region (2018-2029)
3.2.1 Global IC Packaging and Testing Equipment Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of IC Packaging and Testing Equipment by Region (2024-2029)
3.3 Global IC Packaging and Testing Equipment Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global IC Packaging and Testing Equipment Production by Region (2018-2029)
3.4.1 Global IC Packaging and Testing Equipment Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of IC Packaging and Testing Equipment by Region (2024-2029)
3.5 Global IC Packaging and Testing Equipment Market Price Analysis by Region (2018-2023)
3.6 Global IC Packaging and Testing Equipment Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe IC Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.3 China IC Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan IC Packaging and Testing Equipment Production Value Estimates and Forecasts (2018-2029)
4 IC Packaging and Testing Equipment Consumption by Region
4.1 Global IC Packaging and Testing Equipment Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global IC Packaging and Testing Equipment Consumption by Region (2018-2029)
4.2.1 Global IC Packaging and Testing Equipment Consumption by Region (2018-2023)
4.2.2 Global IC Packaging and Testing Equipment Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America IC Packaging and Testing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America IC Packaging and Testing Equipment Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging and Testing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe IC Packaging and Testing Equipment Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging and Testing Equipment Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific IC Packaging and Testing Equipment Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging and Testing Equipment Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa IC Packaging and Testing Equipment Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global IC Packaging and Testing Equipment Production by Type (2018-2029)
5.1.1 Global IC Packaging and Testing Equipment Production by Type (2018-2023)
5.1.2 Global IC Packaging and Testing Equipment Production by Type (2024-2029)
5.1.3 Global IC Packaging and Testing Equipment Production Market Share by Type (2018-2029)
5.2 Global IC Packaging and Testing Equipment Production Value by Type (2018-2029)
5.2.1 Global IC Packaging and Testing Equipment Production Value by Type (2018-2023)
5.2.2 Global IC Packaging and Testing Equipment Production Value by Type (2024-2029)
5.2.3 Global IC Packaging and Testing Equipment Production Value Market Share by Type (2018-2029)
5.3 Global IC Packaging and Testing Equipment Price by Type (2018-2029)
6 Segment by Application
6.1 Global IC Packaging and Testing Equipment Production by Application (2018-2029)
6.1.1 Global IC Packaging and Testing Equipment Production by Application (2018-2023)
6.1.2 Global IC Packaging and Testing Equipment Production by Application (2024-2029)
6.1.3 Global IC Packaging and Testing Equipment Production Market Share by Application (2018-2029)
6.2 Global IC Packaging and Testing Equipment Production Value by Application (2018-2029)
6.2.1 Global IC Packaging and Testing Equipment Production Value by Application (2018-2023)
6.2.2 Global IC Packaging and Testing Equipment Production Value by Application (2024-2029)
6.2.3 Global IC Packaging and Testing Equipment Production Value Market Share by Application (2018-2029)
6.3 Global IC Packaging and Testing Equipment Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Amkor Technology
7.1.1 Amkor Technology IC Packaging and Testing Equipment Corporation Information
7.1.2 Amkor Technology IC Packaging and Testing Equipment Product Portfolio
7.1.3 Amkor Technology IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Amkor Technology Main Business and Markets Served
7.1.5 Amkor Technology Recent Developments/Updates
7.2 UTAC Holdings
7.2.1 UTAC Holdings IC Packaging and Testing Equipment Corporation Information
7.2.2 UTAC Holdings IC Packaging and Testing Equipment Product Portfolio
7.2.3 UTAC Holdings IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.2.4 UTAC Holdings Main Business and Markets Served
7.2.5 UTAC Holdings Recent Developments/Updates
7.3 Nepes
7.3.1 Nepes IC Packaging and Testing Equipment Corporation Information
7.3.2 Nepes IC Packaging and Testing Equipment Product Portfolio
7.3.3 Nepes IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Nepes Main Business and Markets Served
7.3.5 Nepes Recent Developments/Updates
7.4 Unisem
7.4.1 Unisem IC Packaging and Testing Equipment Corporation Information
7.4.2 Unisem IC Packaging and Testing Equipment Product Portfolio
7.4.3 Unisem IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Unisem Main Business and Markets Served
7.4.5 Unisem Recent Developments/Updates
7.5 JCET Group
7.5.1 JCET Group IC Packaging and Testing Equipment Corporation Information
7.5.2 JCET Group IC Packaging and Testing Equipment Product Portfolio
7.5.3 JCET Group IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.5.4 JCET Group Main Business and Markets Served
7.5.5 JCET Group Recent Developments/Updates
7.6 Siliconware Precision Industries
7.6.1 Siliconware Precision Industries IC Packaging and Testing Equipment Corporation Information
7.6.2 Siliconware Precision Industries IC Packaging and Testing Equipment Product Portfolio
7.6.3 Siliconware Precision Industries IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Siliconware Precision Industries Main Business and Markets Served
7.6.5 Siliconware Precision Industries Recent Developments/Updates
7.7 KYEC
7.7.1 KYEC IC Packaging and Testing Equipment Corporation Information
7.7.2 KYEC IC Packaging and Testing Equipment Product Portfolio
7.7.3 KYEC IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.7.4 KYEC Main Business and Markets Served
7.7.5 KYEC Recent Developments/Updates
7.8 TongFu Microelectronics
7.8.1 TongFu Microelectronics IC Packaging and Testing Equipment Corporation Information
7.8.2 TongFu Microelectronics IC Packaging and Testing Equipment Product Portfolio
7.8.3 TongFu Microelectronics IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.8.4 TongFu Microelectronics Main Business and Markets Served
7.7.5 TongFu Microelectronics Recent Developments/Updates
7.9 ITEQ Corporation
7.9.1 ITEQ Corporation IC Packaging and Testing Equipment Corporation Information
7.9.2 ITEQ Corporation IC Packaging and Testing Equipment Product Portfolio
7.9.3 ITEQ Corporation IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.9.4 ITEQ Corporation Main Business and Markets Served
7.9.5 ITEQ Corporation Recent Developments/Updates
7.10 Powertech Technology Inc. (PTI)
7.10.1 Powertech Technology Inc. (PTI) IC Packaging and Testing Equipment Corporation Information
7.10.2 Powertech Technology Inc. (PTI) IC Packaging and Testing Equipment Product Portfolio
7.10.3 Powertech Technology Inc. (PTI) IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Powertech Technology Inc. (PTI) Main Business and Markets Served
7.10.5 Powertech Technology Inc. (PTI) Recent Developments/Updates
7.11 TSHT
7.11.1 TSHT IC Packaging and Testing Equipment Corporation Information
7.11.2 TSHT IC Packaging and Testing Equipment Product Portfolio
7.11.3 TSHT IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.11.4 TSHT Main Business and Markets Served
7.11.5 TSHT Recent Developments/Updates
7.12 Chipbond Technology
7.12.1 Chipbond Technology IC Packaging and Testing Equipment Corporation Information
7.12.2 Chipbond Technology IC Packaging and Testing Equipment Product Portfolio
7.12.3 Chipbond Technology IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Chipbond Technology Main Business and Markets Served
7.12.5 Chipbond Technology Recent Developments/Updates
7.13 LCSP
7.13.1 LCSP IC Packaging and Testing Equipment Corporation Information
7.13.2 LCSP IC Packaging and Testing Equipment Product Portfolio
7.13.3 LCSP IC Packaging and Testing Equipment Production, Value, Price and Gross Margin (2018-2023)
7.13.4 LCSP Main Business and Markets Served
7.13.5 LCSP Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging and Testing Equipment Industry Chain Analysis
8.2 IC Packaging and Testing Equipment Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging and Testing Equipment Production Mode & Process
8.4 IC Packaging and Testing Equipment Sales and Marketing
8.4.1 IC Packaging and Testing Equipment Sales Channels
8.4.2 IC Packaging and Testing Equipment Distributors
8.5 IC Packaging and Testing Equipment Customers
9 IC Packaging and Testing Equipment Market Dynamics
9.1 IC Packaging and Testing Equipment Industry Trends
9.2 IC Packaging and Testing Equipment Market Drivers
9.3 IC Packaging and Testing Equipment Market Challenges
9.4 IC Packaging and Testing Equipment Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Amkor Technology
UTAC Holdings
Nepes
Unisem
JCET Group
Siliconware Precision Industries
KYEC
TongFu Microelectronics
ITEQ Corporation
Powertech Technology Inc. (PTI)
TSHT
Chipbond Technology
LCSP
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*If Applicable.