The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing.
This report studies IC Packaging and Testing.
According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.
The key IDMs include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi; and the key OSATs include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation and ChipMOS TECHNOLOGIES, etc.
The global IC Packaging and Testing market was valued at US$ 76920 million in 2023 and is anticipated to reach US$ 108320 million by 2030, witnessing a CAGR of 5.1% during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for IC Packaging and Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging and Testing.
The IC Packaging and Testing market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Packaging and Testing market comprehensively. Regional market sizes, concerning products by Type, by Business Model, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging and Testing companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Business Model, and by regions.
Market Segmentation
By Company
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Western Digital
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas
Microchip Technology
Onsemi
Sony Semiconductor Solutions Corporation
Panasonic
Winbond
Nanya Technology
ISSI (Integrated Silicon Solution Inc.)
Macronix
Giantec Semiconductor
Sharp
Magnachip
Toshiba
JS Foundry KK.
Hitachi
Murata
Skyworks Solutions Inc
Wolfspeed
Littelfuse
Diodes Incorporated
Rohm
Fuji Electric
Vishay Intertechnology
Mitsubishi Electric
Nexperia
Ampleon
CR Micro
Hangzhou Silan Integrated Circuit
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
Carsem
King Yuan Electronics Corp. (KYEC)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor锛圚efei锛塁o., Ltd.
Hefei Chipmore Technology Co.,Ltd.
HT-tech
Chippacking
Segment by Type
IC Packaging
IC Testing
Segment by Business Model
OSAT
IDM
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Business Model, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of IC Packaging and Testing company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Business Model, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global IC Packaging and Testing Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 IC Packaging
1.2.3 IC Testing
1.3 Market by Business Model
1.3.1 Global IC Packaging and Testing Market Growth by Business Model: 2019 VS 2023 VS 2030
1.3.2 OSAT
1.3.3 IDM
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global IC Packaging and Testing Market Perspective (2019-2030)
2.2 Global IC Packaging and Testing Growth Trends by Region
2.2.1 Global IC Packaging and Testing Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 IC Packaging and Testing Historic Market Size by Region (2019-2024)
2.2.3 IC Packaging and Testing Forecasted Market Size by Region (2025-2030)
2.3 IC Packaging and Testing Market Dynamics
2.3.1 IC Packaging and Testing Industry Trends
2.3.2 IC Packaging and Testing Market Drivers
2.3.3 IC Packaging and Testing Market Challenges
2.3.4 IC Packaging and Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top IC Packaging and Testing Players by Revenue
3.1.1 Global Top IC Packaging and Testing Players by Revenue (2019-2024)
3.1.2 Global IC Packaging and Testing Revenue Market Share by Players (2019-2024)
3.2 Global IC Packaging and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by IC Packaging and Testing Revenue
3.4 Global IC Packaging and Testing Market Concentration Ratio
3.4.1 Global IC Packaging and Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by IC Packaging and Testing Revenue in 2023
3.5 Global Key Players of IC Packaging and Testing Head office and Area Served
3.6 Global Key Players of IC Packaging and Testing, Product and Application
3.7 Global Key Players of IC Packaging and Testing, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 IC Packaging and Testing Breakdown Data by Type
4.1 Global IC Packaging and Testing Historic Market Size by Type (2019-2024)
4.2 Global IC Packaging and Testing Forecasted Market Size by Type (2025-2030)
5 IC Packaging and Testing Breakdown Data by Business Model
5.1 Global IC Packaging and Testing Historic Market Size by Business Model (2019-2024)
5.2 Global IC Packaging and Testing Forecasted Market Size by Business Model (2025-2030)
6 North America
6.1 North America IC Packaging and Testing Market Size (2019-2030)
6.2 North America IC Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America IC Packaging and Testing Market Size by Country (2019-2024)
6.4 North America IC Packaging and Testing Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe IC Packaging and Testing Market Size (2019-2030)
7.2 Europe IC Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe IC Packaging and Testing Market Size by Country (2019-2024)
7.4 Europe IC Packaging and Testing Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific IC Packaging and Testing Market Size (2019-2030)
8.2 Asia-Pacific IC Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific IC Packaging and Testing Market Size by Region (2019-2024)
8.4 Asia-Pacific IC Packaging and Testing Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America IC Packaging and Testing Market Size (2019-2030)
9.2 Latin America IC Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America IC Packaging and Testing Market Size by Country (2019-2024)
9.4 Latin America IC Packaging and Testing Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa IC Packaging and Testing Market Size (2019-2030)
10.2 Middle East & Africa IC Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa IC Packaging and Testing Market Size by Country (2019-2024)
10.4 Middle East & Africa IC Packaging and Testing Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Samsung
11.1.1 Samsung Company Details
11.1.2 Samsung Business Overview
11.1.3 Samsung IC Packaging and Testing Introduction
11.1.4 Samsung Revenue in IC Packaging and Testing Business (2019-2024)
11.1.5 Samsung Recent Development
11.2 Intel
11.2.1 Intel Company Details
11.2.2 Intel Business Overview
11.2.3 Intel IC Packaging and Testing Introduction
11.2.4 Intel Revenue in IC Packaging and Testing Business (2019-2024)
11.2.5 Intel Recent Development
11.3 SK Hynix
11.3.1 SK Hynix Company Details
11.3.2 SK Hynix Business Overview
11.3.3 SK Hynix IC Packaging and Testing Introduction
11.3.4 SK Hynix Revenue in IC Packaging and Testing Business (2019-2024)
11.3.5 SK Hynix Recent Development
11.4 Micron Technology
11.4.1 Micron Technology Company Details
11.4.2 Micron Technology Business Overview
11.4.3 Micron Technology IC Packaging and Testing Introduction
11.4.4 Micron Technology Revenue in IC Packaging and Testing Business (2019-2024)
11.4.5 Micron Technology Recent Development
11.5 Texas Instruments (TI)
11.5.1 Texas Instruments (TI) Company Details
11.5.2 Texas Instruments (TI) Business Overview
11.5.3 Texas Instruments (TI) IC Packaging and Testing Introduction
11.5.4 Texas Instruments (TI) Revenue in IC Packaging and Testing Business (2019-2024)
11.5.5 Texas Instruments (TI) Recent Development
11.6 STMicroelectronics
11.6.1 STMicroelectronics Company Details
11.6.2 STMicroelectronics Business Overview
11.6.3 STMicroelectronics IC Packaging and Testing Introduction
11.6.4 STMicroelectronics Revenue in IC Packaging and Testing Business (2019-2024)
11.6.5 STMicroelectronics Recent Development
11.7 Kioxia
11.7.1 Kioxia Company Details
11.7.2 Kioxia Business Overview
11.7.3 Kioxia IC Packaging and Testing Introduction
11.7.4 Kioxia Revenue in IC Packaging and Testing Business (2019-2024)
11.7.5 Kioxia Recent Development
11.8 Western Digital
11.8.1 Western Digital Company Details
11.8.2 Western Digital Business Overview
11.8.3 Western Digital IC Packaging and Testing Introduction
11.8.4 Western Digital Revenue in IC Packaging and Testing Business (2019-2024)
11.8.5 Western Digital Recent Development
11.9 Infineon
11.9.1 Infineon Company Details
11.9.2 Infineon Business Overview
11.9.3 Infineon IC Packaging and Testing Introduction
11.9.4 Infineon Revenue in IC Packaging and Testing Business (2019-2024)
11.9.5 Infineon Recent Development
11.10 NXP
11.10.1 NXP Company Details
11.10.2 NXP Business Overview
11.10.3 NXP IC Packaging and Testing Introduction
11.10.4 NXP Revenue in IC Packaging and Testing Business (2019-2024)
11.10.5 NXP Recent Development
11.11 Analog Devices, Inc. (ADI)
11.11.1 Analog Devices, Inc. (ADI) Company Details
11.11.2 Analog Devices, Inc. (ADI) Business Overview
11.11.3 Analog Devices, Inc. (ADI) IC Packaging and Testing Introduction
11.11.4 Analog Devices, Inc. (ADI) Revenue in IC Packaging and Testing Business (2019-2024)
11.11.5 Analog Devices, Inc. (ADI) Recent Development
11.12 Renesas
11.12.1 Renesas Company Details
11.12.2 Renesas Business Overview
11.12.3 Renesas IC Packaging and Testing Introduction
11.12.4 Renesas Revenue in IC Packaging and Testing Business (2019-2024)
11.12.5 Renesas Recent Development
11.13 Microchip Technology
11.13.1 Microchip Technology Company Details
11.13.2 Microchip Technology Business Overview
11.13.3 Microchip Technology IC Packaging and Testing Introduction
11.13.4 Microchip Technology Revenue in IC Packaging and Testing Business (2019-2024)
11.13.5 Microchip Technology Recent Development
11.14 Onsemi
11.14.1 Onsemi Company Details
11.14.2 Onsemi Business Overview
11.14.3 Onsemi IC Packaging and Testing Introduction
11.14.4 Onsemi Revenue in IC Packaging and Testing Business (2019-2024)
11.14.5 Onsemi Recent Development
11.15 Sony Semiconductor Solutions Corporation
11.15.1 Sony Semiconductor Solutions Corporation Company Details
11.15.2 Sony Semiconductor Solutions Corporation Business Overview
11.15.3 Sony Semiconductor Solutions Corporation IC Packaging and Testing Introduction
11.15.4 Sony Semiconductor Solutions Corporation Revenue in IC Packaging and Testing Business (2019-2024)
11.15.5 Sony Semiconductor Solutions Corporation Recent Development
11.16 Panasonic
11.16.1 Panasonic Company Details
11.16.2 Panasonic Business Overview
11.16.3 Panasonic IC Packaging and Testing Introduction
11.16.4 Panasonic Revenue in IC Packaging and Testing Business (2019-2024)
11.16.5 Panasonic Recent Development
11.17 Winbond
11.17.1 Winbond Company Details
11.17.2 Winbond Business Overview
11.17.3 Winbond IC Packaging and Testing Introduction
11.17.4 Winbond Revenue in IC Packaging and Testing Business (2019-2024)
11.17.5 Winbond Recent Development
11.18 Nanya Technology
11.18.1 Nanya Technology Company Details
11.18.2 Nanya Technology Business Overview
11.18.3 Nanya Technology IC Packaging and Testing Introduction
11.18.4 Nanya Technology Revenue in IC Packaging and Testing Business (2019-2024)
11.18.5 Nanya Technology Recent Development
11.19 ISSI (Integrated Silicon Solution Inc.)
11.19.1 ISSI (Integrated Silicon Solution Inc.) Company Details
11.19.2 ISSI (Integrated Silicon Solution Inc.) Business Overview
11.19.3 ISSI (Integrated Silicon Solution Inc.) IC Packaging and Testing Introduction
11.19.4 ISSI (Integrated Silicon Solution Inc.) Revenue in IC Packaging and Testing Business (2019-2024)
11.19.5 ISSI (Integrated Silicon Solution Inc.) Recent Development
11.20 Macronix
11.20.1 Macronix Company Details
11.20.2 Macronix Business Overview
11.20.3 Macronix IC Packaging and Testing Introduction
11.20.4 Macronix Revenue in IC Packaging and Testing Business (2019-2024)
11.20.5 Macronix Recent Development
11.21 Giantec Semiconductor
11.21.1 Giantec Semiconductor Company Details
11.21.2 Giantec Semiconductor Business Overview
11.21.3 Giantec Semiconductor IC Packaging and Testing Introduction
11.21.4 Giantec Semiconductor Revenue in IC Packaging and Testing Business (2019-2024)
11.21.5 Giantec Semiconductor Recent Development
11.22 Sharp
11.22.1 Sharp Company Details
11.22.2 Sharp Business Overview
11.22.3 Sharp IC Packaging and Testing Introduction
11.22.4 Sharp Revenue in IC Packaging and Testing Business (2019-2024)
11.22.5 Sharp Recent Development
11.23 Magnachip
11.23.1 Magnachip Company Details
11.23.2 Magnachip Business Overview
11.23.3 Magnachip IC Packaging and Testing Introduction
11.23.4 Magnachip Revenue in IC Packaging and Testing Business (2019-2024)
11.23.5 Magnachip Recent Development
11.24 Toshiba
11.24.1 Toshiba Company Details
11.24.2 Toshiba Business Overview
11.24.3 Toshiba IC Packaging and Testing Introduction
11.24.4 Toshiba Revenue in IC Packaging and Testing Business (2019-2024)
11.24.5 Toshiba Recent Development
11.25 JS Foundry KK.
11.25.1 JS Foundry KK. Company Details
11.25.2 JS Foundry KK. Business Overview
11.25.3 JS Foundry KK. IC Packaging and Testing Introduction
11.25.4 JS Foundry KK. Revenue in IC Packaging and Testing Business (2019-2024)
11.25.5 JS Foundry KK. Recent Development
11.26 Hitachi
11.26.1 Hitachi Company Details
11.26.2 Hitachi Business Overview
11.26.3 Hitachi IC Packaging and Testing Introduction
11.26.4 Hitachi Revenue in IC Packaging and Testing Business (2019-2024)
11.26.5 Hitachi Recent Development
11.27 Murata
11.27.1 Murata Company Details
11.27.2 Murata Business Overview
11.27.3 Murata IC Packaging and Testing Introduction
11.27.4 Murata Revenue in IC Packaging and Testing Business (2019-2024)
11.27.5 Murata Recent Development
11.28 Skyworks Solutions Inc
11.28.1 Skyworks Solutions Inc Company Details
11.28.2 Skyworks Solutions Inc Business Overview
11.28.3 Skyworks Solutions Inc IC Packaging and Testing Introduction
11.28.4 Skyworks Solutions Inc Revenue in IC Packaging and Testing Business (2019-2024)
11.28.5 Skyworks Solutions Inc Recent Development
11.29 Wolfspeed
11.29.1 Wolfspeed Company Details
11.29.2 Wolfspeed Business Overview
11.29.3 Wolfspeed IC Packaging and Testing Introduction
11.29.4 Wolfspeed Revenue in IC Packaging and Testing Business (2019-2024)
11.29.5 Wolfspeed Recent Development
11.30 Littelfuse
11.30.1 Littelfuse Company Details
11.30.2 Littelfuse Business Overview
11.30.3 Littelfuse IC Packaging and Testing Introduction
11.30.4 Littelfuse Revenue in IC Packaging and Testing Business (2019-2024)
11.30.5 Littelfuse Recent Development
11.31 Diodes Incorporated
11.31.1 Diodes Incorporated Company Details
11.31.2 Diodes Incorporated Business Overview
11.31.3 Diodes Incorporated IC Packaging and Testing Introduction
11.31.4 Diodes Incorporated Revenue in IC Packaging and Testing Business (2019-2024)
11.31.5 Diodes Incorporated Recent Development
11.32 Rohm
11.32.1 Rohm Company Details
11.32.2 Rohm Business Overview
11.32.3 Rohm IC Packaging and Testing Introduction
11.32.4 Rohm Revenue in IC Packaging and Testing Business (2019-2024)
11.32.5 Rohm Recent Development
11.33 Fuji Electric
11.33.1 Fuji Electric Company Details
11.33.2 Fuji Electric Business Overview
11.33.3 Fuji Electric IC Packaging and Testing Introduction
11.33.4 Fuji Electric Revenue in IC Packaging and Testing Business (2019-2024)
11.33.5 Fuji Electric Recent Development
11.34 Vishay Intertechnology
11.34.1 Vishay Intertechnology Company Details
11.34.2 Vishay Intertechnology Business Overview
11.34.3 Vishay Intertechnology IC Packaging and Testing Introduction
11.34.4 Vishay Intertechnology Revenue in IC Packaging and Testing Business (2019-2024)
11.34.5 Vishay Intertechnology Recent Development
11.35 Mitsubishi Electric
11.35.1 Mitsubishi Electric Company Details
11.35.2 Mitsubishi Electric Business Overview
11.35.3 Mitsubishi Electric IC Packaging and Testing Introduction
11.35.4 Mitsubishi Electric Revenue in IC Packaging and Testing Business (2019-2024)
11.35.5 Mitsubishi Electric Recent Development
11.36 Nexperia
11.36.1 Nexperia Company Details
11.36.2 Nexperia Business Overview
11.36.3 Nexperia IC Packaging and Testing Introduction
11.36.4 Nexperia Revenue in IC Packaging and Testing Business (2019-2024)
11.36.5 Nexperia Recent Development
11.37 Ampleon
11.37.1 Ampleon Company Details
11.37.2 Ampleon Business Overview
11.37.3 Ampleon IC Packaging and Testing Introduction
11.37.4 Ampleon Revenue in IC Packaging and Testing Business (2019-2024)
11.37.5 Ampleon Recent Development
11.38 CR Micro
11.38.1 CR Micro Company Details
11.38.2 CR Micro Business Overview
11.38.3 CR Micro IC Packaging and Testing Introduction
11.38.4 CR Micro Revenue in IC Packaging and Testing Business (2019-2024)
11.38.5 CR Micro Recent Development
11.39 Hangzhou Silan Integrated Circuit
11.39.1 Hangzhou Silan Integrated Circuit Company Details
11.39.2 Hangzhou Silan Integrated Circuit Business Overview
11.39.3 Hangzhou Silan Integrated Circuit IC Packaging and Testing Introduction
11.39.4 Hangzhou Silan Integrated Circuit Revenue in IC Packaging and Testing Business (2019-2024)
11.39.5 Hangzhou Silan Integrated Circuit Recent Development
11.40 ASE (SPIL)
11.40.1 ASE (SPIL) Company Details
11.40.2 ASE (SPIL) Business Overview
11.40.3 ASE (SPIL) IC Packaging and Testing Introduction
11.40.4 ASE (SPIL) Revenue in IC Packaging and Testing Business (2019-2024)
11.40.5 ASE (SPIL) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Western Digital
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas
Microchip Technology
Onsemi
Sony Semiconductor Solutions Corporation
Panasonic
Winbond
Nanya Technology
ISSI (Integrated Silicon Solution Inc.)
Macronix
Giantec Semiconductor
Sharp
Magnachip
Toshiba
JS Foundry KK.
Hitachi
Murata
Skyworks Solutions Inc
Wolfspeed
Littelfuse
Diodes Incorporated
Rohm
Fuji Electric
Vishay Intertechnology
Mitsubishi Electric
Nexperia
Ampleon
CR Micro
Hangzhou Silan Integrated Circuit
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
Carsem
King Yuan Electronics Corp. (KYEC)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor锛圚efei锛塁o., Ltd.
Hefei Chipmore Technology Co.,Ltd.
HT-tech
Chippacking
听
听
*If Applicable.
