The global IC Packaging and Testing Service market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for IC Packaging and Testing Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging and Testing Service.
Report Scope
The IC Packaging and Testing Service market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Packaging and Testing Service market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging and Testing Service companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Intel
Samsung
SK Hynix
Micron
ASE Group
Amkor Technology, Inc.
Huatian Technology
Powertech Technology, Inc.
Chipbond
Presto Engineering
JECT
Siliconware Precision Industries Co., Ltd.
Tongfu Microelectronics
Tower Semiconductor
Qualcomm
MediaTek
UMC
Apple
IBM
Graphcore
ADLINK
Kioxia
Texas Instruments
TSMC
Analog Devices
Sony
Infineon
Bosch
onsemi
Mitsubishi Electric
Micross
UTAC
KYEC
ChipMOS
China Resources Group
Segment by Type
IDM
OSAT
Segment by Application
Communication
Automotive Electronics
Industrial
Consumer Electronics
Computing and Networking
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of IC Packaging and Testing Service companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global IC Packaging and Testing Service Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 IDM
1.2.3 OSAT
1.3 Market by Application
1.3.1 Global IC Packaging and Testing Service Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Communication
1.3.3 Automotive Electronics
1.3.4 Industrial
1.3.5 Consumer Electronics
1.3.6 Computing and Networking
1.3.7 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global IC Packaging and Testing Service Market Perspective (2019-2030)
2.2 IC Packaging and Testing Service Growth Trends by Region
2.2.1 Global IC Packaging and Testing Service Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 IC Packaging and Testing Service Historic Market Size by Region (2019-2024)
2.2.3 IC Packaging and Testing Service Forecasted Market Size by Region (2025-2030)
2.3 IC Packaging and Testing Service Market Dynamics
2.3.1 IC Packaging and Testing Service Industry Trends
2.3.2 IC Packaging and Testing Service Market Drivers
2.3.3 IC Packaging and Testing Service Market Challenges
2.3.4 IC Packaging and Testing Service Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top IC Packaging and Testing Service Players by Revenue
3.1.1 Global Top IC Packaging and Testing Service Players by Revenue (2019-2024)
3.1.2 Global IC Packaging and Testing Service Revenue Market Share by Players (2019-2024)
3.2 Global IC Packaging and Testing Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by IC Packaging and Testing Service Revenue
3.4 Global IC Packaging and Testing Service Market Concentration Ratio
3.4.1 Global IC Packaging and Testing Service Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by IC Packaging and Testing Service Revenue in 2023
3.5 IC Packaging and Testing Service Key Players Head office and Area Served
3.6 Key Players IC Packaging and Testing Service Product Solution and Service
3.7 Date of Enter into IC Packaging and Testing Service Market
3.8 Mergers & Acquisitions, Expansion Plans
4 IC Packaging and Testing Service Breakdown Data by Type
4.1 Global IC Packaging and Testing Service Historic Market Size by Type (2019-2024)
4.2 Global IC Packaging and Testing Service Forecasted Market Size by Type (2025-2030)
5 IC Packaging and Testing Service Breakdown Data by Application
5.1 Global IC Packaging and Testing Service Historic Market Size by Application (2019-2024)
5.2 Global IC Packaging and Testing Service Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America IC Packaging and Testing Service Market Size (2019-2030)
6.2 North America IC Packaging and Testing Service Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America IC Packaging and Testing Service Market Size by Country (2019-2024)
6.4 North America IC Packaging and Testing Service Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe IC Packaging and Testing Service Market Size (2019-2030)
7.2 Europe IC Packaging and Testing Service Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe IC Packaging and Testing Service Market Size by Country (2019-2024)
7.4 Europe IC Packaging and Testing Service Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific IC Packaging and Testing Service Market Size (2019-2030)
8.2 Asia-Pacific IC Packaging and Testing Service Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific IC Packaging and Testing Service Market Size by Region (2019-2024)
8.4 Asia-Pacific IC Packaging and Testing Service Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America IC Packaging and Testing Service Market Size (2019-2030)
9.2 Latin America IC Packaging and Testing Service Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America IC Packaging and Testing Service Market Size by Country (2019-2024)
9.4 Latin America IC Packaging and Testing Service Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa IC Packaging and Testing Service Market Size (2019-2030)
10.2 Middle East & Africa IC Packaging and Testing Service Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa IC Packaging and Testing Service Market Size by Country (2019-2024)
10.4 Middle East & Africa IC Packaging and Testing Service Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Intel
11.1.1 Intel Company Detail
11.1.2 Intel Business Overview
11.1.3 Intel IC Packaging and Testing Service Introduction
11.1.4 Intel Revenue in IC Packaging and Testing Service Business (2019-2024)
11.1.5 Intel Recent Development
11.2 Samsung
11.2.1 Samsung Company Detail
11.2.2 Samsung Business Overview
11.2.3 Samsung IC Packaging and Testing Service Introduction
11.2.4 Samsung Revenue in IC Packaging and Testing Service Business (2019-2024)
11.2.5 Samsung Recent Development
11.3 SK Hynix
11.3.1 SK Hynix Company Detail
11.3.2 SK Hynix Business Overview
11.3.3 SK Hynix IC Packaging and Testing Service Introduction
11.3.4 SK Hynix Revenue in IC Packaging and Testing Service Business (2019-2024)
11.3.5 SK Hynix Recent Development
11.4 Micron
11.4.1 Micron Company Detail
11.4.2 Micron Business Overview
11.4.3 Micron IC Packaging and Testing Service Introduction
11.4.4 Micron Revenue in IC Packaging and Testing Service Business (2019-2024)
11.4.5 Micron Recent Development
11.5 ASE Group
11.5.1 ASE Group Company Detail
11.5.2 ASE Group Business Overview
11.5.3 ASE Group IC Packaging and Testing Service Introduction
11.5.4 ASE Group Revenue in IC Packaging and Testing Service Business (2019-2024)
11.5.5 ASE Group Recent Development
11.6 Amkor Technology, Inc.
11.6.1 Amkor Technology, Inc. Company Detail
11.6.2 Amkor Technology, Inc. Business Overview
11.6.3 Amkor Technology, Inc. IC Packaging and Testing Service Introduction
11.6.4 Amkor Technology, Inc. Revenue in IC Packaging and Testing Service Business (2019-2024)
11.6.5 Amkor Technology, Inc. Recent Development
11.7 Huatian Technology
11.7.1 Huatian Technology Company Detail
11.7.2 Huatian Technology Business Overview
11.7.3 Huatian Technology IC Packaging and Testing Service Introduction
11.7.4 Huatian Technology Revenue in IC Packaging and Testing Service Business (2019-2024)
11.7.5 Huatian Technology Recent Development
11.8 Powertech Technology, Inc.
11.8.1 Powertech Technology, Inc. Company Detail
11.8.2 Powertech Technology, Inc. Business Overview
11.8.3 Powertech Technology, Inc. IC Packaging and Testing Service Introduction
11.8.4 Powertech Technology, Inc. Revenue in IC Packaging and Testing Service Business (2019-2024)
11.8.5 Powertech Technology, Inc. Recent Development
11.9 Chipbond
11.9.1 Chipbond Company Detail
11.9.2 Chipbond Business Overview
11.9.3 Chipbond IC Packaging and Testing Service Introduction
11.9.4 Chipbond Revenue in IC Packaging and Testing Service Business (2019-2024)
11.9.5 Chipbond Recent Development
11.10 Presto Engineering
11.10.1 Presto Engineering Company Detail
11.10.2 Presto Engineering Business Overview
11.10.3 Presto Engineering IC Packaging and Testing Service Introduction
11.10.4 Presto Engineering Revenue in IC Packaging and Testing Service Business (2019-2024)
11.10.5 Presto Engineering Recent Development
11.11 JECT
11.11.1 JECT Company Detail
11.11.2 JECT Business Overview
11.11.3 JECT IC Packaging and Testing Service Introduction
11.11.4 JECT Revenue in IC Packaging and Testing Service Business (2019-2024)
11.11.5 JECT Recent Development
11.12 Siliconware Precision Industries Co., Ltd.
11.12.1 Siliconware Precision Industries Co., Ltd. Company Detail
11.12.2 Siliconware Precision Industries Co., Ltd. Business Overview
11.12.3 Siliconware Precision Industries Co., Ltd. IC Packaging and Testing Service Introduction
11.12.4 Siliconware Precision Industries Co., Ltd. Revenue in IC Packaging and Testing Service Business (2019-2024)
11.12.5 Siliconware Precision Industries Co., Ltd. Recent Development
11.13 Tongfu Microelectronics
11.13.1 Tongfu Microelectronics Company Detail
11.13.2 Tongfu Microelectronics Business Overview
11.13.3 Tongfu Microelectronics IC Packaging and Testing Service Introduction
11.13.4 Tongfu Microelectronics Revenue in IC Packaging and Testing Service Business (2019-2024)
11.13.5 Tongfu Microelectronics Recent Development
11.14 Tower Semiconductor
11.14.1 Tower Semiconductor Company Detail
11.14.2 Tower Semiconductor Business Overview
11.14.3 Tower Semiconductor IC Packaging and Testing Service Introduction
11.14.4 Tower Semiconductor Revenue in IC Packaging and Testing Service Business (2019-2024)
11.14.5 Tower Semiconductor Recent Development
11.15 Qualcomm
11.15.1 Qualcomm Company Detail
11.15.2 Qualcomm Business Overview
11.15.3 Qualcomm IC Packaging and Testing Service Introduction
11.15.4 Qualcomm Revenue in IC Packaging and Testing Service Business (2019-2024)
11.15.5 Qualcomm Recent Development
11.16 MediaTek
11.16.1 MediaTek Company Detail
11.16.2 MediaTek Business Overview
11.16.3 MediaTek IC Packaging and Testing Service Introduction
11.16.4 MediaTek Revenue in IC Packaging and Testing Service Business (2019-2024)
11.16.5 MediaTek Recent Development
11.17 UMC
11.17.1 UMC Company Detail
11.17.2 UMC Business Overview
11.17.3 UMC IC Packaging and Testing Service Introduction
11.17.4 UMC Revenue in IC Packaging and Testing Service Business (2019-2024)
11.17.5 UMC Recent Development
11.18 Apple
11.18.1 Apple Company Detail
11.18.2 Apple Business Overview
11.18.3 Apple IC Packaging and Testing Service Introduction
11.18.4 Apple Revenue in IC Packaging and Testing Service Business (2019-2024)
11.18.5 Apple Recent Development
11.19 IBM
11.19.1 IBM Company Detail
11.19.2 IBM Business Overview
11.19.3 IBM IC Packaging and Testing Service Introduction
11.19.4 IBM Revenue in IC Packaging and Testing Service Business (2019-2024)
11.19.5 IBM Recent Development
11.20 Graphcore
11.20.1 Graphcore Company Detail
11.20.2 Graphcore Business Overview
11.20.3 Graphcore IC Packaging and Testing Service Introduction
11.20.4 Graphcore Revenue in IC Packaging and Testing Service Business (2019-2024)
11.20.5 Graphcore Recent Development
11.21 ADLINK
11.21.1 ADLINK Company Detail
11.21.2 ADLINK Business Overview
11.21.3 ADLINK IC Packaging and Testing Service Introduction
11.21.4 ADLINK Revenue in IC Packaging and Testing Service Business (2019-2024)
11.21.5 ADLINK Recent Development
11.22 Kioxia
11.22.1 Kioxia Company Detail
11.22.2 Kioxia Business Overview
11.22.3 Kioxia IC Packaging and Testing Service Introduction
11.22.4 Kioxia Revenue in IC Packaging and Testing Service Business (2019-2024)
11.22.5 Kioxia Recent Development
11.23 Texas Instruments
11.23.1 Texas Instruments Company Detail
11.23.2 Texas Instruments Business Overview
11.23.3 Texas Instruments IC Packaging and Testing Service Introduction
11.23.4 Texas Instruments Revenue in IC Packaging and Testing Service Business (2019-2024)
11.23.5 Texas Instruments Recent Development
11.24 TSMC
11.24.1 TSMC Company Detail
11.24.2 TSMC Business Overview
11.24.3 TSMC IC Packaging and Testing Service Introduction
11.24.4 TSMC Revenue in IC Packaging and Testing Service Business (2019-2024)
11.24.5 TSMC Recent Development
11.25 Analog Devices
11.25.1 Analog Devices Company Detail
11.25.2 Analog Devices Business Overview
11.25.3 Analog Devices IC Packaging and Testing Service Introduction
11.25.4 Analog Devices Revenue in IC Packaging and Testing Service Business (2019-2024)
11.25.5 Analog Devices Recent Development
11.26 Sony
11.26.1 Sony Company Detail
11.26.2 Sony Business Overview
11.26.3 Sony IC Packaging and Testing Service Introduction
11.26.4 Sony Revenue in IC Packaging and Testing Service Business (2019-2024)
11.26.5 Sony Recent Development
11.27 Infineon
11.27.1 Infineon Company Detail
11.27.2 Infineon Business Overview
11.27.3 Infineon IC Packaging and Testing Service Introduction
11.27.4 Infineon Revenue in IC Packaging and Testing Service Business (2019-2024)
11.27.5 Infineon Recent Development
11.28 Bosch
11.28.1 Bosch Company Detail
11.28.2 Bosch Business Overview
11.28.3 Bosch IC Packaging and Testing Service Introduction
11.28.4 Bosch Revenue in IC Packaging and Testing Service Business (2019-2024)
11.28.5 Bosch Recent Development
11.29 onsemi
11.29.1 onsemi Company Detail
11.29.2 onsemi Business Overview
11.29.3 onsemi IC Packaging and Testing Service Introduction
11.29.4 onsemi Revenue in IC Packaging and Testing Service Business (2019-2024)
11.29.5 onsemi Recent Development
11.30 Mitsubishi Electric
11.30.1 Mitsubishi Electric Company Detail
11.30.2 Mitsubishi Electric Business Overview
11.30.3 Mitsubishi Electric IC Packaging and Testing Service Introduction
11.30.4 Mitsubishi Electric Revenue in IC Packaging and Testing Service Business (2019-2024)
11.30.5 Mitsubishi Electric Recent Development
11.31 Micross
11.31.1 Micross Company Detail
11.31.2 Micross Business Overview
11.31.3 Micross IC Packaging and Testing Service Introduction
11.31.4 Micross Revenue in IC Packaging and Testing Service Business (2019-2024)
11.31.5 Micross Recent Development
11.32 UTAC
11.32.1 UTAC Company Detail
11.32.2 UTAC Business Overview
11.32.3 UTAC IC Packaging and Testing Service Introduction
11.32.4 UTAC Revenue in IC Packaging and Testing Service Business (2019-2024)
11.32.5 UTAC Recent Development
11.33 KYEC
11.33.1 KYEC Company Detail
11.33.2 KYEC Business Overview
11.33.3 KYEC IC Packaging and Testing Service Introduction
11.33.4 KYEC Revenue in IC Packaging and Testing Service Business (2019-2024)
11.33.5 KYEC Recent Development
11.34 ChipMOS
11.34.1 ChipMOS Company Detail
11.34.2 ChipMOS Business Overview
11.34.3 ChipMOS IC Packaging and Testing Service Introduction
11.34.4 ChipMOS Revenue in IC Packaging and Testing Service Business (2019-2024)
11.34.5 ChipMOS Recent Development
11.35 China Resources Group
11.35.1 China Resources Group Company Detail
11.35.2 China Resources Group Business Overview
11.35.3 China Resources Group IC Packaging and Testing Service Introduction
11.35.4 China Resources Group Revenue in IC Packaging and Testing Service Business (2019-2024)
11.35.5 China Resources Group Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Intel
Samsung
SK Hynix
Micron
ASE Group
Amkor Technology, Inc.
Huatian Technology
Powertech Technology, Inc.
Chipbond
Presto Engineering
JECT
Siliconware Precision Industries Co., Ltd.
Tongfu Microelectronics
Tower Semiconductor
Qualcomm
MediaTek
UMC
Apple
IBM
Graphcore
ADLINK
Kioxia
Texas Instruments
TSMC
Analog Devices
Sony
Infineon
Bosch
onsemi
Mitsubishi Electric
Micross
UTAC
KYEC
ChipMOS
China Resources Group
听
听
*If Applicable.
