Global IC Packaging Design and Verification Market Research Report 2023

Publication ID:

PB510233015

Publication Date:

October 16, 2023

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

The global IC Packaging Design and Verification market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole IC Packaging Design and Verification 91制片厂.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global IC Packaging Design and Verification market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
Siemens
Altium
Zuken
Autodesk
Cadence
Synopsys
ANSYS
Novarm
WestDev
ExpressPCB
EasyEDA
Shanghai Tsingyue
National Instrument
Segment by Type
Cloud Based
On-premises
Segment by Application
Consumer Electronics
Telecommunication
Industrial
Medical
Automotive
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The IC Packaging Design and Verification report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies鈥� Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies鈥� Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global IC Packaging Design and Verification Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Cloud Based
1.2.3 On-premises
1.3 Market by Application
1.3.1 Global IC Packaging Design and Verification Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Telecommunication
1.3.4 Industrial
1.3.5 Medical
1.3.6 Automotive
1.3.7 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global IC Packaging Design and Verification Market Perspective (2018-2029)
2.2 IC Packaging Design and Verification Growth Trends by Region
2.2.1 Global IC Packaging Design and Verification Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 IC Packaging Design and Verification Historic Market Size by Region (2018-2023)
2.2.3 IC Packaging Design and Verification Forecasted Market Size by Region (2024-2029)
2.3 IC Packaging Design and Verification Market Dynamics
2.3.1 IC Packaging Design and Verification Industry Trends
2.3.2 IC Packaging Design and Verification Market Drivers
2.3.3 IC Packaging Design and Verification Market Challenges
2.3.4 IC Packaging Design and Verification Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top IC Packaging Design and Verification Players by Revenue
3.1.1 Global Top IC Packaging Design and Verification Players by Revenue (2018-2023)
3.1.2 Global IC Packaging Design and Verification Revenue Market Share by Players (2018-2023)
3.2 Global IC Packaging Design and Verification Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by IC Packaging Design and Verification Revenue
3.4 Global IC Packaging Design and Verification Market Concentration Ratio
3.4.1 Global IC Packaging Design and Verification Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by IC Packaging Design and Verification Revenue in 2022
3.5 IC Packaging Design and Verification Key Players Head office and Area Served
3.6 Key Players IC Packaging Design and Verification Product Solution and Service
3.7 Date of Enter into IC Packaging Design and Verification Market
3.8 Mergers & Acquisitions, Expansion Plans
4 IC Packaging Design and Verification Breakdown Data by Type
4.1 Global IC Packaging Design and Verification Historic Market Size by Type (2018-2023)
4.2 Global IC Packaging Design and Verification Forecasted Market Size by Type (2024-2029)
5 IC Packaging Design and Verification Breakdown Data by Application
5.1 Global IC Packaging Design and Verification Historic Market Size by Application (2018-2023)
5.2 Global IC Packaging Design and Verification Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America IC Packaging Design and Verification Market Size (2018-2029)
6.2 North America IC Packaging Design and Verification Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America IC Packaging Design and Verification Market Size by Country (2018-2023)
6.4 North America IC Packaging Design and Verification Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe IC Packaging Design and Verification Market Size (2018-2029)
7.2 Europe IC Packaging Design and Verification Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe IC Packaging Design and Verification Market Size by Country (2018-2023)
7.4 Europe IC Packaging Design and Verification Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific IC Packaging Design and Verification Market Size (2018-2029)
8.2 Asia-Pacific IC Packaging Design and Verification Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific IC Packaging Design and Verification Market Size by Region (2018-2023)
8.4 Asia-Pacific IC Packaging Design and Verification Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America IC Packaging Design and Verification Market Size (2018-2029)
9.2 Latin America IC Packaging Design and Verification Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America IC Packaging Design and Verification Market Size by Country (2018-2023)
9.4 Latin America IC Packaging Design and Verification Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa IC Packaging Design and Verification Market Size (2018-2029)
10.2 Middle East & Africa IC Packaging Design and Verification Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa IC Packaging Design and Verification Market Size by Country (2018-2023)
10.4 Middle East & Africa IC Packaging Design and Verification Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Siemens
11.1.1 Siemens Company Detail
11.1.2 Siemens Business Overview
11.1.3 Siemens IC Packaging Design and Verification Introduction
11.1.4 Siemens Revenue in IC Packaging Design and Verification Business (2018-2023)
11.1.5 Siemens Recent Development
11.2 Altium
11.2.1 Altium Company Detail
11.2.2 Altium Business Overview
11.2.3 Altium IC Packaging Design and Verification Introduction
11.2.4 Altium Revenue in IC Packaging Design and Verification Business (2018-2023)
11.2.5 Altium Recent Development
11.3 Zuken
11.3.1 Zuken Company Detail
11.3.2 Zuken Business Overview
11.3.3 Zuken IC Packaging Design and Verification Introduction
11.3.4 Zuken Revenue in IC Packaging Design and Verification Business (2018-2023)
11.3.5 Zuken Recent Development
11.4 Autodesk
11.4.1 Autodesk Company Detail
11.4.2 Autodesk Business Overview
11.4.3 Autodesk IC Packaging Design and Verification Introduction
11.4.4 Autodesk Revenue in IC Packaging Design and Verification Business (2018-2023)
11.4.5 Autodesk Recent Development
11.5 Cadence
11.5.1 Cadence Company Detail
11.5.2 Cadence Business Overview
11.5.3 Cadence IC Packaging Design and Verification Introduction
11.5.4 Cadence Revenue in IC Packaging Design and Verification Business (2018-2023)
11.5.5 Cadence Recent Development
11.6 Synopsys
11.6.1 Synopsys Company Detail
11.6.2 Synopsys Business Overview
11.6.3 Synopsys IC Packaging Design and Verification Introduction
11.6.4 Synopsys Revenue in IC Packaging Design and Verification Business (2018-2023)
11.6.5 Synopsys Recent Development
11.7 ANSYS
11.7.1 ANSYS Company Detail
11.7.2 ANSYS Business Overview
11.7.3 ANSYS IC Packaging Design and Verification Introduction
11.7.4 ANSYS Revenue in IC Packaging Design and Verification Business (2018-2023)
11.7.5 ANSYS Recent Development
11.8 Novarm
11.8.1 Novarm Company Detail
11.8.2 Novarm Business Overview
11.8.3 Novarm IC Packaging Design and Verification Introduction
11.8.4 Novarm Revenue in IC Packaging Design and Verification Business (2018-2023)
11.8.5 Novarm Recent Development
11.9 WestDev
11.9.1 WestDev Company Detail
11.9.2 WestDev Business Overview
11.9.3 WestDev IC Packaging Design and Verification Introduction
11.9.4 WestDev Revenue in IC Packaging Design and Verification Business (2018-2023)
11.9.5 WestDev Recent Development
11.10 ExpressPCB
11.10.1 ExpressPCB Company Detail
11.10.2 ExpressPCB Business Overview
11.10.3 ExpressPCB IC Packaging Design and Verification Introduction
11.10.4 ExpressPCB Revenue in IC Packaging Design and Verification Business (2018-2023)
11.10.5 ExpressPCB Recent Development
11.11 EasyEDA
11.11.1 EasyEDA Company Detail
11.11.2 EasyEDA Business Overview
11.11.3 EasyEDA IC Packaging Design and Verification Introduction
11.11.4 EasyEDA Revenue in IC Packaging Design and Verification Business (2018-2023)
11.11.5 EasyEDA Recent Development
11.12 Shanghai Tsingyue
11.12.1 Shanghai Tsingyue Company Detail
11.12.2 Shanghai Tsingyue Business Overview
11.12.3 Shanghai Tsingyue IC Packaging Design and Verification Introduction
11.12.4 Shanghai Tsingyue Revenue in IC Packaging Design and Verification Business (2018-2023)
11.12.5 Shanghai Tsingyue Recent Development
11.13 National Instrument
11.13.1 National Instrument Company Detail
11.13.2 National Instrument Business Overview
11.13.3 National Instrument IC Packaging Design and Verification Introduction
11.13.4 National Instrument Revenue in IC Packaging Design and Verification Business (2018-2023)
11.13.5 National Instrument Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Siemens
Altium
Zuken
Autodesk
Cadence
Synopsys
ANSYS
Novarm
WestDev
ExpressPCB
EasyEDA
Shanghai Tsingyue
National Instrument

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