The global market for IC Packaging Substrate was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
IC packaging substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Substrate.
The IC Packaging Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global IC Packaging Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing
by Type
WB CSP
FC BGA
FC CSP
PBGA
SiP
BOC
Other
by Application
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Packaging Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Packaging Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 IC Packaging Substrate Market Overview
1.1 Product Definition
1.2 IC Packaging Substrate by Type
1.2.1 Global IC Packaging Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 WB CSP
1.2.3 FC BGA
1.2.4 FC CSP
1.2.5 PBGA
1.2.6 SiP
1.2.7 BOC
1.2.8 Other
1.3 IC Packaging Substrate by Application
1.3.1 Global IC Packaging Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global IC Packaging Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global IC Packaging Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global IC Packaging Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global IC Packaging Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of IC Packaging Substrate, Industry Ranking, 2023 VS 2024
2.4 Global IC Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global IC Packaging Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of IC Packaging Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging Substrate, Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging Substrate, Date of Enter into This Industry
2.9 IC Packaging Substrate Market Competitive Situation and Trends
2.9.1 IC Packaging Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging Substrate Production by Region
3.1 Global IC Packaging Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global IC Packaging Substrate Production Value by Region (2020-2031)
3.2.1 Global IC Packaging Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of IC Packaging Substrate by Region (2026-2031)
3.3 Global IC Packaging Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global IC Packaging Substrate Production Volume by Region (2020-2031)
3.4.1 Global IC Packaging Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of IC Packaging Substrate by Region (2026-2031)
3.5 Global IC Packaging Substrate Market Price Analysis by Region (2020-2025)
3.6 Global IC Packaging Substrate Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
4 IC Packaging Substrate Consumption by Region
4.1 Global IC Packaging Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global IC Packaging Substrate Consumption by Region (2020-2031)
4.2.1 Global IC Packaging Substrate Consumption by Region (2020-2025)
4.2.2 Global IC Packaging Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America IC Packaging Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe IC Packaging Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific IC Packaging Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa IC Packaging Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global IC Packaging Substrate Production by Type (2020-2031)
5.1.1 Global IC Packaging Substrate Production by Type (2020-2025)
5.1.2 Global IC Packaging Substrate Production by Type (2026-2031)
5.1.3 Global IC Packaging Substrate Production Market Share by Type (2020-2031)
5.2 Global IC Packaging Substrate Production Value by Type (2020-2031)
5.2.1 Global IC Packaging Substrate Production Value by Type (2020-2025)
5.2.2 Global IC Packaging Substrate Production Value by Type (2026-2031)
5.2.3 Global IC Packaging Substrate Production Value Market Share by Type (2020-2031)
5.3 Global IC Packaging Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global IC Packaging Substrate Production by Application (2020-2031)
6.1.1 Global IC Packaging Substrate Production by Application (2020-2025)
6.1.2 Global IC Packaging Substrate Production by Application (2026-2031)
6.1.3 Global IC Packaging Substrate Production Market Share by Application (2020-2031)
6.2 Global IC Packaging Substrate Production Value by Application (2020-2031)
6.2.1 Global IC Packaging Substrate Production Value by Application (2020-2025)
6.2.2 Global IC Packaging Substrate Production Value by Application (2026-2031)
6.2.3 Global IC Packaging Substrate Production Value Market Share by Application (2020-2031)
6.3 Global IC Packaging Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Ibiden
7.1.1 Ibiden IC Packaging Substrate Company Information
7.1.2 Ibiden IC Packaging Substrate Product Portfolio
7.1.3 Ibiden IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Ibiden Main Business and Markets Served
7.1.5 Ibiden Recent Developments/Updates
7.2 Kinsus Interconnect Technology
7.2.1 Kinsus Interconnect Technology IC Packaging Substrate Company Information
7.2.2 Kinsus Interconnect Technology IC Packaging Substrate Product Portfolio
7.2.3 Kinsus Interconnect Technology IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Kinsus Interconnect Technology Main Business and Markets Served
7.2.5 Kinsus Interconnect Technology Recent Developments/Updates
7.3 Unimicron
7.3.1 Unimicron IC Packaging Substrate Company Information
7.3.2 Unimicron IC Packaging Substrate Product Portfolio
7.3.3 Unimicron IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Unimicron Main Business and Markets Served
7.3.5 Unimicron Recent Developments/Updates
7.4 Shinko Electric Industries
7.4.1 Shinko Electric Industries IC Packaging Substrate Company Information
7.4.2 Shinko Electric Industries IC Packaging Substrate Product Portfolio
7.4.3 Shinko Electric Industries IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Shinko Electric Industries Main Business and Markets Served
7.4.5 Shinko Electric Industries Recent Developments/Updates
7.5 Semco
7.5.1 Semco IC Packaging Substrate Company Information
7.5.2 Semco IC Packaging Substrate Product Portfolio
7.5.3 Semco IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Semco Main Business and Markets Served
7.5.5 Semco Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech IC Packaging Substrate Company Information
7.6.2 Simmtech IC Packaging Substrate Product Portfolio
7.6.3 Simmtech IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Nanya
7.7.1 Nanya IC Packaging Substrate Company Information
7.7.2 Nanya IC Packaging Substrate Product Portfolio
7.7.3 Nanya IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Nanya Main Business and Markets Served
7.7.5 Nanya Recent Developments/Updates
7.8 Kyocera
7.8.1 Kyocera IC Packaging Substrate Company Information
7.8.2 Kyocera IC Packaging Substrate Product Portfolio
7.8.3 Kyocera IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Kyocera Main Business and Markets Served
7.8.5 Kyocera Recent Developments/Updates
7.9 LG Innotek
7.9.1 LG Innotek IC Packaging Substrate Company Information
7.9.2 LG Innotek IC Packaging Substrate Product Portfolio
7.9.3 LG Innotek IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 LG Innotek Main Business and Markets Served
7.9.5 LG Innotek Recent Developments/Updates
7.10 AT&S
7.10.1 AT&S IC Packaging Substrate Company Information
7.10.2 AT&S IC Packaging Substrate Product Portfolio
7.10.3 AT&S IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 AT&S Main Business and Markets Served
7.10.5 AT&S Recent Developments/Updates
7.11 ASE
7.11.1 ASE IC Packaging Substrate Company Information
7.11.2 ASE IC Packaging Substrate Product Portfolio
7.11.3 ASE IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 ASE Main Business and Markets Served
7.11.5 ASE Recent Developments/Updates
7.12 Daeduck
7.12.1 Daeduck IC Packaging Substrate Company Information
7.12.2 Daeduck IC Packaging Substrate Product Portfolio
7.12.3 Daeduck IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Daeduck Main Business and Markets Served
7.12.5 Daeduck Recent Developments/Updates
7.13 Shennan Circuit
7.13.1 Shennan Circuit IC Packaging Substrate Company Information
7.13.2 Shennan Circuit IC Packaging Substrate Product Portfolio
7.13.3 Shennan Circuit IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Shennan Circuit Main Business and Markets Served
7.13.5 Shennan Circuit Recent Developments/Updates
7.14 Zhen Ding Technology
7.14.1 Zhen Ding Technology IC Packaging Substrate Company Information
7.14.2 Zhen Ding Technology IC Packaging Substrate Product Portfolio
7.14.3 Zhen Ding Technology IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Zhen Ding Technology Main Business and Markets Served
7.14.5 Zhen Ding Technology Recent Developments/Updates
7.15 KCC (Korea Circuit Company)
7.15.1 KCC (Korea Circuit Company) IC Packaging Substrate Company Information
7.15.2 KCC (Korea Circuit Company) IC Packaging Substrate Product Portfolio
7.15.3 KCC (Korea Circuit Company) IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.15.4 KCC (Korea Circuit Company) Main Business and Markets Served
7.15.5 KCC (Korea Circuit Company) Recent Developments/Updates
7.16 ACCESS
7.16.1 ACCESS IC Packaging Substrate Company Information
7.16.2 ACCESS IC Packaging Substrate Product Portfolio
7.16.3 ACCESS IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.16.4 ACCESS Main Business and Markets Served
7.16.5 ACCESS Recent Developments/Updates
7.17 Shenzhen Fastprint Circuit Tech
7.17.1 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Company Information
7.17.2 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product Portfolio
7.17.3 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
7.17.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
7.18 AKM Meadville
7.18.1 AKM Meadville IC Packaging Substrate Company Information
7.18.2 AKM Meadville IC Packaging Substrate Product Portfolio
7.18.3 AKM Meadville IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.18.4 AKM Meadville Main Business and Markets Served
7.18.5 AKM Meadville Recent Developments/Updates
7.19 Toppan Printing
7.19.1 Toppan Printing IC Packaging Substrate Company Information
7.19.2 Toppan Printing IC Packaging Substrate Product Portfolio
7.19.3 Toppan Printing IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Toppan Printing Main Business and Markets Served
7.19.5 Toppan Printing Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging Substrate Industry Chain Analysis
8.2 IC Packaging Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging Substrate Production Mode & Process Analysis
8.4 IC Packaging Substrate Sales and Marketing
8.4.1 IC Packaging Substrate Sales Channels
8.4.2 IC Packaging Substrate Distributors
8.5 IC Packaging Substrate Customer Analysis
9 IC Packaging Substrate Market Dynamics
9.1 IC Packaging Substrate Industry Trends
9.2 IC Packaging Substrate Market Drivers
9.3 IC Packaging Substrate Market Challenges
9.4 IC Packaging Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing
听
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*If Applicable.
