Global IC Packaging Substrate (SUB) Market Research Report 2023

Publication ID:

PB503239196

Publication Date:

March 3, 2023

Pages:

113

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global IC Packaging Substrate (SUB) market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for IC Packaging Substrate (SUB) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for IC Packaging Substrate (SUB) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of IC Packaging Substrate (SUB) include Samsung Electro-Mechanics, MST, NGK, KLA Corporation, Panasonic, Simmtech, Daeduck, ASE Material and Kyocera, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Packaging Substrate (SUB), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Substrate (SUB).
The IC Packaging Substrate (SUB) market size, estimations, and forecasts are provided in terms of output/shipments (M Pcs) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global IC Packaging Substrate (SUB) market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging Substrate (SUB) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC
Segment by Type
Organic Substrate
Inorganic Substrate
Composite Substrate
Segment by Application
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Packaging Substrate (SUB) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Packaging Substrate (SUB) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Packaging Substrate (SUB) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 IC Packaging Substrate (SUB) Market Overview
1.1 Product Definition
1.2 IC Packaging Substrate (SUB) Segment by Type
1.2.1 Global IC Packaging Substrate (SUB) Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Organic Substrate
1.2.3 Inorganic Substrate
1.2.4 Composite Substrate
1.3 IC Packaging Substrate (SUB) Segment by Application
1.3.1 Global IC Packaging Substrate (SUB) Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global IC Packaging Substrate (SUB) Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global IC Packaging Substrate (SUB) Production Estimates and Forecasts (2018-2029)
1.4.4 Global IC Packaging Substrate (SUB) Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging Substrate (SUB) Production Market Share by Manufacturers (2018-2023)
2.2 Global IC Packaging Substrate (SUB) Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of IC Packaging Substrate (SUB), Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global IC Packaging Substrate (SUB) Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of IC Packaging Substrate (SUB), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging Substrate (SUB), Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging Substrate (SUB), Date of Enter into This Industry
2.9 IC Packaging Substrate (SUB) Market Competitive Situation and Trends
2.9.1 IC Packaging Substrate (SUB) Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging Substrate (SUB) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging Substrate (SUB) Production by Region
3.1 Global IC Packaging Substrate (SUB) Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global IC Packaging Substrate (SUB) Production Value by Region (2018-2029)
3.2.1 Global IC Packaging Substrate (SUB) Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of IC Packaging Substrate (SUB) by Region (2024-2029)
3.3 Global IC Packaging Substrate (SUB) Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global IC Packaging Substrate (SUB) Production by Region (2018-2029)
3.4.1 Global IC Packaging Substrate (SUB) Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of IC Packaging Substrate (SUB) by Region (2024-2029)
3.5 Global IC Packaging Substrate (SUB) Market Price Analysis by Region (2018-2023)
3.6 Global IC Packaging Substrate (SUB) Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2018-2029)
3.6.3 China IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2018-2029)
4 IC Packaging Substrate (SUB) Consumption by Region
4.1 Global IC Packaging Substrate (SUB) Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global IC Packaging Substrate (SUB) Consumption by Region (2018-2029)
4.2.1 Global IC Packaging Substrate (SUB) Consumption by Region (2018-2023)
4.2.2 Global IC Packaging Substrate (SUB) Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America IC Packaging Substrate (SUB) Consumption by Country (2018-2029)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe IC Packaging Substrate (SUB) Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global IC Packaging Substrate (SUB) Production by Type (2018-2029)
5.1.1 Global IC Packaging Substrate (SUB) Production by Type (2018-2023)
5.1.2 Global IC Packaging Substrate (SUB) Production by Type (2024-2029)
5.1.3 Global IC Packaging Substrate (SUB) Production Market Share by Type (2018-2029)
5.2 Global IC Packaging Substrate (SUB) Production Value by Type (2018-2029)
5.2.1 Global IC Packaging Substrate (SUB) Production Value by Type (2018-2023)
5.2.2 Global IC Packaging Substrate (SUB) Production Value by Type (2024-2029)
5.2.3 Global IC Packaging Substrate (SUB) Production Value Market Share by Type (2018-2029)
5.3 Global IC Packaging Substrate (SUB) Price by Type (2018-2029)
6 Segment by Application
6.1 Global IC Packaging Substrate (SUB) Production by Application (2018-2029)
6.1.1 Global IC Packaging Substrate (SUB) Production by Application (2018-2023)
6.1.2 Global IC Packaging Substrate (SUB) Production by Application (2024-2029)
6.1.3 Global IC Packaging Substrate (SUB) Production Market Share by Application (2018-2029)
6.2 Global IC Packaging Substrate (SUB) Production Value by Application (2018-2029)
6.2.1 Global IC Packaging Substrate (SUB) Production Value by Application (2018-2023)
6.2.2 Global IC Packaging Substrate (SUB) Production Value by Application (2024-2029)
6.2.3 Global IC Packaging Substrate (SUB) Production Value Market Share by Application (2018-2029)
6.3 Global IC Packaging Substrate (SUB) Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Samsung Electro-Mechanics
7.1.1 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Corporation Information
7.1.2 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product Portfolio
7.1.3 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Samsung Electro-Mechanics Main Business and Markets Served
7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
7.2 MST
7.2.1 MST IC Packaging Substrate (SUB) Corporation Information
7.2.2 MST IC Packaging Substrate (SUB) Product Portfolio
7.2.3 MST IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.2.4 MST Main Business and Markets Served
7.2.5 MST Recent Developments/Updates
7.3 NGK
7.3.1 NGK IC Packaging Substrate (SUB) Corporation Information
7.3.2 NGK IC Packaging Substrate (SUB) Product Portfolio
7.3.3 NGK IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.3.4 NGK Main Business and Markets Served
7.3.5 NGK Recent Developments/Updates
7.4 KLA Corporation
7.4.1 KLA Corporation IC Packaging Substrate (SUB) Corporation Information
7.4.2 KLA Corporation IC Packaging Substrate (SUB) Product Portfolio
7.4.3 KLA Corporation IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.4.4 KLA Corporation Main Business and Markets Served
7.4.5 KLA Corporation Recent Developments/Updates
7.5 Panasonic
7.5.1 Panasonic IC Packaging Substrate (SUB) Corporation Information
7.5.2 Panasonic IC Packaging Substrate (SUB) Product Portfolio
7.5.3 Panasonic IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Panasonic Main Business and Markets Served
7.5.5 Panasonic Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech IC Packaging Substrate (SUB) Corporation Information
7.6.2 Simmtech IC Packaging Substrate (SUB) Product Portfolio
7.6.3 Simmtech IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Daeduck
7.7.1 Daeduck IC Packaging Substrate (SUB) Corporation Information
7.7.2 Daeduck IC Packaging Substrate (SUB) Product Portfolio
7.7.3 Daeduck IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Daeduck Main Business and Markets Served
7.7.5 Daeduck Recent Developments/Updates
7.8 ASE Material
7.8.1 ASE Material IC Packaging Substrate (SUB) Corporation Information
7.8.2 ASE Material IC Packaging Substrate (SUB) Product Portfolio
7.8.3 ASE Material IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.8.4 ASE Material Main Business and Markets Served
7.7.5 ASE Material Recent Developments/Updates
7.9 Kyocera
7.9.1 Kyocera IC Packaging Substrate (SUB) Corporation Information
7.9.2 Kyocera IC Packaging Substrate (SUB) Product Portfolio
7.9.3 Kyocera IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Kyocera Main Business and Markets Served
7.9.5 Kyocera Recent Developments/Updates
7.10 Ibiden
7.10.1 Ibiden IC Packaging Substrate (SUB) Corporation Information
7.10.2 Ibiden IC Packaging Substrate (SUB) Product Portfolio
7.10.3 Ibiden IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Ibiden Main Business and Markets Served
7.10.5 Ibiden Recent Developments/Updates
7.11 Shinko Electric Industries
7.11.1 Shinko Electric Industries IC Packaging Substrate (SUB) Corporation Information
7.11.2 Shinko Electric Industries IC Packaging Substrate (SUB) Product Portfolio
7.11.3 Shinko Electric Industries IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Shinko Electric Industries Main Business and Markets Served
7.11.5 Shinko Electric Industries Recent Developments/Updates
7.12 AT&S
7.12.1 AT&S IC Packaging Substrate (SUB) Corporation Information
7.12.2 AT&S IC Packaging Substrate (SUB) Product Portfolio
7.12.3 AT&S IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.12.4 AT&S Main Business and Markets Served
7.12.5 AT&S Recent Developments/Updates
7.13 LG InnoTek
7.13.1 LG InnoTek IC Packaging Substrate (SUB) Corporation Information
7.13.2 LG InnoTek IC Packaging Substrate (SUB) Product Portfolio
7.13.3 LG InnoTek IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.13.4 LG InnoTek Main Business and Markets Served
7.13.5 LG InnoTek Recent Developments/Updates
7.14 Fastprint Circuit Tech
7.14.1 Fastprint Circuit Tech IC Packaging Substrate (SUB) Corporation Information
7.14.2 Fastprint Circuit Tech IC Packaging Substrate (SUB) Product Portfolio
7.14.3 Fastprint Circuit Tech IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Fastprint Circuit Tech Main Business and Markets Served
7.14.5 Fastprint Circuit Tech Recent Developments/Updates
7.15 ACCESS
7.15.1 ACCESS IC Packaging Substrate (SUB) Corporation Information
7.15.2 ACCESS IC Packaging Substrate (SUB) Product Portfolio
7.15.3 ACCESS IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.15.4 ACCESS Main Business and Markets Served
7.15.5 ACCESS Recent Developments/Updates
7.16 Danbond Technology
7.16.1 Danbond Technology IC Packaging Substrate (SUB) Corporation Information
7.16.2 Danbond Technology IC Packaging Substrate (SUB) Product Portfolio
7.16.3 Danbond Technology IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Danbond Technology Main Business and Markets Served
7.16.5 Danbond Technology Recent Developments/Updates
7.17 TTM Technologies
7.17.1 TTM Technologies IC Packaging Substrate (SUB) Corporation Information
7.17.2 TTM Technologies IC Packaging Substrate (SUB) Product Portfolio
7.17.3 TTM Technologies IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.17.4 TTM Technologies Main Business and Markets Served
7.17.5 TTM Technologies Recent Developments/Updates
7.18 Unimicron
7.18.1 Unimicron IC Packaging Substrate (SUB) Corporation Information
7.18.2 Unimicron IC Packaging Substrate (SUB) Product Portfolio
7.18.3 Unimicron IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.18.4 Unimicron Main Business and Markets Served
7.18.5 Unimicron Recent Developments/Updates
7.19 Nan Ya PCB
7.19.1 Nan Ya PCB IC Packaging Substrate (SUB) Corporation Information
7.19.2 Nan Ya PCB IC Packaging Substrate (SUB) Product Portfolio
7.19.3 Nan Ya PCB IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.19.4 Nan Ya PCB Main Business and Markets Served
7.19.5 Nan Ya PCB Recent Developments/Updates
7.20 Kinsus
7.20.1 Kinsus IC Packaging Substrate (SUB) Corporation Information
7.20.2 Kinsus IC Packaging Substrate (SUB) Product Portfolio
7.20.3 Kinsus IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.20.4 Kinsus Main Business and Markets Served
7.20.5 Kinsus Recent Developments/Updates
7.21 SCC
7.21.1 SCC IC Packaging Substrate (SUB) Corporation Information
7.21.2 SCC IC Packaging Substrate (SUB) Product Portfolio
7.21.3 SCC IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2018-2023)
7.21.4 SCC Main Business and Markets Served
7.21.5 SCC Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging Substrate (SUB) Industry Chain Analysis
8.2 IC Packaging Substrate (SUB) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging Substrate (SUB) Production Mode & Process
8.4 IC Packaging Substrate (SUB) Sales and Marketing
8.4.1 IC Packaging Substrate (SUB) Sales Channels
8.4.2 IC Packaging Substrate (SUB) Distributors
8.5 IC Packaging Substrate (SUB) Customers
9 IC Packaging Substrate (SUB) Market Dynamics
9.1 IC Packaging Substrate (SUB) Industry Trends
9.2 IC Packaging Substrate (SUB) Market Drivers
9.3 IC Packaging Substrate (SUB) Market Challenges
9.4 IC Packaging Substrate (SUB) Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC

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