The global Integrated Circuit Assembly Packaging and Testing market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Integrated Circuit Assembly Packaging and Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Integrated Circuit Assembly Packaging and Testing.
Report Scope
The Integrated Circuit Assembly Packaging and Testing market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Integrated Circuit Assembly Packaging and Testing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Integrated Circuit Assembly Packaging and Testing companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Technology Holding
Silicon Precision
Powertech
KYEC
Qi Bang
Amkor
United Technologies
JCET Group
Tongfu Microelectronics
TSHT
Qizhong Technology
China Resources Packaging and Testing
UTAC Holdings
Nepes
Unisem
Siliconware Precision Industries
ITEQ Corporation
Chipbond Technology
LCSP
Segment by Type
Package
Testing
Other
Segment by Application
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Integrated Circuit Assembly Packaging and Testing companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Integrated Circuit Assembly Packaging and Testing Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Package
1.2.3 Testing
1.2.4 Other
1.3 Market by Application
1.3.1 Global Integrated Circuit Assembly Packaging and Testing Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Integrated Device Manufacturer (IDMs)
1.3.3 Outsourced Semiconductor Assembly and Test (OSAT)
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Integrated Circuit Assembly Packaging and Testing Market Perspective (2019-2030)
2.2 Integrated Circuit Assembly Packaging and Testing Growth Trends by Region
2.2.1 Global Integrated Circuit Assembly Packaging and Testing Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Integrated Circuit Assembly Packaging and Testing Historic Market Size by Region (2019-2024)
2.2.3 Integrated Circuit Assembly Packaging and Testing Forecasted Market Size by Region (2025-2030)
2.3 Integrated Circuit Assembly Packaging and Testing Market Dynamics
2.3.1 Integrated Circuit Assembly Packaging and Testing Industry Trends
2.3.2 Integrated Circuit Assembly Packaging and Testing Market Drivers
2.3.3 Integrated Circuit Assembly Packaging and Testing Market Challenges
2.3.4 Integrated Circuit Assembly Packaging and Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Integrated Circuit Assembly Packaging and Testing Players by Revenue
3.1.1 Global Top Integrated Circuit Assembly Packaging and Testing Players by Revenue (2019-2024)
3.1.2 Global Integrated Circuit Assembly Packaging and Testing Revenue Market Share by Players (2019-2024)
3.2 Global Integrated Circuit Assembly Packaging and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Integrated Circuit Assembly Packaging and Testing Revenue
3.4 Global Integrated Circuit Assembly Packaging and Testing Market Concentration Ratio
3.4.1 Global Integrated Circuit Assembly Packaging and Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Integrated Circuit Assembly Packaging and Testing Revenue in 2023
3.5 Integrated Circuit Assembly Packaging and Testing Key Players Head office and Area Served
3.6 Key Players Integrated Circuit Assembly Packaging and Testing Product Solution and Service
3.7 Date of Enter into Integrated Circuit Assembly Packaging and Testing Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Integrated Circuit Assembly Packaging and Testing Breakdown Data by Type
4.1 Global Integrated Circuit Assembly Packaging and Testing Historic Market Size by Type (2019-2024)
4.2 Global Integrated Circuit Assembly Packaging and Testing Forecasted Market Size by Type (2025-2030)
5 Integrated Circuit Assembly Packaging and Testing Breakdown Data by Application
5.1 Global Integrated Circuit Assembly Packaging and Testing Historic Market Size by Application (2019-2024)
5.2 Global Integrated Circuit Assembly Packaging and Testing Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Integrated Circuit Assembly Packaging and Testing Market Size (2019-2030)
6.2 North America Integrated Circuit Assembly Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Integrated Circuit Assembly Packaging and Testing Market Size by Country (2019-2024)
6.4 North America Integrated Circuit Assembly Packaging and Testing Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Integrated Circuit Assembly Packaging and Testing Market Size (2019-2030)
7.2 Europe Integrated Circuit Assembly Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Integrated Circuit Assembly Packaging and Testing Market Size by Country (2019-2024)
7.4 Europe Integrated Circuit Assembly Packaging and Testing Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Integrated Circuit Assembly Packaging and Testing Market Size (2019-2030)
8.2 Asia-Pacific Integrated Circuit Assembly Packaging and Testing Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Integrated Circuit Assembly Packaging and Testing Market Size by Region (2019-2024)
8.4 Asia-Pacific Integrated Circuit Assembly Packaging and Testing Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Integrated Circuit Assembly Packaging and Testing Market Size (2019-2030)
9.2 Latin America Integrated Circuit Assembly Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Integrated Circuit Assembly Packaging and Testing Market Size by Country (2019-2024)
9.4 Latin America Integrated Circuit Assembly Packaging and Testing Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Integrated Circuit Assembly Packaging and Testing Market Size (2019-2030)
10.2 Middle East & Africa Integrated Circuit Assembly Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Integrated Circuit Assembly Packaging and Testing Market Size by Country (2019-2024)
10.4 Middle East & Africa Integrated Circuit Assembly Packaging and Testing Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Technology Holding
11.1.1 ASE Technology Holding Company Detail
11.1.2 ASE Technology Holding Business Overview
11.1.3 ASE Technology Holding Integrated Circuit Assembly Packaging and Testing Introduction
11.1.4 ASE Technology Holding Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.1.5 ASE Technology Holding Recent Development
11.2 Silicon Precision
11.2.1 Silicon Precision Company Detail
11.2.2 Silicon Precision Business Overview
11.2.3 Silicon Precision Integrated Circuit Assembly Packaging and Testing Introduction
11.2.4 Silicon Precision Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.2.5 Silicon Precision Recent Development
11.3 Powertech
11.3.1 Powertech Company Detail
11.3.2 Powertech Business Overview
11.3.3 Powertech Integrated Circuit Assembly Packaging and Testing Introduction
11.3.4 Powertech Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.3.5 Powertech Recent Development
11.4 KYEC
11.4.1 KYEC Company Detail
11.4.2 KYEC Business Overview
11.4.3 KYEC Integrated Circuit Assembly Packaging and Testing Introduction
11.4.4 KYEC Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.4.5 KYEC Recent Development
11.5 Qi Bang
11.5.1 Qi Bang Company Detail
11.5.2 Qi Bang Business Overview
11.5.3 Qi Bang Integrated Circuit Assembly Packaging and Testing Introduction
11.5.4 Qi Bang Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.5.5 Qi Bang Recent Development
11.6 Amkor
11.6.1 Amkor Company Detail
11.6.2 Amkor Business Overview
11.6.3 Amkor Integrated Circuit Assembly Packaging and Testing Introduction
11.6.4 Amkor Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.6.5 Amkor Recent Development
11.7 United Technologies
11.7.1 United Technologies Company Detail
11.7.2 United Technologies Business Overview
11.7.3 United Technologies Integrated Circuit Assembly Packaging and Testing Introduction
11.7.4 United Technologies Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.7.5 United Technologies Recent Development
11.8 JCET Group
11.8.1 JCET Group Company Detail
11.8.2 JCET Group Business Overview
11.8.3 JCET Group Integrated Circuit Assembly Packaging and Testing Introduction
11.8.4 JCET Group Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.8.5 JCET Group Recent Development
11.9 Tongfu Microelectronics
11.9.1 Tongfu Microelectronics Company Detail
11.9.2 Tongfu Microelectronics Business Overview
11.9.3 Tongfu Microelectronics Integrated Circuit Assembly Packaging and Testing Introduction
11.9.4 Tongfu Microelectronics Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.9.5 Tongfu Microelectronics Recent Development
11.10 TSHT
11.10.1 TSHT Company Detail
11.10.2 TSHT Business Overview
11.10.3 TSHT Integrated Circuit Assembly Packaging and Testing Introduction
11.10.4 TSHT Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.10.5 TSHT Recent Development
11.11 Qizhong Technology
11.11.1 Qizhong Technology Company Detail
11.11.2 Qizhong Technology Business Overview
11.11.3 Qizhong Technology Integrated Circuit Assembly Packaging and Testing Introduction
11.11.4 Qizhong Technology Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.11.5 Qizhong Technology Recent Development
11.12 China Resources Packaging and Testing
11.12.1 China Resources Packaging and Testing Company Detail
11.12.2 China Resources Packaging and Testing Business Overview
11.12.3 China Resources Packaging and Testing Integrated Circuit Assembly Packaging and Testing Introduction
11.12.4 China Resources Packaging and Testing Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.12.5 China Resources Packaging and Testing Recent Development
11.13 UTAC Holdings
11.13.1 UTAC Holdings Company Detail
11.13.2 UTAC Holdings Business Overview
11.13.3 UTAC Holdings Integrated Circuit Assembly Packaging and Testing Introduction
11.13.4 UTAC Holdings Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.13.5 UTAC Holdings Recent Development
11.14 Nepes
11.14.1 Nepes Company Detail
11.14.2 Nepes Business Overview
11.14.3 Nepes Integrated Circuit Assembly Packaging and Testing Introduction
11.14.4 Nepes Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.14.5 Nepes Recent Development
11.15 Unisem
11.15.1 Unisem Company Detail
11.15.2 Unisem Business Overview
11.15.3 Unisem Integrated Circuit Assembly Packaging and Testing Introduction
11.15.4 Unisem Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.15.5 Unisem Recent Development
11.16 Siliconware Precision Industries
11.16.1 Siliconware Precision Industries Company Detail
11.16.2 Siliconware Precision Industries Business Overview
11.16.3 Siliconware Precision Industries Integrated Circuit Assembly Packaging and Testing Introduction
11.16.4 Siliconware Precision Industries Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.16.5 Siliconware Precision Industries Recent Development
11.17 ITEQ Corporation
11.17.1 ITEQ Corporation Company Detail
11.17.2 ITEQ Corporation Business Overview
11.17.3 ITEQ Corporation Integrated Circuit Assembly Packaging and Testing Introduction
11.17.4 ITEQ Corporation Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.17.5 ITEQ Corporation Recent Development
11.18 Chipbond Technology
11.18.1 Chipbond Technology Company Detail
11.18.2 Chipbond Technology Business Overview
11.18.3 Chipbond Technology Integrated Circuit Assembly Packaging and Testing Introduction
11.18.4 Chipbond Technology Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.18.5 Chipbond Technology Recent Development
11.19 LCSP
11.19.1 LCSP Company Detail
11.19.2 LCSP Business Overview
11.19.3 LCSP Integrated Circuit Assembly Packaging and Testing Introduction
11.19.4 LCSP Revenue in Integrated Circuit Assembly Packaging and Testing Business (2019-2024)
11.19.5 LCSP Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
ASE Technology Holding
Silicon Precision
Powertech
KYEC
Qi Bang
Amkor
United Technologies
JCET Group
Tongfu Microelectronics
TSHT
Qizhong Technology
China Resources Packaging and Testing
UTAC Holdings
Nepes
Unisem
Siliconware Precision Industries
ITEQ Corporation
Chipbond Technology
LCSP
听
听
*If Applicable.
