A process wherein a semiconductor chip is packaged in a form suitable for the electronic device.
Semiconductor packaging is a process of protecting the chip from the external environment, and electrically packaging it to connect the terminals. The integrated circuit (IC) is a component of circuit boards and electronic devices. ICs need to be electrically packaged in a form fitting to where they鈥檙e installed. They are responsible for interconnects, supplying electrical power, and heat dissipation. Packaging also protects the semiconductor chips, shielding the integrated circuits from external factors such as high temperatures, impurities, and physical impact. Each chip is tested to verify normal operation after the packaging process has been completed. This testing is called the package test. The package test is conducted on finished chip products. Chips are placed in a testing apparatus and tested under various conditions to sort out defective products.
The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing. According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.
This report studies the Integrated Circuits (IC) Packaging and Testing Service.
The key IDMs include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi; and the key OSATs include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation and ChipMOS TECHNOLOGIES, etc.
The global Integrated Circuits (IC) Packaging & Testing market was valued at US$ 89440 million in 2023 and is anticipated to reach US$ 125970 million by 2030, witnessing a CAGR of 5.1% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.27% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Integrated Circuits (IC) Packaging & Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Integrated Circuits (IC) Packaging & Testing.
The Integrated Circuits (IC) Packaging & Testing market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Integrated Circuits (IC) Packaging & Testing market comprehensively. Regional market sizes, concerning products by Business Model, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Integrated Circuits (IC) Packaging & Testing companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Business Model, by Application, and by regions.
Market Segmentation
By Company
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Western Digital
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas
Microchip Technology
Onsemi
Sony Semiconductor Solutions Corporation
Panasonic
Winbond
Nanya Technology
ISSI (Integrated Silicon Solution Inc.)
Macronix
Giantec Semiconductor
Sharp
Magnachip
Toshiba
JS Foundry KK.
Hitachi
Murata
Skyworks Solutions Inc
Wolfspeed
Littelfuse
Diodes Incorporated
Rohm
Fuji Electric
Vishay Intertechnology
Mitsubishi Electric
Nexperia
Ampleon
CR Micro
Hangzhou Silan Integrated Circuit
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
Carsem
King Yuan Electronics Corp. (KYEC)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor锛圚efei锛塁o., Ltd.
Hefei Chipmore Technology Co.,Ltd.
HT-tech
Chippacking
Segment by Business Model
IDM
OSAT
Segment by Application
Analog IC Packaging & Testing
MPU & MCUs IC Packaging & Testing
Logic IC Packaging & Testing
Memory IC Packaging & Testing
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Business Model, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Integrated Circuits (IC) Packaging & Testing company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Business Model, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Business Model
1.2.1 Global Integrated Circuits (IC) Packaging & Testing Market Size Growth Rate by Business Model: 2019 VS 2023 VS 2030
1.2.2 IDM
1.2.3 OSAT
1.3 Market by Application
1.3.1 Global Integrated Circuits (IC) Packaging & Testing Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Analog IC Packaging & Testing
1.3.3 MPU & MCUs IC Packaging & Testing
1.3.4 Logic IC Packaging & Testing
1.3.5 Memory IC Packaging & Testing
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Integrated Circuits (IC) Packaging & Testing Market Perspective (2019-2030)
2.2 Global Integrated Circuits (IC) Packaging & Testing Growth Trends by Region
2.2.1 Global Integrated Circuits (IC) Packaging & Testing Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Integrated Circuits (IC) Packaging & Testing Historic Market Size by Region (2019-2024)
2.2.3 Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Region (2025-2030)
2.3 Integrated Circuits (IC) Packaging & Testing Market Dynamics
2.3.1 Integrated Circuits (IC) Packaging & Testing Industry Trends
2.3.2 Integrated Circuits (IC) Packaging & Testing Market Drivers
2.3.3 Integrated Circuits (IC) Packaging & Testing Market Challenges
2.3.4 Integrated Circuits (IC) Packaging & Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Integrated Circuits (IC) Packaging & Testing Players by Revenue
3.1.1 Global Top Integrated Circuits (IC) Packaging & Testing Players by Revenue (2019-2024)
3.1.2 Global Integrated Circuits (IC) Packaging & Testing Revenue Market Share by Players (2019-2024)
3.2 Global Integrated Circuits (IC) Packaging & Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Integrated Circuits (IC) Packaging & Testing Revenue
3.4 Global Integrated Circuits (IC) Packaging & Testing Market Concentration Ratio
3.4.1 Global Integrated Circuits (IC) Packaging & Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Integrated Circuits (IC) Packaging & Testing Revenue in 2023
3.5 Global Key Players of Integrated Circuits (IC) Packaging & Testing Head office and Area Served
3.6 Global Key Players of Integrated Circuits (IC) Packaging & Testing, Product and Application
3.7 Global Key Players of Integrated Circuits (IC) Packaging & Testing, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Integrated Circuits (IC) Packaging & Testing Breakdown Data by Business Model
4.1 Global Integrated Circuits (IC) Packaging & Testing Historic Market Size by Business Model (2019-2024)
4.2 Global Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Business Model (2025-2030)
5 Integrated Circuits (IC) Packaging & Testing Breakdown Data by Application
5.1 Global Integrated Circuits (IC) Packaging & Testing Historic Market Size by Application (2019-2024)
5.2 Global Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)
6.2 North America Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024)
6.4 North America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)
7.2 Europe Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024)
7.4 Europe Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)
8.2 Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size by Region (2019-2024)
8.4 Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)
9.2 Latin America Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024)
9.4 Latin America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)
10.2 Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024)
10.4 Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Samsung
11.1.1 Samsung Company Details
11.1.2 Samsung Business Overview
11.1.3 Samsung Integrated Circuits (IC) Packaging & Testing Introduction
11.1.4 Samsung Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.1.5 Samsung Recent Development
11.2 Intel
11.2.1 Intel Company Details
11.2.2 Intel Business Overview
11.2.3 Intel Integrated Circuits (IC) Packaging & Testing Introduction
11.2.4 Intel Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.2.5 Intel Recent Development
11.3 SK Hynix
11.3.1 SK Hynix Company Details
11.3.2 SK Hynix Business Overview
11.3.3 SK Hynix Integrated Circuits (IC) Packaging & Testing Introduction
11.3.4 SK Hynix Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.3.5 SK Hynix Recent Development
11.4 Micron Technology
11.4.1 Micron Technology Company Details
11.4.2 Micron Technology Business Overview
11.4.3 Micron Technology Integrated Circuits (IC) Packaging & Testing Introduction
11.4.4 Micron Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.4.5 Micron Technology Recent Development
11.5 Texas Instruments (TI)
11.5.1 Texas Instruments (TI) Company Details
11.5.2 Texas Instruments (TI) Business Overview
11.5.3 Texas Instruments (TI) Integrated Circuits (IC) Packaging & Testing Introduction
11.5.4 Texas Instruments (TI) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.5.5 Texas Instruments (TI) Recent Development
11.6 STMicroelectronics
11.6.1 STMicroelectronics Company Details
11.6.2 STMicroelectronics Business Overview
11.6.3 STMicroelectronics Integrated Circuits (IC) Packaging & Testing Introduction
11.6.4 STMicroelectronics Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.6.5 STMicroelectronics Recent Development
11.7 Kioxia
11.7.1 Kioxia Company Details
11.7.2 Kioxia Business Overview
11.7.3 Kioxia Integrated Circuits (IC) Packaging & Testing Introduction
11.7.4 Kioxia Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.7.5 Kioxia Recent Development
11.8 Western Digital
11.8.1 Western Digital Company Details
11.8.2 Western Digital Business Overview
11.8.3 Western Digital Integrated Circuits (IC) Packaging & Testing Introduction
11.8.4 Western Digital Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.8.5 Western Digital Recent Development
11.9 Infineon
11.9.1 Infineon Company Details
11.9.2 Infineon Business Overview
11.9.3 Infineon Integrated Circuits (IC) Packaging & Testing Introduction
11.9.4 Infineon Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.9.5 Infineon Recent Development
11.10 NXP
11.10.1 NXP Company Details
11.10.2 NXP Business Overview
11.10.3 NXP Integrated Circuits (IC) Packaging & Testing Introduction
11.10.4 NXP Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.10.5 NXP Recent Development
11.11 Analog Devices, Inc. (ADI)
11.11.1 Analog Devices, Inc. (ADI) Company Details
11.11.2 Analog Devices, Inc. (ADI) Business Overview
11.11.3 Analog Devices, Inc. (ADI) Integrated Circuits (IC) Packaging & Testing Introduction
11.11.4 Analog Devices, Inc. (ADI) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.11.5 Analog Devices, Inc. (ADI) Recent Development
11.12 Renesas
11.12.1 Renesas Company Details
11.12.2 Renesas Business Overview
11.12.3 Renesas Integrated Circuits (IC) Packaging & Testing Introduction
11.12.4 Renesas Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.12.5 Renesas Recent Development
11.13 Microchip Technology
11.13.1 Microchip Technology Company Details
11.13.2 Microchip Technology Business Overview
11.13.3 Microchip Technology Integrated Circuits (IC) Packaging & Testing Introduction
11.13.4 Microchip Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.13.5 Microchip Technology Recent Development
11.14 Onsemi
11.14.1 Onsemi Company Details
11.14.2 Onsemi Business Overview
11.14.3 Onsemi Integrated Circuits (IC) Packaging & Testing Introduction
11.14.4 Onsemi Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.14.5 Onsemi Recent Development
11.15 Sony Semiconductor Solutions Corporation
11.15.1 Sony Semiconductor Solutions Corporation Company Details
11.15.2 Sony Semiconductor Solutions Corporation Business Overview
11.15.3 Sony Semiconductor Solutions Corporation Integrated Circuits (IC) Packaging & Testing Introduction
11.15.4 Sony Semiconductor Solutions Corporation Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.15.5 Sony Semiconductor Solutions Corporation Recent Development
11.16 Panasonic
11.16.1 Panasonic Company Details
11.16.2 Panasonic Business Overview
11.16.3 Panasonic Integrated Circuits (IC) Packaging & Testing Introduction
11.16.4 Panasonic Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.16.5 Panasonic Recent Development
11.17 Winbond
11.17.1 Winbond Company Details
11.17.2 Winbond Business Overview
11.17.3 Winbond Integrated Circuits (IC) Packaging & Testing Introduction
11.17.4 Winbond Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.17.5 Winbond Recent Development
11.18 Nanya Technology
11.18.1 Nanya Technology Company Details
11.18.2 Nanya Technology Business Overview
11.18.3 Nanya Technology Integrated Circuits (IC) Packaging & Testing Introduction
11.18.4 Nanya Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.18.5 Nanya Technology Recent Development
11.19 ISSI (Integrated Silicon Solution Inc.)
11.19.1 ISSI (Integrated Silicon Solution Inc.) Company Details
11.19.2 ISSI (Integrated Silicon Solution Inc.) Business Overview
11.19.3 ISSI (Integrated Silicon Solution Inc.) Integrated Circuits (IC) Packaging & Testing Introduction
11.19.4 ISSI (Integrated Silicon Solution Inc.) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.19.5 ISSI (Integrated Silicon Solution Inc.) Recent Development
11.20 Macronix
11.20.1 Macronix Company Details
11.20.2 Macronix Business Overview
11.20.3 Macronix Integrated Circuits (IC) Packaging & Testing Introduction
11.20.4 Macronix Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.20.5 Macronix Recent Development
11.21 Giantec Semiconductor
11.21.1 Giantec Semiconductor Company Details
11.21.2 Giantec Semiconductor Business Overview
11.21.3 Giantec Semiconductor Integrated Circuits (IC) Packaging & Testing Introduction
11.21.4 Giantec Semiconductor Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.21.5 Giantec Semiconductor Recent Development
11.22 Sharp
11.22.1 Sharp Company Details
11.22.2 Sharp Business Overview
11.22.3 Sharp Integrated Circuits (IC) Packaging & Testing Introduction
11.22.4 Sharp Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.22.5 Sharp Recent Development
11.23 Magnachip
11.23.1 Magnachip Company Details
11.23.2 Magnachip Business Overview
11.23.3 Magnachip Integrated Circuits (IC) Packaging & Testing Introduction
11.23.4 Magnachip Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.23.5 Magnachip Recent Development
11.24 Toshiba
11.24.1 Toshiba Company Details
11.24.2 Toshiba Business Overview
11.24.3 Toshiba Integrated Circuits (IC) Packaging & Testing Introduction
11.24.4 Toshiba Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.24.5 Toshiba Recent Development
11.25 JS Foundry KK.
11.25.1 JS Foundry KK. Company Details
11.25.2 JS Foundry KK. Business Overview
11.25.3 JS Foundry KK. Integrated Circuits (IC) Packaging & Testing Introduction
11.25.4 JS Foundry KK. Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.25.5 JS Foundry KK. Recent Development
11.26 Hitachi
11.26.1 Hitachi Company Details
11.26.2 Hitachi Business Overview
11.26.3 Hitachi Integrated Circuits (IC) Packaging & Testing Introduction
11.26.4 Hitachi Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.26.5 Hitachi Recent Development
11.27 Murata
11.27.1 Murata Company Details
11.27.2 Murata Business Overview
11.27.3 Murata Integrated Circuits (IC) Packaging & Testing Introduction
11.27.4 Murata Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.27.5 Murata Recent Development
11.28 Skyworks Solutions Inc
11.28.1 Skyworks Solutions Inc Company Details
11.28.2 Skyworks Solutions Inc Business Overview
11.28.3 Skyworks Solutions Inc Integrated Circuits (IC) Packaging & Testing Introduction
11.28.4 Skyworks Solutions Inc Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.28.5 Skyworks Solutions Inc Recent Development
11.29 Wolfspeed
11.29.1 Wolfspeed Company Details
11.29.2 Wolfspeed Business Overview
11.29.3 Wolfspeed Integrated Circuits (IC) Packaging & Testing Introduction
11.29.4 Wolfspeed Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.29.5 Wolfspeed Recent Development
11.30 Littelfuse
11.30.1 Littelfuse Company Details
11.30.2 Littelfuse Business Overview
11.30.3 Littelfuse Integrated Circuits (IC) Packaging & Testing Introduction
11.30.4 Littelfuse Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.30.5 Littelfuse Recent Development
11.31 Diodes Incorporated
11.31.1 Diodes Incorporated Company Details
11.31.2 Diodes Incorporated Business Overview
11.31.3 Diodes Incorporated Integrated Circuits (IC) Packaging & Testing Introduction
11.31.4 Diodes Incorporated Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.31.5 Diodes Incorporated Recent Development
11.32 Rohm
11.32.1 Rohm Company Details
11.32.2 Rohm Business Overview
11.32.3 Rohm Integrated Circuits (IC) Packaging & Testing Introduction
11.32.4 Rohm Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.32.5 Rohm Recent Development
11.33 Fuji Electric
11.33.1 Fuji Electric Company Details
11.33.2 Fuji Electric Business Overview
11.33.3 Fuji Electric Integrated Circuits (IC) Packaging & Testing Introduction
11.33.4 Fuji Electric Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.33.5 Fuji Electric Recent Development
11.34 Vishay Intertechnology
11.34.1 Vishay Intertechnology Company Details
11.34.2 Vishay Intertechnology Business Overview
11.34.3 Vishay Intertechnology Integrated Circuits (IC) Packaging & Testing Introduction
11.34.4 Vishay Intertechnology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.34.5 Vishay Intertechnology Recent Development
11.35 Mitsubishi Electric
11.35.1 Mitsubishi Electric Company Details
11.35.2 Mitsubishi Electric Business Overview
11.35.3 Mitsubishi Electric Integrated Circuits (IC) Packaging & Testing Introduction
11.35.4 Mitsubishi Electric Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.35.5 Mitsubishi Electric Recent Development
11.36 Nexperia
11.36.1 Nexperia Company Details
11.36.2 Nexperia Business Overview
11.36.3 Nexperia Integrated Circuits (IC) Packaging & Testing Introduction
11.36.4 Nexperia Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.36.5 Nexperia Recent Development
11.37 Ampleon
11.37.1 Ampleon Company Details
11.37.2 Ampleon Business Overview
11.37.3 Ampleon Integrated Circuits (IC) Packaging & Testing Introduction
11.37.4 Ampleon Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.37.5 Ampleon Recent Development
11.38 CR Micro
11.38.1 CR Micro Company Details
11.38.2 CR Micro Business Overview
11.38.3 CR Micro Integrated Circuits (IC) Packaging & Testing Introduction
11.38.4 CR Micro Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.38.5 CR Micro Recent Development
11.39 Hangzhou Silan Integrated Circuit
11.39.1 Hangzhou Silan Integrated Circuit Company Details
11.39.2 Hangzhou Silan Integrated Circuit Business Overview
11.39.3 Hangzhou Silan Integrated Circuit Integrated Circuits (IC) Packaging & Testing Introduction
11.39.4 Hangzhou Silan Integrated Circuit Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.39.5 Hangzhou Silan Integrated Circuit Recent Development
11.40 ASE (SPIL)
11.40.1 ASE (SPIL) Company Details
11.40.2 ASE (SPIL) Business Overview
11.40.3 ASE (SPIL) Integrated Circuits (IC) Packaging & Testing Introduction
11.40.4 ASE (SPIL) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)
11.40.5 ASE (SPIL) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Western Digital
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas
Microchip Technology
Onsemi
Sony Semiconductor Solutions Corporation
Panasonic
Winbond
Nanya Technology
ISSI (Integrated Silicon Solution Inc.)
Macronix
Giantec Semiconductor
Sharp
Magnachip
Toshiba
JS Foundry KK.
Hitachi
Murata
Skyworks Solutions Inc
Wolfspeed
Littelfuse
Diodes Incorporated
Rohm
Fuji Electric
Vishay Intertechnology
Mitsubishi Electric
Nexperia
Ampleon
CR Micro
Hangzhou Silan Integrated Circuit
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
Carsem
King Yuan Electronics Corp. (KYEC)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor锛圚efei锛塁o., Ltd.
Hefei Chipmore Technology Co.,Ltd.
HT-tech
Chippacking
听
听
*If Applicable.
