IC substrate is the core material of the packaging link and has a high technical threshold. IC substrate directly loads the chip, provides an electronic connection between the chip and the PCB motherboard, plays the role of "connecting the above and the next", and is a necessary core material in IC packaging technology. With the development of semiconductor technology, the characteristic size of IC continues to shrink, and the integration continues to improve. The corresponding IC package towards super multi-pin, narrow pitch, ultra-miniaturization direction in high-level packaging, IC substrate has replaced the traditional lead frame, becoming an indispensable part of the IC package. Memory chip packaging substrate is mainly used for smartphone and tablet computer storage modules and solid state disks.
The global Memory Chip Packaging Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Memory Chip Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Memory Chip Packaging Substrate.
The Memory Chip Packaging Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Memory Chip Packaging Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Memory Chip Packaging Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung Electro-Mechanics
Simmtech
Daeduck
Korea Circuit
Ibiden
Kyocera
ASE Group
Shinko
Fujitsu Global
Doosan Electronic
Toppan Printing
Unimicron
Kinsus
Nanya
Fastprint Circuit
Shennan Circuits
by Type
WB BGA
WB-CSP
Others
by Application
Flash Drive
Solid State Storage
Embedded Storage
Volatile Storage
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Memory Chip Packaging Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Memory Chip Packaging Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Memory Chip Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Memory Chip Packaging Substrate Market Overview
1.1 Product Definition
1.2 Memory Chip Packaging Substrate by Type
1.2.1 Global Memory Chip Packaging Substrate Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 WB BGA
1.2.3 WB-CSP
1.2.4 Others
1.3 Memory Chip Packaging Substrate by Application
1.3.1 Global Memory Chip Packaging Substrate Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Flash Drive
1.3.3 Solid State Storage
1.3.4 Embedded Storage
1.3.5 Volatile Storage
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Memory Chip Packaging Substrate Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Memory Chip Packaging Substrate Production Estimates and Forecasts (2019-2030)
1.4.4 Global Memory Chip Packaging Substrate Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Memory Chip Packaging Substrate Production Market Share by Manufacturers (2019-2024)
2.2 Global Memory Chip Packaging Substrate Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Memory Chip Packaging Substrate, Industry Ranking, 2022 VS 2023
2.4 Global Memory Chip Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Memory Chip Packaging Substrate Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Memory Chip Packaging Substrate, Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Memory Chip Packaging Substrate, Product Type & Application
2.8 Global Key Manufacturers of Memory Chip Packaging Substrate, Date of Enter into This Industry
2.9 Global Memory Chip Packaging Substrate Market Competitive Situation and Trends
2.9.1 Global Memory Chip Packaging Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Memory Chip Packaging Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Memory Chip Packaging Substrate Production by Region
3.1 Global Memory Chip Packaging Substrate Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Memory Chip Packaging Substrate Production Value by Region (2019-2030)
3.2.1 Global Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Memory Chip Packaging Substrate by Region (2025-2030)
3.3 Global Memory Chip Packaging Substrate Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Memory Chip Packaging Substrate Production by Region (2019-2030)
3.4.1 Global Memory Chip Packaging Substrate Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Memory Chip Packaging Substrate by Region (2025-2030)
3.5 Global Memory Chip Packaging Substrate Market Price Analysis by Region (2019-2024)
3.6 Global Memory Chip Packaging Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
4 Memory Chip Packaging Substrate Consumption by Region
4.1 Global Memory Chip Packaging Substrate Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.2.1 Global Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.2.2 Global Memory Chip Packaging Substrate Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Memory Chip Packaging Substrate Production by Type (2019-2030)
5.1.1 Global Memory Chip Packaging Substrate Production by Type (2019-2024)
5.1.2 Global Memory Chip Packaging Substrate Production by Type (2025-2030)
5.1.3 Global Memory Chip Packaging Substrate Production Market Share by Type (2019-2030)
5.2 Global Memory Chip Packaging Substrate Production Value by Type (2019-2030)
5.2.1 Global Memory Chip Packaging Substrate Production Value by Type (2019-2024)
5.2.2 Global Memory Chip Packaging Substrate Production Value by Type (2025-2030)
5.2.3 Global Memory Chip Packaging Substrate Production Value Market Share by Type (2019-2030)
5.3 Global Memory Chip Packaging Substrate Price by Type (2019-2030)
6 Segment by Application
6.1 Global Memory Chip Packaging Substrate Production by Application (2019-2030)
6.1.1 Global Memory Chip Packaging Substrate Production by Application (2019-2024)
6.1.2 Global Memory Chip Packaging Substrate Production by Application (2025-2030)
6.1.3 Global Memory Chip Packaging Substrate Production Market Share by Application (2019-2030)
6.2 Global Memory Chip Packaging Substrate Production Value by Application (2019-2030)
6.2.1 Global Memory Chip Packaging Substrate Production Value by Application (2019-2024)
6.2.2 Global Memory Chip Packaging Substrate Production Value by Application (2025-2030)
6.2.3 Global Memory Chip Packaging Substrate Production Value Market Share by Application (2019-2030)
6.3 Global Memory Chip Packaging Substrate Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Samsung Electro-Mechanics
7.1.1 Samsung Electro-Mechanics Memory Chip Packaging Substrate Company Information
7.1.2 Samsung Electro-Mechanics Memory Chip Packaging Substrate Product Portfolio
7.1.3 Samsung Electro-Mechanics Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Samsung Electro-Mechanics Main Business and Markets Served
7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
7.2 Simmtech
7.2.1 Simmtech Memory Chip Packaging Substrate Company Information
7.2.2 Simmtech Memory Chip Packaging Substrate Product Portfolio
7.2.3 Simmtech Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Simmtech Main Business and Markets Served
7.2.5 Simmtech Recent Developments/Updates
7.3 Daeduck
7.3.1 Daeduck Memory Chip Packaging Substrate Company Information
7.3.2 Daeduck Memory Chip Packaging Substrate Product Portfolio
7.3.3 Daeduck Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Daeduck Main Business and Markets Served
7.3.5 Daeduck Recent Developments/Updates
7.4 Korea Circuit
7.4.1 Korea Circuit Memory Chip Packaging Substrate Company Information
7.4.2 Korea Circuit Memory Chip Packaging Substrate Product Portfolio
7.4.3 Korea Circuit Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Korea Circuit Main Business and Markets Served
7.4.5 Korea Circuit Recent Developments/Updates
7.5 Ibiden
7.5.1 Ibiden Memory Chip Packaging Substrate Company Information
7.5.2 Ibiden Memory Chip Packaging Substrate Product Portfolio
7.5.3 Ibiden Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Ibiden Main Business and Markets Served
7.5.5 Ibiden Recent Developments/Updates
7.6 Kyocera
7.6.1 Kyocera Memory Chip Packaging Substrate Company Information
7.6.2 Kyocera Memory Chip Packaging Substrate Product Portfolio
7.6.3 Kyocera Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Kyocera Main Business and Markets Served
7.6.5 Kyocera Recent Developments/Updates
7.7 ASE Group
7.7.1 ASE Group Memory Chip Packaging Substrate Company Information
7.7.2 ASE Group Memory Chip Packaging Substrate Product Portfolio
7.7.3 ASE Group Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.7.4 ASE Group Main Business and Markets Served
7.7.5 ASE Group Recent Developments/Updates
7.8 Shinko
7.8.1 Shinko Memory Chip Packaging Substrate Company Information
7.8.2 Shinko Memory Chip Packaging Substrate Product Portfolio
7.8.3 Shinko Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Shinko Main Business and Markets Served
7.8.5 Shinko Recent Developments/Updates
7.9 Fujitsu Global
7.9.1 Fujitsu Global Memory Chip Packaging Substrate Company Information
7.9.2 Fujitsu Global Memory Chip Packaging Substrate Product Portfolio
7.9.3 Fujitsu Global Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Fujitsu Global Main Business and Markets Served
7.9.5 Fujitsu Global Recent Developments/Updates
7.10 Doosan Electronic
7.10.1 Doosan Electronic Memory Chip Packaging Substrate Company Information
7.10.2 Doosan Electronic Memory Chip Packaging Substrate Product Portfolio
7.10.3 Doosan Electronic Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Doosan Electronic Main Business and Markets Served
7.10.5 Doosan Electronic Recent Developments/Updates
7.11 Toppan Printing
7.11.1 Toppan Printing Memory Chip Packaging Substrate Company Information
7.11.2 Toppan Printing Memory Chip Packaging Substrate Product Portfolio
7.11.3 Toppan Printing Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Toppan Printing Main Business and Markets Served
7.11.5 Toppan Printing Recent Developments/Updates
7.12 Unimicron
7.12.1 Unimicron Memory Chip Packaging Substrate Company Information
7.12.2 Unimicron Memory Chip Packaging Substrate Product Portfolio
7.12.3 Unimicron Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Unimicron Main Business and Markets Served
7.12.5 Unimicron Recent Developments/Updates
7.13 Kinsus
7.13.1 Kinsus Memory Chip Packaging Substrate Company Information
7.13.2 Kinsus Memory Chip Packaging Substrate Product Portfolio
7.13.3 Kinsus Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Kinsus Main Business and Markets Served
7.13.5 Kinsus Recent Developments/Updates
7.14 Nanya
7.14.1 Nanya Memory Chip Packaging Substrate Company Information
7.14.2 Nanya Memory Chip Packaging Substrate Product Portfolio
7.14.3 Nanya Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Nanya Main Business and Markets Served
7.14.5 Nanya Recent Developments/Updates
7.15 Fastprint Circuit
7.15.1 Fastprint Circuit Memory Chip Packaging Substrate Company Information
7.15.2 Fastprint Circuit Memory Chip Packaging Substrate Product Portfolio
7.15.3 Fastprint Circuit Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.15.4 Fastprint Circuit Main Business and Markets Served
7.15.5 Fastprint Circuit Recent Developments/Updates
7.16 Shennan Circuits
7.16.1 Shennan Circuits Memory Chip Packaging Substrate Company Information
7.16.2 Shennan Circuits Memory Chip Packaging Substrate Product Portfolio
7.16.3 Shennan Circuits Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.16.4 Shennan Circuits Main Business and Markets Served
7.16.5 Shennan Circuits Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Memory Chip Packaging Substrate Industry Chain Analysis
8.2 Memory Chip Packaging Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Memory Chip Packaging Substrate Production Mode & Process
8.4 Memory Chip Packaging Substrate Sales and Marketing
8.4.1 Memory Chip Packaging Substrate Sales Channels
8.4.2 Memory Chip Packaging Substrate Distributors
8.5 Memory Chip Packaging Substrate Customers
9 Memory Chip Packaging Substrate Market Dynamics
9.1 Memory Chip Packaging Substrate Industry Trends
9.2 Memory Chip Packaging Substrate Market Drivers
9.3 Memory Chip Packaging Substrate Market Challenges
9.4 Memory Chip Packaging Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Samsung Electro-Mechanics
Simmtech
Daeduck
Korea Circuit
Ibiden
Kyocera
ASE Group
Shinko
Fujitsu Global
Doosan Electronic
Toppan Printing
Unimicron
Kinsus
Nanya
Fastprint Circuit
Shennan Circuits
听
听
*If Applicable.
