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Packaging is an essential part of semiconductor manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. The package is the container that holds the semiconductor die. The packaging may be done by a separate vendor, the OSAT, although foundries are expanding their packaging efforts. The package protects the die, connects the chip to a board or other chips, and may dissipate heat. This report focuses on Memory Semiconductor Packaging market.
The global Memory Semiconductor Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Since the outbreak of the epidemic in 2020, remote office, online education, streaming media and other applications have triggered an increase in demand for consumer electronics and cloud services, and the global Digital transformation has accelerated. At the same time, the semiconductor industry, including storage chips, has formed a global comprehensive shortage wave that has lasted for nearly two years due to sudden demand and accelerated supply chain hoarding.
However, since the third quarter of 2021, the comprehensive shortage of supply and demand has transformed into a structural imbalance between supply and demand. The phenomenon of long and short materials continues to ferment in major end markets, and the inventory level of enterprises is gradually piling up, leading to a cycle of inventory adjustment downstream. In 2022, under the impact of a series of events such as the Russia-Ukraine conflict, the resurgence of the epidemic, and rising inflation, the risk of global economic downturn has intensified. The demand for smart phones, PCs and other technology products is rapidly declining. The dilemma of "low demand and high inventory" is constantly fermenting, leading to a rapid change in the supply and demand relationship. The market situation of oversupply has led to further decline in the market.
The three-year "pandemic dividend" has subsided, and 2022 has become a turning point, bringing the growth of the storage market to an end. According to the CFM flash memory market, the NAND Flash market capacity is expected to grow by 6% to 610 B GB in 2022, while the DRAM market capacity is expected to grow by 4% to 194 B Gb. Compared to the previous NAND Flash and DRAM, which maintained growth rates of over 30% and 20% respectively, the growth rates of 6% and 4% in 2022 are undoubtedly at historical lows. It is expected to return to the growth rates of 20% and 10% in 2023 under the premise of improved demand.
This report aims to provide a comprehensive presentation of the global market for Memory Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Memory Semiconductor Packaging.
Report Scope
The Memory Semiconductor Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Memory Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Memory Semiconductor Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung
Micron
Hynix
Amkor
YMTC
CXMT
Segment by Type
OSATs
IDM
Segment by Application
DRAM
3D NAND
SRAM
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Memory Semiconductor Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

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