The global MEMS and Sensors Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for MEMS and Sensors Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding MEMS and Sensors Packaging.
Report Scope
The MEMS and Sensors Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global MEMS and Sensors Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the MEMS and Sensors Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor Technology
Unisem (M) Berhad
Micralyne, Inc
UTAC
Hana Microelectronics Public Co., Ltd
Infineon Technologies AG
Analog Devices, Inc
Bosch Sensortec GmbH
JCET Group
HT-tech
KYEC
Chipmos Technologies Inc
Chipbond Technology Corporation
OSE CORP
Tong Hsing Electronic Industries,ltd
Formosa Advanced Technologies Co., Ltd
Xintec Inc
Shunsin Technology (Zhongshan) Ltd
China Wafer Level CSP Co.,Ltd
Segment by Type
Mold Type
Air Type
Segment by Application
Lidar
Microphone Sensor
RF MEMS
Fingerprint Sensor
Onboard Pressure Sensor
Optical Sensor
IoT Devices
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of MEMS and Sensors Packaging companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global MEMS and Sensors Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Mold Type
1.2.3 Air Type
1.3 Market by Application
1.3.1 Global MEMS and Sensors Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Lidar
1.3.3 Microphone Sensor
1.3.4 RF MEMS
1.3.5 Fingerprint Sensor
1.3.6 Onboard Pressure Sensor
1.3.7 Optical Sensor
1.3.8 IoT Devices
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global MEMS and Sensors Packaging Market Perspective (2019-2030)
2.2 MEMS and Sensors Packaging Growth Trends by Region
2.2.1 Global MEMS and Sensors Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 MEMS and Sensors Packaging Historic Market Size by Region (2019-2024)
2.2.3 MEMS and Sensors Packaging Forecasted Market Size by Region (2025-2030)
2.3 MEMS and Sensors Packaging Market Dynamics
2.3.1 MEMS and Sensors Packaging Industry Trends
2.3.2 MEMS and Sensors Packaging Market Drivers
2.3.3 MEMS and Sensors Packaging Market Challenges
2.3.4 MEMS and Sensors Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top MEMS and Sensors Packaging Players by Revenue
3.1.1 Global Top MEMS and Sensors Packaging Players by Revenue (2019-2024)
3.1.2 Global MEMS and Sensors Packaging Revenue Market Share by Players (2019-2024)
3.2 Global MEMS and Sensors Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by MEMS and Sensors Packaging Revenue
3.4 Global MEMS and Sensors Packaging Market Concentration Ratio
3.4.1 Global MEMS and Sensors Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by MEMS and Sensors Packaging Revenue in 2023
3.5 MEMS and Sensors Packaging Key Players Head office and Area Served
3.6 Key Players MEMS and Sensors Packaging Product Solution and Service
3.7 Date of Enter into MEMS and Sensors Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 MEMS and Sensors Packaging Breakdown Data by Type
4.1 Global MEMS and Sensors Packaging Historic Market Size by Type (2019-2024)
4.2 Global MEMS and Sensors Packaging Forecasted Market Size by Type (2025-2030)
5 MEMS and Sensors Packaging Breakdown Data by Application
5.1 Global MEMS and Sensors Packaging Historic Market Size by Application (2019-2024)
5.2 Global MEMS and Sensors Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America MEMS and Sensors Packaging Market Size (2019-2030)
6.2 North America MEMS and Sensors Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America MEMS and Sensors Packaging Market Size by Country (2019-2024)
6.4 North America MEMS and Sensors Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe MEMS and Sensors Packaging Market Size (2019-2030)
7.2 Europe MEMS and Sensors Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe MEMS and Sensors Packaging Market Size by Country (2019-2024)
7.4 Europe MEMS and Sensors Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific MEMS and Sensors Packaging Market Size (2019-2030)
8.2 Asia-Pacific MEMS and Sensors Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific MEMS and Sensors Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific MEMS and Sensors Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America MEMS and Sensors Packaging Market Size (2019-2030)
9.2 Latin America MEMS and Sensors Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America MEMS and Sensors Packaging Market Size by Country (2019-2024)
9.4 Latin America MEMS and Sensors Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa MEMS and Sensors Packaging Market Size (2019-2030)
10.2 Middle East & Africa MEMS and Sensors Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa MEMS and Sensors Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa MEMS and Sensors Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor Technology
11.1.1 Amkor Technology Company Detail
11.1.2 Amkor Technology Business Overview
11.1.3 Amkor Technology MEMS and Sensors Packaging Introduction
11.1.4 Amkor Technology Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.1.5 Amkor Technology Recent Development
11.2 Unisem (M) Berhad
11.2.1 Unisem (M) Berhad Company Detail
11.2.2 Unisem (M) Berhad Business Overview
11.2.3 Unisem (M) Berhad MEMS and Sensors Packaging Introduction
11.2.4 Unisem (M) Berhad Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.2.5 Unisem (M) Berhad Recent Development
11.3 Micralyne, Inc
11.3.1 Micralyne, Inc Company Detail
11.3.2 Micralyne, Inc Business Overview
11.3.3 Micralyne, Inc MEMS and Sensors Packaging Introduction
11.3.4 Micralyne, Inc Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.3.5 Micralyne, Inc Recent Development
11.4 UTAC
11.4.1 UTAC Company Detail
11.4.2 UTAC Business Overview
11.4.3 UTAC MEMS and Sensors Packaging Introduction
11.4.4 UTAC Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.4.5 UTAC Recent Development
11.5 Hana Microelectronics Public Co., Ltd
11.5.1 Hana Microelectronics Public Co., Ltd Company Detail
11.5.2 Hana Microelectronics Public Co., Ltd Business Overview
11.5.3 Hana Microelectronics Public Co., Ltd MEMS and Sensors Packaging Introduction
11.5.4 Hana Microelectronics Public Co., Ltd Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.5.5 Hana Microelectronics Public Co., Ltd Recent Development
11.6 Infineon Technologies AG
11.6.1 Infineon Technologies AG Company Detail
11.6.2 Infineon Technologies AG Business Overview
11.6.3 Infineon Technologies AG MEMS and Sensors Packaging Introduction
11.6.4 Infineon Technologies AG Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.6.5 Infineon Technologies AG Recent Development
11.7 Analog Devices, Inc
11.7.1 Analog Devices, Inc Company Detail
11.7.2 Analog Devices, Inc Business Overview
11.7.3 Analog Devices, Inc MEMS and Sensors Packaging Introduction
11.7.4 Analog Devices, Inc Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.7.5 Analog Devices, Inc Recent Development
11.8 Bosch Sensortec GmbH
11.8.1 Bosch Sensortec GmbH Company Detail
11.8.2 Bosch Sensortec GmbH Business Overview
11.8.3 Bosch Sensortec GmbH MEMS and Sensors Packaging Introduction
11.8.4 Bosch Sensortec GmbH Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.8.5 Bosch Sensortec GmbH Recent Development
11.9 JCET Group
11.9.1 JCET Group Company Detail
11.9.2 JCET Group Business Overview
11.9.3 JCET Group MEMS and Sensors Packaging Introduction
11.9.4 JCET Group Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.9.5 JCET Group Recent Development
11.10 HT-tech
11.10.1 HT-tech Company Detail
11.10.2 HT-tech Business Overview
11.10.3 HT-tech MEMS and Sensors Packaging Introduction
11.10.4 HT-tech Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.10.5 HT-tech Recent Development
11.11 KYEC
11.11.1 KYEC Company Detail
11.11.2 KYEC Business Overview
11.11.3 KYEC MEMS and Sensors Packaging Introduction
11.11.4 KYEC Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.11.5 KYEC Recent Development
11.12 Chipmos Technologies Inc
11.12.1 Chipmos Technologies Inc Company Detail
11.12.2 Chipmos Technologies Inc Business Overview
11.12.3 Chipmos Technologies Inc MEMS and Sensors Packaging Introduction
11.12.4 Chipmos Technologies Inc Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.12.5 Chipmos Technologies Inc Recent Development
11.13 Chipbond Technology Corporation
11.13.1 Chipbond Technology Corporation Company Detail
11.13.2 Chipbond Technology Corporation Business Overview
11.13.3 Chipbond Technology Corporation MEMS and Sensors Packaging Introduction
11.13.4 Chipbond Technology Corporation Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.13.5 Chipbond Technology Corporation Recent Development
11.14 OSE CORP
11.14.1 OSE CORP Company Detail
11.14.2 OSE CORP Business Overview
11.14.3 OSE CORP MEMS and Sensors Packaging Introduction
11.14.4 OSE CORP Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.14.5 OSE CORP Recent Development
11.15 Tong Hsing Electronic Industries,ltd
11.15.1 Tong Hsing Electronic Industries,ltd Company Detail
11.15.2 Tong Hsing Electronic Industries,ltd Business Overview
11.15.3 Tong Hsing Electronic Industries,ltd MEMS and Sensors Packaging Introduction
11.15.4 Tong Hsing Electronic Industries,ltd Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.15.5 Tong Hsing Electronic Industries,ltd Recent Development
11.16 Formosa Advanced Technologies Co., Ltd
11.16.1 Formosa Advanced Technologies Co., Ltd Company Detail
11.16.2 Formosa Advanced Technologies Co., Ltd Business Overview
11.16.3 Formosa Advanced Technologies Co., Ltd MEMS and Sensors Packaging Introduction
11.16.4 Formosa Advanced Technologies Co., Ltd Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.16.5 Formosa Advanced Technologies Co., Ltd Recent Development
11.17 Xintec Inc
11.17.1 Xintec Inc Company Detail
11.17.2 Xintec Inc Business Overview
11.17.3 Xintec Inc MEMS and Sensors Packaging Introduction
11.17.4 Xintec Inc Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.17.5 Xintec Inc Recent Development
11.18 Shunsin Technology (Zhongshan) Ltd
11.18.1 Shunsin Technology (Zhongshan) Ltd Company Detail
11.18.2 Shunsin Technology (Zhongshan) Ltd Business Overview
11.18.3 Shunsin Technology (Zhongshan) Ltd MEMS and Sensors Packaging Introduction
11.18.4 Shunsin Technology (Zhongshan) Ltd Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.18.5 Shunsin Technology (Zhongshan) Ltd Recent Development
11.19 China Wafer Level CSP Co.,Ltd
11.19.1 China Wafer Level CSP Co.,Ltd Company Detail
11.19.2 China Wafer Level CSP Co.,Ltd Business Overview
11.19.3 China Wafer Level CSP Co.,Ltd MEMS and Sensors Packaging Introduction
11.19.4 China Wafer Level CSP Co.,Ltd Revenue in MEMS and Sensors Packaging Business (2019-2024)
11.19.5 China Wafer Level CSP Co.,Ltd Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Amkor Technology
Unisem (M) Berhad
Micralyne, Inc
UTAC
Hana Microelectronics Public Co., Ltd
Infineon Technologies AG
Analog Devices, Inc
Bosch Sensortec GmbH
JCET Group
HT-tech
KYEC
Chipmos Technologies Inc
Chipbond Technology Corporation
OSE CORP
Tong Hsing Electronic Industries,ltd
Formosa Advanced Technologies Co., Ltd
Xintec Inc
Shunsin Technology (Zhongshan) Ltd
China Wafer Level CSP Co.,Ltd
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*If Applicable.
