Microelectronic Packages, also referred to as Hermetic Microelectronic Packages or Integrated Circuit (IC) Packages completes electrical assemblies by packaging sensitive electronic components in a Hermetically Sealed Microelectronic Housing.
The global Microelectronic Packages market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Microelectronic Packages is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Microelectronic Packages is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Microelectronic Packages include Schott, Ametek, Materion, Amkor, Kyocera, Fujitsu, Hermetic Solutions Group, Egide Group and Teledyne Microelectronics, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Microelectronic Packages, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Microelectronic Packages.
The Microelectronic Packages market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Microelectronic Packages market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Microelectronic Packages manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Schott
Ametek
Materion
Amkor
Kyocera
Fujitsu
Hermetic Solutions Group
Egide Group
Teledyne Microelectronics
SGA Technologies
Texas Instruments
Micross Components
Complete Hermetics
Advanced Technology Group
Hi-Rel Group
XT Xing Technologies
Segment by Type
Ceramic to Metal
Glass to Metal
Segment by Application
Electronics
Telecommunication
Automotive
Aerospace / Aviation
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Microelectronic Packages manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Microelectronic Packages by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Microelectronic Packages in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Microelectronic Packages Market Overview
1.1 Product Definition
1.2 Microelectronic Packages Segment by Type
1.2.1 Global Microelectronic Packages Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Ceramic to Metal
1.2.3 Glass to Metal
1.3 Microelectronic Packages Segment by Application
1.3.1 Global Microelectronic Packages Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Electronics
1.3.3 Telecommunication
1.3.4 Automotive
1.3.5 Aerospace / Aviation
1.4 Global Market Growth Prospects
1.4.1 Global Microelectronic Packages Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Microelectronic Packages Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Microelectronic Packages Production Estimates and Forecasts (2018-2029)
1.4.4 Global Microelectronic Packages Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Microelectronic Packages Production Market Share by Manufacturers (2018-2023)
2.2 Global Microelectronic Packages Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Microelectronic Packages, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Microelectronic Packages Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Microelectronic Packages Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Microelectronic Packages, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Microelectronic Packages, Product Offered and Application
2.8 Global Key Manufacturers of Microelectronic Packages, Date of Enter into This Industry
2.9 Microelectronic Packages Market Competitive Situation and Trends
2.9.1 Microelectronic Packages Market Concentration Rate
2.9.2 Global 5 and 10 Largest Microelectronic Packages Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Microelectronic Packages Production by Region
3.1 Global Microelectronic Packages Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Microelectronic Packages Production Value by Region (2018-2029)
3.2.1 Global Microelectronic Packages Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Microelectronic Packages by Region (2024-2029)
3.3 Global Microelectronic Packages Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Microelectronic Packages Production by Region (2018-2029)
3.4.1 Global Microelectronic Packages Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Microelectronic Packages by Region (2024-2029)
3.5 Global Microelectronic Packages Market Price Analysis by Region (2018-2023)
3.6 Global Microelectronic Packages Production and Value, Year-over-Year Growth
3.6.1 North America Microelectronic Packages Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Microelectronic Packages Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Microelectronic Packages Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Microelectronic Packages Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Microelectronic Packages Production Value Estimates and Forecasts (2018-2029)
3.6.6 Taiwan Microelectronic Packages Production Value Estimates and Forecasts (2018-2029)
4 Microelectronic Packages Consumption by Region
4.1 Global Microelectronic Packages Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Microelectronic Packages Consumption by Region (2018-2029)
4.2.1 Global Microelectronic Packages Consumption by Region (2018-2023)
4.2.2 Global Microelectronic Packages Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Microelectronic Packages Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Microelectronic Packages Consumption by Country (2018-2029)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Microelectronic Packages Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Microelectronic Packages Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Microelectronic Packages Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Microelectronic Packages Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Microelectronic Packages Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Microelectronic Packages Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Microelectronic Packages Production by Type (2018-2029)
5.1.1 Global Microelectronic Packages Production by Type (2018-2023)
5.1.2 Global Microelectronic Packages Production by Type (2024-2029)
5.1.3 Global Microelectronic Packages Production Market Share by Type (2018-2029)
5.2 Global Microelectronic Packages Production Value by Type (2018-2029)
5.2.1 Global Microelectronic Packages Production Value by Type (2018-2023)
5.2.2 Global Microelectronic Packages Production Value by Type (2024-2029)
5.2.3 Global Microelectronic Packages Production Value Market Share by Type (2018-2029)
5.3 Global Microelectronic Packages Price by Type (2018-2029)
6 Segment by Application
6.1 Global Microelectronic Packages Production by Application (2018-2029)
6.1.1 Global Microelectronic Packages Production by Application (2018-2023)
6.1.2 Global Microelectronic Packages Production by Application (2024-2029)
6.1.3 Global Microelectronic Packages Production Market Share by Application (2018-2029)
6.2 Global Microelectronic Packages Production Value by Application (2018-2029)
6.2.1 Global Microelectronic Packages Production Value by Application (2018-2023)
6.2.2 Global Microelectronic Packages Production Value by Application (2024-2029)
6.2.3 Global Microelectronic Packages Production Value Market Share by Application (2018-2029)
6.3 Global Microelectronic Packages Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Schott
7.1.1 Schott Microelectronic Packages Corporation Information
7.1.2 Schott Microelectronic Packages Product Portfolio
7.1.3 Schott Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Schott Main Business and Markets Served
7.1.5 Schott Recent Developments/Updates
7.2 Ametek
7.2.1 Ametek Microelectronic Packages Corporation Information
7.2.2 Ametek Microelectronic Packages Product Portfolio
7.2.3 Ametek Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Ametek Main Business and Markets Served
7.2.5 Ametek Recent Developments/Updates
7.3 Materion
7.3.1 Materion Microelectronic Packages Corporation Information
7.3.2 Materion Microelectronic Packages Product Portfolio
7.3.3 Materion Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Materion Main Business and Markets Served
7.3.5 Materion Recent Developments/Updates
7.4 Amkor
7.4.1 Amkor Microelectronic Packages Corporation Information
7.4.2 Amkor Microelectronic Packages Product Portfolio
7.4.3 Amkor Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Amkor Main Business and Markets Served
7.4.5 Amkor Recent Developments/Updates
7.5 Kyocera
7.5.1 Kyocera Microelectronic Packages Corporation Information
7.5.2 Kyocera Microelectronic Packages Product Portfolio
7.5.3 Kyocera Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Kyocera Main Business and Markets Served
7.5.5 Kyocera Recent Developments/Updates
7.6 Fujitsu
7.6.1 Fujitsu Microelectronic Packages Corporation Information
7.6.2 Fujitsu Microelectronic Packages Product Portfolio
7.6.3 Fujitsu Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Fujitsu Main Business and Markets Served
7.6.5 Fujitsu Recent Developments/Updates
7.7 Hermetic Solutions Group
7.7.1 Hermetic Solutions Group Microelectronic Packages Corporation Information
7.7.2 Hermetic Solutions Group Microelectronic Packages Product Portfolio
7.7.3 Hermetic Solutions Group Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Hermetic Solutions Group Main Business and Markets Served
7.7.5 Hermetic Solutions Group Recent Developments/Updates
7.8 Egide Group
7.8.1 Egide Group Microelectronic Packages Corporation Information
7.8.2 Egide Group Microelectronic Packages Product Portfolio
7.8.3 Egide Group Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Egide Group Main Business and Markets Served
7.7.5 Egide Group Recent Developments/Updates
7.9 Teledyne Microelectronics
7.9.1 Teledyne Microelectronics Microelectronic Packages Corporation Information
7.9.2 Teledyne Microelectronics Microelectronic Packages Product Portfolio
7.9.3 Teledyne Microelectronics Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Teledyne Microelectronics Main Business and Markets Served
7.9.5 Teledyne Microelectronics Recent Developments/Updates
7.10 SGA Technologies
7.10.1 SGA Technologies Microelectronic Packages Corporation Information
7.10.2 SGA Technologies Microelectronic Packages Product Portfolio
7.10.3 SGA Technologies Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.10.4 SGA Technologies Main Business and Markets Served
7.10.5 SGA Technologies Recent Developments/Updates
7.11 Texas Instruments
7.11.1 Texas Instruments Microelectronic Packages Corporation Information
7.11.2 Texas Instruments Microelectronic Packages Product Portfolio
7.11.3 Texas Instruments Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Texas Instruments Main Business and Markets Served
7.11.5 Texas Instruments Recent Developments/Updates
7.12 Micross Components
7.12.1 Micross Components Microelectronic Packages Corporation Information
7.12.2 Micross Components Microelectronic Packages Product Portfolio
7.12.3 Micross Components Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Micross Components Main Business and Markets Served
7.12.5 Micross Components Recent Developments/Updates
7.13 Complete Hermetics
7.13.1 Complete Hermetics Microelectronic Packages Corporation Information
7.13.2 Complete Hermetics Microelectronic Packages Product Portfolio
7.13.3 Complete Hermetics Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Complete Hermetics Main Business and Markets Served
7.13.5 Complete Hermetics Recent Developments/Updates
7.14 Advanced Technology Group
7.14.1 Advanced Technology Group Microelectronic Packages Corporation Information
7.14.2 Advanced Technology Group Microelectronic Packages Product Portfolio
7.14.3 Advanced Technology Group Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Advanced Technology Group Main Business and Markets Served
7.14.5 Advanced Technology Group Recent Developments/Updates
7.15 Hi-Rel Group
7.15.1 Hi-Rel Group Microelectronic Packages Corporation Information
7.15.2 Hi-Rel Group Microelectronic Packages Product Portfolio
7.15.3 Hi-Rel Group Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Hi-Rel Group Main Business and Markets Served
7.15.5 Hi-Rel Group Recent Developments/Updates
7.16 XT Xing Technologies
7.16.1 XT Xing Technologies Microelectronic Packages Corporation Information
7.16.2 XT Xing Technologies Microelectronic Packages Product Portfolio
7.16.3 XT Xing Technologies Microelectronic Packages Production, Value, Price and Gross Margin (2018-2023)
7.16.4 XT Xing Technologies Main Business and Markets Served
7.16.5 XT Xing Technologies Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Microelectronic Packages Industry Chain Analysis
8.2 Microelectronic Packages Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Microelectronic Packages Production Mode & Process
8.4 Microelectronic Packages Sales and Marketing
8.4.1 Microelectronic Packages Sales Channels
8.4.2 Microelectronic Packages Distributors
8.5 Microelectronic Packages Customers
9 Microelectronic Packages Market Dynamics
9.1 Microelectronic Packages Industry Trends
9.2 Microelectronic Packages Market Drivers
9.3 Microelectronic Packages Market Challenges
9.4 Microelectronic Packages Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Schott
Ametek
Materion
Amkor
Kyocera
Fujitsu
Hermetic Solutions Group
Egide Group
Teledyne Microelectronics
SGA Technologies
Texas Instruments
Micross Components
Complete Hermetics
Advanced Technology Group
Hi-Rel Group
XT Xing Technologies
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*If Applicable.
