Global Microelectronic Packaging Materials Market Research Report 2025

Publication ID:

PB503255752

Publication Date:

March 4, 2025

Pages:

121

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Specialty Chemicals [2]

Manufacturing (Chemicals) [3]

Chemicals [4]

Description:

The global market for Microelectronic Packaging Materials was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
North American market for Microelectronic Packaging Materials is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Microelectronic Packaging Materials is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Microelectronic Packaging Materials include Materion, STI, SHING HONG TAI COMPANY, DuPont Electronics & Industrial, Panasonic, Polymer Systems Technology, SCHOTT Company, Silicon Connection, CHIMEI, Stanford Advanced Materials, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Microelectronic Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Microelectronic Packaging Materials.
The Microelectronic Packaging Materials market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Microelectronic Packaging Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Microelectronic Packaging Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Materion
STI
SHING HONG TAI COMPANY
DuPont Electronics & Industrial
Panasonic
Polymer Systems Technology
SCHOTT Company
Silicon Connection
CHIMEI
Stanford Advanced Materials
Ferro
Mosaic Microsystems
MBK Tape Solutions
Component Surfaces
Henkel Corporation
Dow Electronic Materials
Sumitomo Bakelite
Kyocera Corporation
Indium Corporation
Henka TenCate Advanced Composites
Namics Corporation
Alpha Assembly Solutions
by Type
Silicone
Epoxies
Metals
Alloys
Others
by Application
Medical
Aerospace
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Microelectronic Packaging Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Microelectronic Packaging Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Microelectronic Packaging Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Microelectronic Packaging Materials Market Overview
1.1 Product Definition
1.2 Microelectronic Packaging Materials by Type
1.2.1 Global Microelectronic Packaging Materials Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Silicone
1.2.3 Epoxies
1.2.4 Metals
1.2.5 Alloys
1.2.6 Others
1.3 Microelectronic Packaging Materials by Application
1.3.1 Global Microelectronic Packaging Materials Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Medical
1.3.3 Aerospace
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Microelectronic Packaging Materials Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Microelectronic Packaging Materials Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Microelectronic Packaging Materials Production Estimates and Forecasts (2020-2031)
1.4.4 Global Microelectronic Packaging Materials Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Microelectronic Packaging Materials Production Market Share by Manufacturers (2020-2025)
2.2 Global Microelectronic Packaging Materials Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Microelectronic Packaging Materials, Industry Ranking, 2023 VS 2024
2.4 Global Microelectronic Packaging Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Microelectronic Packaging Materials Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Microelectronic Packaging Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Microelectronic Packaging Materials, Product Offered and Application
2.8 Global Key Manufacturers of Microelectronic Packaging Materials, Date of Enter into This Industry
2.9 Microelectronic Packaging Materials Market Competitive Situation and Trends
2.9.1 Microelectronic Packaging Materials Market Concentration Rate
2.9.2 Global 5 and 10 Largest Microelectronic Packaging Materials Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Microelectronic Packaging Materials Production by Region
3.1 Global Microelectronic Packaging Materials Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Microelectronic Packaging Materials Production Value by Region (2020-2031)
3.2.1 Global Microelectronic Packaging Materials Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Microelectronic Packaging Materials by Region (2026-2031)
3.3 Global Microelectronic Packaging Materials Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Microelectronic Packaging Materials Production Volume by Region (2020-2031)
3.4.1 Global Microelectronic Packaging Materials Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Microelectronic Packaging Materials by Region (2026-2031)
3.5 Global Microelectronic Packaging Materials Market Price Analysis by Region (2020-2025)
3.6 Global Microelectronic Packaging Materials Production and Value, Year-over-Year Growth
3.6.1 North America Microelectronic Packaging Materials Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Microelectronic Packaging Materials Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Microelectronic Packaging Materials Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Microelectronic Packaging Materials Production Value Estimates and Forecasts (2020-2031)
4 Microelectronic Packaging Materials Consumption by Region
4.1 Global Microelectronic Packaging Materials Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Microelectronic Packaging Materials Consumption by Region (2020-2031)
4.2.1 Global Microelectronic Packaging Materials Consumption by Region (2020-2025)
4.2.2 Global Microelectronic Packaging Materials Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Microelectronic Packaging Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Microelectronic Packaging Materials Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Microelectronic Packaging Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Microelectronic Packaging Materials Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Microelectronic Packaging Materials Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Microelectronic Packaging Materials Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Microelectronic Packaging Materials Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Microelectronic Packaging Materials Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Microelectronic Packaging Materials Production by Type (2020-2031)
5.1.1 Global Microelectronic Packaging Materials Production by Type (2020-2025)
5.1.2 Global Microelectronic Packaging Materials Production by Type (2026-2031)
5.1.3 Global Microelectronic Packaging Materials Production Market Share by Type (2020-2031)
5.2 Global Microelectronic Packaging Materials Production Value by Type (2020-2031)
5.2.1 Global Microelectronic Packaging Materials Production Value by Type (2020-2025)
5.2.2 Global Microelectronic Packaging Materials Production Value by Type (2026-2031)
5.2.3 Global Microelectronic Packaging Materials Production Value Market Share by Type (2020-2031)
5.3 Global Microelectronic Packaging Materials Price by Type (2020-2031)
6 Segment by Application
6.1 Global Microelectronic Packaging Materials Production by Application (2020-2031)
6.1.1 Global Microelectronic Packaging Materials Production by Application (2020-2025)
6.1.2 Global Microelectronic Packaging Materials Production by Application (2026-2031)
6.1.3 Global Microelectronic Packaging Materials Production Market Share by Application (2020-2031)
6.2 Global Microelectronic Packaging Materials Production Value by Application (2020-2031)
6.2.1 Global Microelectronic Packaging Materials Production Value by Application (2020-2025)
6.2.2 Global Microelectronic Packaging Materials Production Value by Application (2026-2031)
6.2.3 Global Microelectronic Packaging Materials Production Value Market Share by Application (2020-2031)
6.3 Global Microelectronic Packaging Materials Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Materion
7.1.1 Materion Microelectronic Packaging Materials Company Information
7.1.2 Materion Microelectronic Packaging Materials Product Portfolio
7.1.3 Materion Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Materion Main Business and Markets Served
7.1.5 Materion Recent Developments/Updates
7.2 STI
7.2.1 STI Microelectronic Packaging Materials Company Information
7.2.2 STI Microelectronic Packaging Materials Product Portfolio
7.2.3 STI Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.2.4 STI Main Business and Markets Served
7.2.5 STI Recent Developments/Updates
7.3 SHING HONG TAI COMPANY
7.3.1 SHING HONG TAI COMPANY Microelectronic Packaging Materials Company Information
7.3.2 SHING HONG TAI COMPANY Microelectronic Packaging Materials Product Portfolio
7.3.3 SHING HONG TAI COMPANY Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.3.4 SHING HONG TAI COMPANY Main Business and Markets Served
7.3.5 SHING HONG TAI COMPANY Recent Developments/Updates
7.4 DuPont Electronics & Industrial
7.4.1 DuPont Electronics & Industrial Microelectronic Packaging Materials Company Information
7.4.2 DuPont Electronics & Industrial Microelectronic Packaging Materials Product Portfolio
7.4.3 DuPont Electronics & Industrial Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.4.4 DuPont Electronics & Industrial Main Business and Markets Served
7.4.5 DuPont Electronics & Industrial Recent Developments/Updates
7.5 Panasonic
7.5.1 Panasonic Microelectronic Packaging Materials Company Information
7.5.2 Panasonic Microelectronic Packaging Materials Product Portfolio
7.5.3 Panasonic Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Panasonic Main Business and Markets Served
7.5.5 Panasonic Recent Developments/Updates
7.6 Polymer Systems Technology
7.6.1 Polymer Systems Technology Microelectronic Packaging Materials Company Information
7.6.2 Polymer Systems Technology Microelectronic Packaging Materials Product Portfolio
7.6.3 Polymer Systems Technology Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Polymer Systems Technology Main Business and Markets Served
7.6.5 Polymer Systems Technology Recent Developments/Updates
7.7 SCHOTT Company
7.7.1 SCHOTT Company Microelectronic Packaging Materials Company Information
7.7.2 SCHOTT Company Microelectronic Packaging Materials Product Portfolio
7.7.3 SCHOTT Company Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.7.4 SCHOTT Company Main Business and Markets Served
7.7.5 SCHOTT Company Recent Developments/Updates
7.8 Silicon Connection
7.8.1 Silicon Connection Microelectronic Packaging Materials Company Information
7.8.2 Silicon Connection Microelectronic Packaging Materials Product Portfolio
7.8.3 Silicon Connection Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Silicon Connection Main Business and Markets Served
7.8.5 Silicon Connection Recent Developments/Updates
7.9 CHIMEI
7.9.1 CHIMEI Microelectronic Packaging Materials Company Information
7.9.2 CHIMEI Microelectronic Packaging Materials Product Portfolio
7.9.3 CHIMEI Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.9.4 CHIMEI Main Business and Markets Served
7.9.5 CHIMEI Recent Developments/Updates
7.10 Stanford Advanced Materials
7.10.1 Stanford Advanced Materials Microelectronic Packaging Materials Company Information
7.10.2 Stanford Advanced Materials Microelectronic Packaging Materials Product Portfolio
7.10.3 Stanford Advanced Materials Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Stanford Advanced Materials Main Business and Markets Served
7.10.5 Stanford Advanced Materials Recent Developments/Updates
7.11 Ferro
7.11.1 Ferro Microelectronic Packaging Materials Company Information
7.11.2 Ferro Microelectronic Packaging Materials Product Portfolio
7.11.3 Ferro Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Ferro Main Business and Markets Served
7.11.5 Ferro Recent Developments/Updates
7.12 Mosaic Microsystems
7.12.1 Mosaic Microsystems Microelectronic Packaging Materials Company Information
7.12.2 Mosaic Microsystems Microelectronic Packaging Materials Product Portfolio
7.12.3 Mosaic Microsystems Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Mosaic Microsystems Main Business and Markets Served
7.12.5 Mosaic Microsystems Recent Developments/Updates
7.13 MBK Tape Solutions
7.13.1 MBK Tape Solutions Microelectronic Packaging Materials Company Information
7.13.2 MBK Tape Solutions Microelectronic Packaging Materials Product Portfolio
7.13.3 MBK Tape Solutions Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.13.4 MBK Tape Solutions Main Business and Markets Served
7.13.5 MBK Tape Solutions Recent Developments/Updates
7.14 Component Surfaces
7.14.1 Component Surfaces Microelectronic Packaging Materials Company Information
7.14.2 Component Surfaces Microelectronic Packaging Materials Product Portfolio
7.14.3 Component Surfaces Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Component Surfaces Main Business and Markets Served
7.14.5 Component Surfaces Recent Developments/Updates
7.15 Henkel Corporation
7.15.1 Henkel Corporation Microelectronic Packaging Materials Company Information
7.15.2 Henkel Corporation Microelectronic Packaging Materials Product Portfolio
7.15.3 Henkel Corporation Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Henkel Corporation Main Business and Markets Served
7.15.5 Henkel Corporation Recent Developments/Updates
7.16 Dow Electronic Materials
7.16.1 Dow Electronic Materials Microelectronic Packaging Materials Company Information
7.16.2 Dow Electronic Materials Microelectronic Packaging Materials Product Portfolio
7.16.3 Dow Electronic Materials Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Dow Electronic Materials Main Business and Markets Served
7.16.5 Dow Electronic Materials Recent Developments/Updates
7.17 Sumitomo Bakelite
7.17.1 Sumitomo Bakelite Microelectronic Packaging Materials Company Information
7.17.2 Sumitomo Bakelite Microelectronic Packaging Materials Product Portfolio
7.17.3 Sumitomo Bakelite Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Sumitomo Bakelite Main Business and Markets Served
7.17.5 Sumitomo Bakelite Recent Developments/Updates
7.18 Kyocera Corporation
7.18.1 Kyocera Corporation Microelectronic Packaging Materials Company Information
7.18.2 Kyocera Corporation Microelectronic Packaging Materials Product Portfolio
7.18.3 Kyocera Corporation Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Kyocera Corporation Main Business and Markets Served
7.18.5 Kyocera Corporation Recent Developments/Updates
7.19 Indium Corporation
7.19.1 Indium Corporation Microelectronic Packaging Materials Company Information
7.19.2 Indium Corporation Microelectronic Packaging Materials Product Portfolio
7.19.3 Indium Corporation Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Indium Corporation Main Business and Markets Served
7.19.5 Indium Corporation Recent Developments/Updates
7.20 Henka TenCate Advanced Composites
7.20.1 Henka TenCate Advanced Composites Microelectronic Packaging Materials Company Information
7.20.2 Henka TenCate Advanced Composites Microelectronic Packaging Materials Product Portfolio
7.20.3 Henka TenCate Advanced Composites Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.20.4 Henka TenCate Advanced Composites Main Business and Markets Served
7.20.5 Henka TenCate Advanced Composites Recent Developments/Updates
7.21 Namics Corporation
7.21.1 Namics Corporation Microelectronic Packaging Materials Company Information
7.21.2 Namics Corporation Microelectronic Packaging Materials Product Portfolio
7.21.3 Namics Corporation Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.21.4 Namics Corporation Main Business and Markets Served
7.21.5 Namics Corporation Recent Developments/Updates
7.22 Alpha Assembly Solutions
7.22.1 Alpha Assembly Solutions Microelectronic Packaging Materials Company Information
7.22.2 Alpha Assembly Solutions Microelectronic Packaging Materials Product Portfolio
7.22.3 Alpha Assembly Solutions Microelectronic Packaging Materials Production, Value, Price and Gross Margin (2020-2025)
7.22.4 Alpha Assembly Solutions Main Business and Markets Served
7.22.5 Alpha Assembly Solutions Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Microelectronic Packaging Materials Industry Chain Analysis
8.2 Microelectronic Packaging Materials Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Microelectronic Packaging Materials Production Mode & Process Analysis
8.4 Microelectronic Packaging Materials Sales and Marketing
8.4.1 Microelectronic Packaging Materials Sales Channels
8.4.2 Microelectronic Packaging Materials Distributors
8.5 Microelectronic Packaging Materials Customer Analysis
9 Microelectronic Packaging Materials Market Dynamics
9.1 Microelectronic Packaging Materials Industry Trends
9.2 Microelectronic Packaging Materials Market Drivers
9.3 Microelectronic Packaging Materials Market Challenges
9.4 Microelectronic Packaging Materials Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

Materion
STI
SHING HONG TAI COMPANY
DuPont Electronics & Industrial
Panasonic
Polymer Systems Technology
SCHOTT Company
Silicon Connection
CHIMEI
Stanford Advanced Materials
Ferro
Mosaic Microsystems
MBK Tape Solutions
Component Surfaces
Henkel Corporation
Dow Electronic Materials
Sumitomo Bakelite
Kyocera Corporation
Indium Corporation
Henka TenCate Advanced Composites
Namics Corporation
Alpha Assembly Solutions

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