Global Microelectronics Packaging Market Research Report 2024

Publication ID:

PB503240270

Publication Date:

March 29, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Microelectronics packaging refers to the process of enclosing and protecting individual microelectronic components, such as integrated circuits (ICs), microprocessors, sensors, and other semiconductor devices, within a protective housing or package. The primary purpose of microelectronics packaging is to provide physical protection, electrical connectivity, thermal management, and environmental isolation for the integrated circuit or device.

The global Microelectronics Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Microelectronics Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Microelectronics Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for Microelectronics Packaging in Aeronautics and Astronautics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of Microelectronics Packaging include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, KaiRui and Jiangsu Dongguang Micro-electronics, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Microelectronics Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Microelectronics Packaging.
Report Scope
The Microelectronics Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Microelectronics Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Microelectronics Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
Segment by Type
Metal Shell
Ceramic Shell
Segment by Application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Microelectronics Packaging companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Microelectronics Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Metal Shell
1.2.3 Ceramic Shell
1.3 Market by Application
1.3.1 Global Microelectronics Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Aeronautics and Astronautics
1.3.3 Petrochemical Industry
1.3.4 Automobile
1.3.5 Optical Communication
1.3.6 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Microelectronics Packaging Market Perspective (2019-2030)
2.2 Microelectronics Packaging Growth Trends by Region
2.2.1 Global Microelectronics Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Microelectronics Packaging Historic Market Size by Region (2019-2024)
2.2.3 Microelectronics Packaging Forecasted Market Size by Region (2025-2030)
2.3 Microelectronics Packaging Market Dynamics
2.3.1 Microelectronics Packaging Industry Trends
2.3.2 Microelectronics Packaging Market Drivers
2.3.3 Microelectronics Packaging Market Challenges
2.3.4 Microelectronics Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Microelectronics Packaging Players by Revenue
3.1.1 Global Top Microelectronics Packaging Players by Revenue (2019-2024)
3.1.2 Global Microelectronics Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Microelectronics Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Microelectronics Packaging Revenue
3.4 Global Microelectronics Packaging Market Concentration Ratio
3.4.1 Global Microelectronics Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Microelectronics Packaging Revenue in 2023
3.5 Microelectronics Packaging Key Players Head office and Area Served
3.6 Key Players Microelectronics Packaging Product Solution and Service
3.7 Date of Enter into Microelectronics Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Microelectronics Packaging Breakdown Data by Type
4.1 Global Microelectronics Packaging Historic Market Size by Type (2019-2024)
4.2 Global Microelectronics Packaging Forecasted Market Size by Type (2025-2030)
5 Microelectronics Packaging Breakdown Data by Application
5.1 Global Microelectronics Packaging Historic Market Size by Application (2019-2024)
5.2 Global Microelectronics Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Microelectronics Packaging Market Size (2019-2030)
6.2 North America Microelectronics Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Microelectronics Packaging Market Size by Country (2019-2024)
6.4 North America Microelectronics Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Microelectronics Packaging Market Size (2019-2030)
7.2 Europe Microelectronics Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Microelectronics Packaging Market Size by Country (2019-2024)
7.4 Europe Microelectronics Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Microelectronics Packaging Market Size (2019-2030)
8.2 Asia-Pacific Microelectronics Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Microelectronics Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific Microelectronics Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Microelectronics Packaging Market Size (2019-2030)
9.2 Latin America Microelectronics Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Microelectronics Packaging Market Size by Country (2019-2024)
9.4 Latin America Microelectronics Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Microelectronics Packaging Market Size (2019-2030)
10.2 Middle East & Africa Microelectronics Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Microelectronics Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa Microelectronics Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 AMETEK(GSP)
11.1.1 AMETEK(GSP) Company Detail
11.1.2 AMETEK(GSP) Business Overview
11.1.3 AMETEK(GSP) Microelectronics Packaging Introduction
11.1.4 AMETEK(GSP) Revenue in Microelectronics Packaging Business (2019-2024)
11.1.5 AMETEK(GSP) Recent Development
11.2 SCHOTT
11.2.1 SCHOTT Company Detail
11.2.2 SCHOTT Business Overview
11.2.3 SCHOTT Microelectronics Packaging Introduction
11.2.4 SCHOTT Revenue in Microelectronics Packaging Business (2019-2024)
11.2.5 SCHOTT Recent Development
11.3 Complete Hermetics
11.3.1 Complete Hermetics Company Detail
11.3.2 Complete Hermetics Business Overview
11.3.3 Complete Hermetics Microelectronics Packaging Introduction
11.3.4 Complete Hermetics Revenue in Microelectronics Packaging Business (2019-2024)
11.3.5 Complete Hermetics Recent Development
11.4 KOTO
11.4.1 KOTO Company Detail
11.4.2 KOTO Business Overview
11.4.3 KOTO Microelectronics Packaging Introduction
11.4.4 KOTO Revenue in Microelectronics Packaging Business (2019-2024)
11.4.5 KOTO Recent Development
11.5 Kyocera
11.5.1 Kyocera Company Detail
11.5.2 Kyocera Business Overview
11.5.3 Kyocera Microelectronics Packaging Introduction
11.5.4 Kyocera Revenue in Microelectronics Packaging Business (2019-2024)
11.5.5 Kyocera Recent Development
11.6 SGA Technologies
11.6.1 SGA Technologies Company Detail
11.6.2 SGA Technologies Business Overview
11.6.3 SGA Technologies Microelectronics Packaging Introduction
11.6.4 SGA Technologies Revenue in Microelectronics Packaging Business (2019-2024)
11.6.5 SGA Technologies Recent Development
11.7 Century Seals
11.7.1 Century Seals Company Detail
11.7.2 Century Seals Business Overview
11.7.3 Century Seals Microelectronics Packaging Introduction
11.7.4 Century Seals Revenue in Microelectronics Packaging Business (2019-2024)
11.7.5 Century Seals Recent Development
11.8 KaiRui
11.8.1 KaiRui Company Detail
11.8.2 KaiRui Business Overview
11.8.3 KaiRui Microelectronics Packaging Introduction
11.8.4 KaiRui Revenue in Microelectronics Packaging Business (2019-2024)
11.8.5 KaiRui Recent Development
11.9 Jiangsu Dongguang Micro-electronics
11.9.1 Jiangsu Dongguang Micro-electronics Company Detail
11.9.2 Jiangsu Dongguang Micro-electronics Business Overview
11.9.3 Jiangsu Dongguang Micro-electronics Microelectronics Packaging Introduction
11.9.4 Jiangsu Dongguang Micro-electronics Revenue in Microelectronics Packaging Business (2019-2024)
11.9.5 Jiangsu Dongguang Micro-electronics Recent Development
11.10 Taizhou Hangyu Electric Appliance
11.10.1 Taizhou Hangyu Electric Appliance Company Detail
11.10.2 Taizhou Hangyu Electric Appliance Business Overview
11.10.3 Taizhou Hangyu Electric Appliance Microelectronics Packaging Introduction
11.10.4 Taizhou Hangyu Electric Appliance Revenue in Microelectronics Packaging Business (2019-2024)
11.10.5 Taizhou Hangyu Electric Appliance Recent Development
11.11 CETC40
11.11.1 CETC40 Company Detail
11.11.2 CETC40 Business Overview
11.11.3 CETC40 Microelectronics Packaging Introduction
11.11.4 CETC40 Revenue in Microelectronics Packaging Business (2019-2024)
11.11.5 CETC40 Recent Development
11.12 BOJING ELECTRONICS
11.12.1 BOJING ELECTRONICS Company Detail
11.12.2 BOJING ELECTRONICS Business Overview
11.12.3 BOJING ELECTRONICS Microelectronics Packaging Introduction
11.12.4 BOJING ELECTRONICS Revenue in Microelectronics Packaging Business (2019-2024)
11.12.5 BOJING ELECTRONICS Recent Development
11.13 CETC43
11.13.1 CETC43 Company Detail
11.13.2 CETC43 Business Overview
11.13.3 CETC43 Microelectronics Packaging Introduction
11.13.4 CETC43 Revenue in Microelectronics Packaging Business (2019-2024)
11.13.5 CETC43 Recent Development
11.14 SINOPIONEER
11.14.1 SINOPIONEER Company Detail
11.14.2 SINOPIONEER Business Overview
11.14.3 SINOPIONEER Microelectronics Packaging Introduction
11.14.4 SINOPIONEER Revenue in Microelectronics Packaging Business (2019-2024)
11.14.5 SINOPIONEER Recent Development
11.15 CCTC
11.15.1 CCTC Company Detail
11.15.2 CCTC Business Overview
11.15.3 CCTC Microelectronics Packaging Introduction
11.15.4 CCTC Revenue in Microelectronics Packaging Business (2019-2024)
11.15.5 CCTC Recent Development
11.16 XingChuang
11.16.1 XingChuang Company Detail
11.16.2 XingChuang Business Overview
11.16.3 XingChuang Microelectronics Packaging Introduction
11.16.4 XingChuang Revenue in Microelectronics Packaging Business (2019-2024)
11.16.5 XingChuang Recent Development
11.17 Rizhao Xuri Electronics Co., Ltd.
11.17.1 Rizhao Xuri Electronics Co., Ltd. Company Detail
11.17.2 Rizhao Xuri Electronics Co., Ltd. Business Overview
11.17.3 Rizhao Xuri Electronics Co., Ltd. Microelectronics Packaging Introduction
11.17.4 Rizhao Xuri Electronics Co., Ltd. Revenue in Microelectronics Packaging Business (2019-2024)
11.17.5 Rizhao Xuri Electronics Co., Ltd. Recent Development
11.18 ShengDa Technology
11.18.1 ShengDa Technology Company Detail
11.18.2 ShengDa Technology Business Overview
11.18.3 ShengDa Technology Microelectronics Packaging Introduction
11.18.4 ShengDa Technology Revenue in Microelectronics Packaging Business (2019-2024)
11.18.5 ShengDa Technology Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology

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