
The global market for Microelectronics Solder Paste was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Microelectronics solder paste is a low-temperature solder material that can be used in microelectronic connection links in electronic assembly. Electronic soldering
The paste is formed by mixing tin alloy powder and solder paste. The formula ingredients of tin alloy powder and solder paste, as well as the configuration ratio of tin alloy powder and solder paste, determine its welding performance. Electronic assembly is to weld active components, passive components, connectors and other electronic components on the PCB board through SMT patch or DIP packaging to form a complete PCBA assembly.
North American market for Microelectronics Solder Paste is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Microelectronics Solder Paste is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Microelectronics Solder Paste include MacDermid Alpha, Senju, Indium, Tamura, Heraeus, Henkel, Shenzhen Vital New Material Co.,Ltd., Shenmao, Inventec, Shenzhen Tongfang Electronic New Material Co., Ltd., etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Microelectronics Solder Paste, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Microelectronics Solder Paste.
The Microelectronics Solder Paste market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Microelectronics Solder Paste market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Microelectronics Solder Paste manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
MacDermid Alpha
Senju
Indium
Tamura
Heraeus
Henkel
Shenzhen Vital New Material Co.,Ltd.
Shenmao
Inventec
Shenzhen Tongfang Electronic New Material Co., Ltd.
XIAMEN JISSYU SOLDER CO.,LTD
Hangzhou Huaguang Advanced Welding Materials Co.,Ltd.
Dongguan YongAn Technology Co., Ltd.
U-BOND Technology INC.
Shen ZHEN Yikshing TAT Industrial Co., Ltd.
by Type
Low Temperature Solder Paste Alloy
Medium Temperature Solder Paste Alloy
High Temperature Solder Paste Alloy
by Application
Avionics
Vehicle Electronics
Consumer Electronics
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Microelectronics Solder Paste manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Microelectronics Solder Paste by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Microelectronics Solder Paste in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Microelectronics Solder Paste Market Overview
1.1 Product Definition
1.2 Microelectronics Solder Paste by Type
1.2.1 Global Microelectronics Solder Paste Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Low Temperature Solder Paste Alloy
1.2.3 Medium Temperature Solder Paste Alloy
1.2.4 High Temperature Solder Paste Alloy
1.3 Microelectronics Solder Paste by Application
1.3.1 Global Microelectronics Solder Paste Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Avionics
1.3.3 Vehicle Electronics
1.3.4 Consumer Electronics
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Microelectronics Solder Paste Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Microelectronics Solder Paste Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Microelectronics Solder Paste Production Estimates and Forecasts (2020-2031)
1.4.4 Global Microelectronics Solder Paste Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Microelectronics Solder Paste Production Market Share by Manufacturers (2020-2025)
2.2 Global Microelectronics Solder Paste Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Microelectronics Solder Paste, Industry Ranking, 2023 VS 2024
2.4 Global Microelectronics Solder Paste Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Microelectronics Solder Paste Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Microelectronics Solder Paste, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Microelectronics Solder Paste, Product Offered and Application
2.8 Global Key Manufacturers of Microelectronics Solder Paste, Date of Enter into This Industry
2.9 Microelectronics Solder Paste Market Competitive Situation and Trends
2.9.1 Microelectronics Solder Paste Market Concentration Rate
2.9.2 Global 5 and 10 Largest Microelectronics Solder Paste Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Microelectronics Solder Paste Production by Region
3.1 Global Microelectronics Solder Paste Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Microelectronics Solder Paste Production Value by Region (2020-2031)
3.2.1 Global Microelectronics Solder Paste Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Microelectronics Solder Paste by Region (2026-2031)
3.3 Global Microelectronics Solder Paste Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Microelectronics Solder Paste Production Volume by Region (2020-2031)
3.4.1 Global Microelectronics Solder Paste Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Microelectronics Solder Paste by Region (2026-2031)
3.5 Global Microelectronics Solder Paste Market Price Analysis by Region (2020-2025)
3.6 Global Microelectronics Solder Paste Production and Value, Year-over-Year Growth
3.6.1 North America Microelectronics Solder Paste Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Microelectronics Solder Paste Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Microelectronics Solder Paste Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Microelectronics Solder Paste Production Value Estimates and Forecasts (2020-2031)
4 Microelectronics Solder Paste Consumption by Region
4.1 Global Microelectronics Solder Paste Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Microelectronics Solder Paste Consumption by Region (2020-2031)
4.2.1 Global Microelectronics Solder Paste Consumption by Region (2020-2025)
4.2.2 Global Microelectronics Solder Paste Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Microelectronics Solder Paste Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Microelectronics Solder Paste Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Microelectronics Solder Paste Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Microelectronics Solder Paste Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Microelectronics Solder Paste Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Microelectronics Solder Paste Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Microelectronics Solder Paste Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Microelectronics Solder Paste Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Microelectronics Solder Paste Production by Type (2020-2031)
5.1.1 Global Microelectronics Solder Paste Production by Type (2020-2025)
5.1.2 Global Microelectronics Solder Paste Production by Type (2026-2031)
5.1.3 Global Microelectronics Solder Paste Production Market Share by Type (2020-2031)
5.2 Global Microelectronics Solder Paste Production Value by Type (2020-2031)
5.2.1 Global Microelectronics Solder Paste Production Value by Type (2020-2025)
5.2.2 Global Microelectronics Solder Paste Production Value by Type (2026-2031)
5.2.3 Global Microelectronics Solder Paste Production Value Market Share by Type (2020-2031)
5.3 Global Microelectronics Solder Paste Price by Type (2020-2031)
6 Segment by Application
6.1 Global Microelectronics Solder Paste Production by Application (2020-2031)
6.1.1 Global Microelectronics Solder Paste Production by Application (2020-2025)
6.1.2 Global Microelectronics Solder Paste Production by Application (2026-2031)
6.1.3 Global Microelectronics Solder Paste Production Market Share by Application (2020-2031)
6.2 Global Microelectronics Solder Paste Production Value by Application (2020-2031)
6.2.1 Global Microelectronics Solder Paste Production Value by Application (2020-2025)
6.2.2 Global Microelectronics Solder Paste Production Value by Application (2026-2031)
6.2.3 Global Microelectronics Solder Paste Production Value Market Share by Application (2020-2031)
6.3 Global Microelectronics Solder Paste Price by Application (2020-2031)
7 Key Companies Profiled
7.1 MacDermid Alpha
7.1.1 MacDermid Alpha Microelectronics Solder Paste Company Information
7.1.2 MacDermid Alpha Microelectronics Solder Paste Product Portfolio
7.1.3 MacDermid Alpha Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.1.4 MacDermid Alpha Main Business and Markets Served
7.1.5 MacDermid Alpha Recent Developments/Updates
7.2 Senju
7.2.1 Senju Microelectronics Solder Paste Company Information
7.2.2 Senju Microelectronics Solder Paste Product Portfolio
7.2.3 Senju Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Senju Main Business and Markets Served
7.2.5 Senju Recent Developments/Updates
7.3 Indium
7.3.1 Indium Microelectronics Solder Paste Company Information
7.3.2 Indium Microelectronics Solder Paste Product Portfolio
7.3.3 Indium Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Indium Main Business and Markets Served
7.3.5 Indium Recent Developments/Updates
7.4 Tamura
7.4.1 Tamura Microelectronics Solder Paste Company Information
7.4.2 Tamura Microelectronics Solder Paste Product Portfolio
7.4.3 Tamura Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Tamura Main Business and Markets Served
7.4.5 Tamura Recent Developments/Updates
7.5 Heraeus
7.5.1 Heraeus Microelectronics Solder Paste Company Information
7.5.2 Heraeus Microelectronics Solder Paste Product Portfolio
7.5.3 Heraeus Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Heraeus Main Business and Markets Served
7.5.5 Heraeus Recent Developments/Updates
7.6 Henkel
7.6.1 Henkel Microelectronics Solder Paste Company Information
7.6.2 Henkel Microelectronics Solder Paste Product Portfolio
7.6.3 Henkel Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Henkel Main Business and Markets Served
7.6.5 Henkel Recent Developments/Updates
7.7 Shenzhen Vital New Material Co.,Ltd.
7.7.1 Shenzhen Vital New Material Co.,Ltd. Microelectronics Solder Paste Company Information
7.7.2 Shenzhen Vital New Material Co.,Ltd. Microelectronics Solder Paste Product Portfolio
7.7.3 Shenzhen Vital New Material Co.,Ltd. Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Shenzhen Vital New Material Co.,Ltd. Main Business and Markets Served
7.7.5 Shenzhen Vital New Material Co.,Ltd. Recent Developments/Updates
7.8 Shenmao
7.8.1 Shenmao Microelectronics Solder Paste Company Information
7.8.2 Shenmao Microelectronics Solder Paste Product Portfolio
7.8.3 Shenmao Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Shenmao Main Business and Markets Served
7.8.5 Shenmao Recent Developments/Updates
7.9 Inventec
7.9.1 Inventec Microelectronics Solder Paste Company Information
7.9.2 Inventec Microelectronics Solder Paste Product Portfolio
7.9.3 Inventec Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Inventec Main Business and Markets Served
7.9.5 Inventec Recent Developments/Updates
7.10 Shenzhen Tongfang Electronic New Material Co., Ltd.
7.10.1 Shenzhen Tongfang Electronic New Material Co., Ltd. Microelectronics Solder Paste Company Information
7.10.2 Shenzhen Tongfang Electronic New Material Co., Ltd. Microelectronics Solder Paste Product Portfolio
7.10.3 Shenzhen Tongfang Electronic New Material Co., Ltd. Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Shenzhen Tongfang Electronic New Material Co., Ltd. Main Business and Markets Served
7.10.5 Shenzhen Tongfang Electronic New Material Co., Ltd. Recent Developments/Updates
7.11 XIAMEN JISSYU SOLDER CO.,LTD
7.11.1 XIAMEN JISSYU SOLDER CO.,LTD Microelectronics Solder Paste Company Information
7.11.2 XIAMEN JISSYU SOLDER CO.,LTD Microelectronics Solder Paste Product Portfolio
7.11.3 XIAMEN JISSYU SOLDER CO.,LTD Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.11.4 XIAMEN JISSYU SOLDER CO.,LTD Main Business and Markets Served
7.11.5 XIAMEN JISSYU SOLDER CO.,LTD Recent Developments/Updates
7.12 Hangzhou Huaguang Advanced Welding Materials Co.,Ltd.
7.12.1 Hangzhou Huaguang Advanced Welding Materials Co.,Ltd. Microelectronics Solder Paste Company Information
7.12.2 Hangzhou Huaguang Advanced Welding Materials Co.,Ltd. Microelectronics Solder Paste Product Portfolio
7.12.3 Hangzhou Huaguang Advanced Welding Materials Co.,Ltd. Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Hangzhou Huaguang Advanced Welding Materials Co.,Ltd. Main Business and Markets Served
7.12.5 Hangzhou Huaguang Advanced Welding Materials Co.,Ltd. Recent Developments/Updates
7.13 Dongguan YongAn Technology Co., Ltd.
7.13.1 Dongguan YongAn Technology Co., Ltd. Microelectronics Solder Paste Company Information
7.13.2 Dongguan YongAn Technology Co., Ltd. Microelectronics Solder Paste Product Portfolio
7.13.3 Dongguan YongAn Technology Co., Ltd. Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Dongguan YongAn Technology Co., Ltd. Main Business and Markets Served
7.13.5 Dongguan YongAn Technology Co., Ltd. Recent Developments/Updates
7.14 U-BOND Technology INC.
7.14.1 U-BOND Technology INC. Microelectronics Solder Paste Company Information
7.14.2 U-BOND Technology INC. Microelectronics Solder Paste Product Portfolio
7.14.3 U-BOND Technology INC. Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.14.4 U-BOND Technology INC. Main Business and Markets Served
7.14.5 U-BOND Technology INC. Recent Developments/Updates
7.15 Shen ZHEN Yikshing TAT Industrial Co., Ltd.
7.15.1 Shen ZHEN Yikshing TAT Industrial Co., Ltd. Microelectronics Solder Paste Company Information
7.15.2 Shen ZHEN Yikshing TAT Industrial Co., Ltd. Microelectronics Solder Paste Product Portfolio
7.15.3 Shen ZHEN Yikshing TAT Industrial Co., Ltd. Microelectronics Solder Paste Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Shen ZHEN Yikshing TAT Industrial Co., Ltd. Main Business and Markets Served
7.15.5 Shen ZHEN Yikshing TAT Industrial Co., Ltd. Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Microelectronics Solder Paste Industry Chain Analysis
8.2 Microelectronics Solder Paste Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Microelectronics Solder Paste Production Mode & Process Analysis
8.4 Microelectronics Solder Paste Sales and Marketing
8.4.1 Microelectronics Solder Paste Sales Channels
8.4.2 Microelectronics Solder Paste Distributors
8.5 Microelectronics Solder Paste Customer Analysis
9 Microelectronics Solder Paste Market Dynamics
9.1 Microelectronics Solder Paste Industry Trends
9.2 Microelectronics Solder Paste Market Drivers
9.3 Microelectronics Solder Paste Market Challenges
9.4 Microelectronics Solder Paste Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
MacDermid Alpha
Senju
Indium
Tamura
Heraeus
Henkel
Shenzhen Vital New Material Co.,Ltd.
Shenmao
Inventec
Shenzhen Tongfang Electronic New Material Co., Ltd.
XIAMEN JISSYU SOLDER CO.,LTD
Hangzhou Huaguang Advanced Welding Materials Co.,Ltd.
Dongguan YongAn Technology Co., Ltd.
U-BOND Technology INC.
Shen ZHEN Yikshing TAT Industrial Co., Ltd.
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*If Applicable.
