Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.
The global Molded Interconnect Substrate (MIS) market was valued at US$ 536 million in 2023 and is anticipated to reach US$ 1244 million by 2030, witnessing a CAGR of 12.8% during the forecast period 2024-2030.
MIS (Molded Interconnect Substrate) substrates, as a new packaging technology, have been gaining momentum in the market in recent years.
At present, there are many suppliers in the MIS substrate market, including ASE, Carsem, JCET, Unisem, etc. These companies are actively developing IC packaging technology based on MIS substrates and are competing fiercely in the market.
Market development trend
Technology continues to improve: With the further improvement of integrated circuit product performance and the demand for ultra-thin products, MIS substrate technology is also constantly improving. For example, by optimizing wiring design, increasing wiring density, and adopting more advanced electroplating copper pillar technology, MIS substrates have shown significant advantages in electrical, thermal performance and reliability.
Continuous expansion of application areas: In addition to traditional analog chips, power ICs and digital currency fields, MIS substrates have also been widely used in the packaging of RF and power management devices in electronic products such as mobile phones, industrial control, and IOT. In the future, as electronic products continue to develop in the direction of high performance, multi-function, and high-frequency transmission, the application areas of MIS substrates will be further expanded.
Accelerated domestic substitution: In the field of mid- and low-end packaging, traditional lead frame packaging is gradually replaced by IC substrates. As a type of IC substrate, MIS substrates are expected to play an important role in the process of domestic substitution with their superior performance and cost-effectiveness.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Substrate (MIS), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Substrate (MIS).
The Molded Interconnect Substrate (MIS) market size, estimations, and forecasts are provided in terms of output/shipments (K Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Molded Interconnect Substrate (MIS) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Molded Interconnect Substrate (MIS) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASM Advanced Packaging Materials
Unisem
Phoenix Pioneer Technology
ASE Material
Carsem
JCET Group
MISpak
Advanpack
by Type
Single Layer
Multilayer
by Application
Analog Chip
Power IC
Digital Currency
Others
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Molded Interconnect Substrate (MIS) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Molded Interconnect Substrate (MIS) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Molded Interconnect Substrate (MIS) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Molded Interconnect Substrate (MIS) Market Overview
1.1 Product Definition
1.2 Molded Interconnect Substrate (MIS) by Type
1.2.1 Global Molded Interconnect Substrate (MIS) Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Single Layer
1.2.3 Multilayer
1.3 Molded Interconnect Substrate (MIS) by Application
1.3.1 Global Molded Interconnect Substrate (MIS) Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Analog Chip
1.3.3 Power IC
1.3.4 Digital Currency
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Molded Interconnect Substrate (MIS) Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Molded Interconnect Substrate (MIS) Production Estimates and Forecasts (2019-2030)
1.4.4 Global Molded Interconnect Substrate (MIS) Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Molded Interconnect Substrate (MIS) Production Market Share by Manufacturers (2019-2024)
2.2 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Molded Interconnect Substrate (MIS), Industry Ranking, 2022 VS 2023
2.4 Global Molded Interconnect Substrate (MIS) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Molded Interconnect Substrate (MIS) Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Product Type & Application
2.8 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Date of Enter into This Industry
2.9 Global Molded Interconnect Substrate (MIS) Market Competitive Situation and Trends
2.9.1 Global Molded Interconnect Substrate (MIS) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Molded Interconnect Substrate (MIS) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Molded Interconnect Substrate (MIS) Production by Region
3.1 Global Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Molded Interconnect Substrate (MIS) Production Value by Region (2019-2030)
3.2.1 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Molded Interconnect Substrate (MIS) by Region (2025-2030)
3.3 Global Molded Interconnect Substrate (MIS) Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Molded Interconnect Substrate (MIS) Production by Region (2019-2030)
3.4.1 Global Molded Interconnect Substrate (MIS) Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Molded Interconnect Substrate (MIS) by Region (2025-2030)
3.5 Global Molded Interconnect Substrate (MIS) Market Price Analysis by Region (2019-2024)
3.6 Global Molded Interconnect Substrate (MIS) Production and Value, Year-over-Year Growth
3.6.1 North America Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
4 Molded Interconnect Substrate (MIS) Consumption by Region
4.1 Global Molded Interconnect Substrate (MIS) Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Molded Interconnect Substrate (MIS) Consumption by Region (2019-2030)
4.2.1 Global Molded Interconnect Substrate (MIS) Consumption by Region (2019-2030)
4.2.2 Global Molded Interconnect Substrate (MIS) Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Molded Interconnect Substrate (MIS) Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Molded Interconnect Substrate (MIS) Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Molded Interconnect Substrate (MIS) Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Molded Interconnect Substrate (MIS) Production by Type (2019-2030)
5.1.1 Global Molded Interconnect Substrate (MIS) Production by Type (2019-2024)
5.1.2 Global Molded Interconnect Substrate (MIS) Production by Type (2025-2030)
5.1.3 Global Molded Interconnect Substrate (MIS) Production Market Share by Type (2019-2030)
5.2 Global Molded Interconnect Substrate (MIS) Production Value by Type (2019-2030)
5.2.1 Global Molded Interconnect Substrate (MIS) Production Value by Type (2019-2024)
5.2.2 Global Molded Interconnect Substrate (MIS) Production Value by Type (2025-2030)
5.2.3 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Type (2019-2030)
5.3 Global Molded Interconnect Substrate (MIS) Price by Type (2019-2030)
6 Segment by Application
6.1 Global Molded Interconnect Substrate (MIS) Production by Application (2019-2030)
6.1.1 Global Molded Interconnect Substrate (MIS) Production by Application (2019-2024)
6.1.2 Global Molded Interconnect Substrate (MIS) Production by Application (2025-2030)
6.1.3 Global Molded Interconnect Substrate (MIS) Production Market Share by Application (2019-2030)
6.2 Global Molded Interconnect Substrate (MIS) Production Value by Application (2019-2030)
6.2.1 Global Molded Interconnect Substrate (MIS) Production Value by Application (2019-2024)
6.2.2 Global Molded Interconnect Substrate (MIS) Production Value by Application (2025-2030)
6.2.3 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Application (2019-2030)
6.3 Global Molded Interconnect Substrate (MIS) Price by Application (2019-2030)
7 Key Companies Profiled
7.1 ASM Advanced Packaging Materials
7.1.1 ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Company Information
7.1.2 ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Product Portfolio
7.1.3 ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.1.4 ASM Advanced Packaging Materials Main Business and Markets Served
7.1.5 ASM Advanced Packaging Materials Recent Developments/Updates
7.2 Unisem
7.2.1 Unisem Molded Interconnect Substrate (MIS) Company Information
7.2.2 Unisem Molded Interconnect Substrate (MIS) Product Portfolio
7.2.3 Unisem Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Unisem Main Business and Markets Served
7.2.5 Unisem Recent Developments/Updates
7.3 Phoenix Pioneer Technology
7.3.1 Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Company Information
7.3.2 Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Product Portfolio
7.3.3 Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Phoenix Pioneer Technology Main Business and Markets Served
7.3.5 Phoenix Pioneer Technology Recent Developments/Updates
7.4 ASE Material
7.4.1 ASE Material Molded Interconnect Substrate (MIS) Company Information
7.4.2 ASE Material Molded Interconnect Substrate (MIS) Product Portfolio
7.4.3 ASE Material Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.4.4 ASE Material Main Business and Markets Served
7.4.5 ASE Material Recent Developments/Updates
7.5 Carsem
7.5.1 Carsem Molded Interconnect Substrate (MIS) Company Information
7.5.2 Carsem Molded Interconnect Substrate (MIS) Product Portfolio
7.5.3 Carsem Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Carsem Main Business and Markets Served
7.5.5 Carsem Recent Developments/Updates
7.6 JCET Group
7.6.1 JCET Group Molded Interconnect Substrate (MIS) Company Information
7.6.2 JCET Group Molded Interconnect Substrate (MIS) Product Portfolio
7.6.3 JCET Group Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.6.4 JCET Group Main Business and Markets Served
7.6.5 JCET Group Recent Developments/Updates
7.7 MISpak
7.7.1 MISpak Molded Interconnect Substrate (MIS) Company Information
7.7.2 MISpak Molded Interconnect Substrate (MIS) Product Portfolio
7.7.3 MISpak Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.7.4 MISpak Main Business and Markets Served
7.7.5 MISpak Recent Developments/Updates
7.8 Advanpack
7.8.1 Advanpack Molded Interconnect Substrate (MIS) Company Information
7.8.2 Advanpack Molded Interconnect Substrate (MIS) Product Portfolio
7.8.3 Advanpack Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Advanpack Main Business and Markets Served
7.8.5 Advanpack Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Molded Interconnect Substrate (MIS) Industry Chain Analysis
8.2 Molded Interconnect Substrate (MIS) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Molded Interconnect Substrate (MIS) Production Mode & Process
8.4 Molded Interconnect Substrate (MIS) Sales and Marketing
8.4.1 Molded Interconnect Substrate (MIS) Sales Channels
8.4.2 Molded Interconnect Substrate (MIS) Distributors
8.5 Molded Interconnect Substrate (MIS) Customers
9 Molded Interconnect Substrate (MIS) Market Dynamics
9.1 Molded Interconnect Substrate (MIS) Industry Trends
9.2 Molded Interconnect Substrate (MIS) Market Drivers
9.3 Molded Interconnect Substrate (MIS) Market Challenges
9.4 Molded Interconnect Substrate (MIS) Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
ASM Advanced Packaging Materials
Unisem
Phoenix Pioneer Technology
ASE Material
Carsem
JCET Group
MISpak
Advanpack
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*If Applicable.
