The global market for Molded Interconnect Substrate (MIS) was valued at US$ 98 million in the year 2024 and is projected to reach a revised size of US$ 228 million by 2031, growing at a CAGR of 12.2% during the forecast period.
Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.
Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.
PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates
The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.
In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.
Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Substrate (MIS), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Substrate (MIS).
The Molded Interconnect Substrate (MIS) market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Molded Interconnect Substrate (MIS) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Molded Interconnect Substrate (MIS) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
PPt
MiSpak Technology
QDOS
by Type
1 Layer MIS Substrate
2 Layer MIS Substrate
3 Layer MIS Substrate
4 Layer MIS Substrate
6 Layer MIS Substrate
Others
by Application
Analog Chip
Power IC
RF/5G
Fingerprint Sensor
OIS (Optical Image Stablization)
Others
Production by Region
China Mainland
China Taiwan
Malaysia
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Molded Interconnect Substrate (MIS) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Molded Interconnect Substrate (MIS) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Molded Interconnect Substrate (MIS) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Molded Interconnect Substrate (MIS) Market Overview
1.1 Product Definition
1.2 Molded Interconnect Substrate (MIS) by Type
1.2.1 Global Molded Interconnect Substrate (MIS) Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 1 Layer MIS Substrate
1.2.3 2 Layer MIS Substrate
1.2.4 3 Layer MIS Substrate
1.2.5 4 Layer MIS Substrate
1.2.6 6 Layer MIS Substrate
1.2.7 Others
1.3 Molded Interconnect Substrate (MIS) by Application
1.3.1 Global Molded Interconnect Substrate (MIS) Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Analog Chip
1.3.3 Power IC
1.3.4 RF/5G
1.3.5 Fingerprint Sensor
1.3.6 OIS (Optical Image Stablization)
1.3.7 Others
1.4 Global Market Growth Prospects
1.4.1 Global Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Molded Interconnect Substrate (MIS) Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Molded Interconnect Substrate (MIS) Production Estimates and Forecasts (2020-2031)
1.4.4 Global Molded Interconnect Substrate (MIS) Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Molded Interconnect Substrate (MIS) Production Market Share by Manufacturers (2020-2025)
2.2 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Molded Interconnect Substrate (MIS), Industry Ranking, 2023 VS 2024
2.4 Global Molded Interconnect Substrate (MIS) Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Molded Interconnect Substrate (MIS) Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Product Offered and Application
2.8 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Date of Enter into This Industry
2.9 Molded Interconnect Substrate (MIS) Market Competitive Situation and Trends
2.9.1 Molded Interconnect Substrate (MIS) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Molded Interconnect Substrate (MIS) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Molded Interconnect Substrate (MIS) Production by Region
3.1 Global Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Molded Interconnect Substrate (MIS) Production Value by Region (2020-2031)
3.2.1 Global Molded Interconnect Substrate (MIS) Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Molded Interconnect Substrate (MIS) by Region (2026-2031)
3.3 Global Molded Interconnect Substrate (MIS) Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Molded Interconnect Substrate (MIS) Production Volume by Region (2020-2031)
3.4.1 Global Molded Interconnect Substrate (MIS) Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Molded Interconnect Substrate (MIS) by Region (2026-2031)
3.5 Global Molded Interconnect Substrate (MIS) Market Price Analysis by Region (2020-2025)
3.6 Global Molded Interconnect Substrate (MIS) Production and Value, Year-over-Year Growth
3.6.1 China Mainland Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2020-2031)
3.6.2 China Taiwan Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2020-2031)
3.6.3 Malaysia Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2020-2031)
4 Molded Interconnect Substrate (MIS) Consumption by Region
4.1 Global Molded Interconnect Substrate (MIS) Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Molded Interconnect Substrate (MIS) Consumption by Region (2020-2031)
4.2.1 Global Molded Interconnect Substrate (MIS) Consumption by Region (2020-2025)
4.2.2 Global Molded Interconnect Substrate (MIS) Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Molded Interconnect Substrate (MIS) Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Molded Interconnect Substrate (MIS) Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Molded Interconnect Substrate (MIS) Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Molded Interconnect Substrate (MIS) Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Molded Interconnect Substrate (MIS) Production by Type (2020-2031)
5.1.1 Global Molded Interconnect Substrate (MIS) Production by Type (2020-2025)
5.1.2 Global Molded Interconnect Substrate (MIS) Production by Type (2026-2031)
5.1.3 Global Molded Interconnect Substrate (MIS) Production Market Share by Type (2020-2031)
5.2 Global Molded Interconnect Substrate (MIS) Production Value by Type (2020-2031)
5.2.1 Global Molded Interconnect Substrate (MIS) Production Value by Type (2020-2025)
5.2.2 Global Molded Interconnect Substrate (MIS) Production Value by Type (2026-2031)
5.2.3 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Type (2020-2031)
5.3 Global Molded Interconnect Substrate (MIS) Price by Type (2020-2031)
6 Segment by Application
6.1 Global Molded Interconnect Substrate (MIS) Production by Application (2020-2031)
6.1.1 Global Molded Interconnect Substrate (MIS) Production by Application (2020-2025)
6.1.2 Global Molded Interconnect Substrate (MIS) Production by Application (2026-2031)
6.1.3 Global Molded Interconnect Substrate (MIS) Production Market Share by Application (2020-2031)
6.2 Global Molded Interconnect Substrate (MIS) Production Value by Application (2020-2031)
6.2.1 Global Molded Interconnect Substrate (MIS) Production Value by Application (2020-2025)
6.2.2 Global Molded Interconnect Substrate (MIS) Production Value by Application (2026-2031)
6.2.3 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Application (2020-2031)
6.3 Global Molded Interconnect Substrate (MIS) Price by Application (2020-2031)
7 Key Companies Profiled
7.1 PPt
7.1.1 PPt Molded Interconnect Substrate (MIS) Company Information
7.1.2 PPt Molded Interconnect Substrate (MIS) Product Portfolio
7.1.3 PPt Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2020-2025)
7.1.4 PPt Main Business and Markets Served
7.1.5 PPt Recent Developments/Updates
7.2 MiSpak Technology
7.2.1 MiSpak Technology Molded Interconnect Substrate (MIS) Company Information
7.2.2 MiSpak Technology Molded Interconnect Substrate (MIS) Product Portfolio
7.2.3 MiSpak Technology Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2020-2025)
7.2.4 MiSpak Technology Main Business and Markets Served
7.2.5 MiSpak Technology Recent Developments/Updates
7.3 QDOS
7.3.1 QDOS Molded Interconnect Substrate (MIS) Company Information
7.3.2 QDOS Molded Interconnect Substrate (MIS) Product Portfolio
7.3.3 QDOS Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2020-2025)
7.3.4 QDOS Main Business and Markets Served
7.3.5 QDOS Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Molded Interconnect Substrate (MIS) Industry Chain Analysis
8.2 Molded Interconnect Substrate (MIS) Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Molded Interconnect Substrate (MIS) Production Mode & Process Analysis
8.4 Molded Interconnect Substrate (MIS) Sales and Marketing
8.4.1 Molded Interconnect Substrate (MIS) Sales Channels
8.4.2 Molded Interconnect Substrate (MIS) Distributors
8.5 Molded Interconnect Substrate (MIS) Customer Analysis
9 Molded Interconnect Substrate (MIS) Market Dynamics
9.1 Molded Interconnect Substrate (MIS) Industry Trends
9.2 Molded Interconnect Substrate (MIS) Market Drivers
9.3 Molded Interconnect Substrate (MIS) Market Challenges
9.4 Molded Interconnect Substrate (MIS) Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
PPt
MiSpak Technology
QDOS
听
听
*If Applicable.
