The global market for Molded Interconnect Substrate Technology was valued at US$ 98 million in the year 2024 and is projected to reach a revised size of US$ 228 million by 2031, growing at a CAGR of 12.2% during the forecast period.
The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Molded Interconnect Substrate Technology competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.
Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.
Currently, there are currently only three companies in the world that manufacture MIS substrates, China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.
PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates
The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.
In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.
Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Substrate Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Substrate Technology.
The Molded Interconnect Substrate Technology market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Molded Interconnect Substrate Technology market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Molded Interconnect Substrate Technology manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Company
PPt
MiSpak Technology
QDOS
Segment by Type
Multi-layer MIS
Single-layer MIS
Segment by Application
Power IC
RF/5G
Fingerprint Sensor
OIS (Optical Image Stablization)
Others
Production by Region
China Taiwan
China Mainland
Malaysia
Consumption by Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East and Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Molded Interconnect Substrate Technology manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Molded Interconnect Substrate Technology by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Molded Interconnect Substrate Technology in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Molded Interconnect Substrate Technology Market Overview
1.1 Product Definition
1.2 Molded Interconnect Substrate Technology by Type
1.2.1 Global Molded Interconnect Substrate Technology Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Multi-layer MIS
1.2.3 Single-layer MIS
1.3 Molded Interconnect Substrate Technology by Application
1.3.1 Global Molded Interconnect Substrate Technology Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Power IC
1.3.3 RF/5G
1.3.4 Fingerprint Sensor
1.3.5 OIS (Optical Image Stablization)
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Molded Interconnect Substrate Technology Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Molded Interconnect Substrate Technology Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Molded Interconnect Substrate Technology Production Estimates and Forecasts (2020-2031)
1.4.4 Global Molded Interconnect Substrate Technology Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Molded Interconnect Substrate Technology Production Market Share by Manufacturers (2020-2025)
2.2 Global Molded Interconnect Substrate Technology Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Molded Interconnect Substrate Technology, Industry Ranking, 2023 VS 2024
2.4 Global Molded Interconnect Substrate Technology Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Molded Interconnect Substrate Technology Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Molded Interconnect Substrate Technology, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Molded Interconnect Substrate Technology, Product Offered and Application
2.8 Global Key Manufacturers of Molded Interconnect Substrate Technology, Date of Enter into This Industry
2.9 Molded Interconnect Substrate Technology Market Competitive Situation and Trends
2.9.1 Molded Interconnect Substrate Technology Market Concentration Rate
2.9.2 Global 5 and 10 Largest Molded Interconnect Substrate Technology Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Molded Interconnect Substrate Technology Production by Region
3.1 Global Molded Interconnect Substrate Technology Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Molded Interconnect Substrate Technology Production Value by Region (2020-2031)
3.2.1 Global Molded Interconnect Substrate Technology Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Molded Interconnect Substrate Technology by Region (2026-2031)
3.3 Global Molded Interconnect Substrate Technology Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Molded Interconnect Substrate Technology Production Volume by Region (2020-2031)
3.4.1 Global Molded Interconnect Substrate Technology Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Molded Interconnect Substrate Technology by Region (2026-2031)
3.5 Global Molded Interconnect Substrate Technology Market Price Analysis by Region (2020-2025)
3.6 Global Molded Interconnect Substrate Technology Production and Value, Year-over-Year Growth
3.6.1 China Taiwan Molded Interconnect Substrate Technology Production Value Estimates and Forecasts (2020-2031)
3.6.2 China Mainland Molded Interconnect Substrate Technology Production Value Estimates and Forecasts (2020-2031)
3.6.3 Malaysia Molded Interconnect Substrate Technology Production Value Estimates and Forecasts (2020-2031)
4 Molded Interconnect Substrate Technology Consumption by Region
4.1 Global Molded Interconnect Substrate Technology Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Molded Interconnect Substrate Technology Consumption by Region (2020-2031)
4.2.1 Global Molded Interconnect Substrate Technology Consumption by Region (2020-2025)
4.2.2 Global Molded Interconnect Substrate Technology Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Molded Interconnect Substrate Technology Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Molded Interconnect Substrate Technology Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Molded Interconnect Substrate Technology Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Molded Interconnect Substrate Technology Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Molded Interconnect Substrate Technology Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Molded Interconnect Substrate Technology Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Molded Interconnect Substrate Technology Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Molded Interconnect Substrate Technology Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Molded Interconnect Substrate Technology Production by Type (2020-2031)
5.1.1 Global Molded Interconnect Substrate Technology Production by Type (2020-2025)
5.1.2 Global Molded Interconnect Substrate Technology Production by Type (2026-2031)
5.1.3 Global Molded Interconnect Substrate Technology Production Market Share by Type (2020-2031)
5.2 Global Molded Interconnect Substrate Technology Production Value by Type (2020-2031)
5.2.1 Global Molded Interconnect Substrate Technology Production Value by Type (2020-2025)
5.2.2 Global Molded Interconnect Substrate Technology Production Value by Type (2026-2031)
5.2.3 Global Molded Interconnect Substrate Technology Production Value Market Share by Type (2020-2031)
5.3 Global Molded Interconnect Substrate Technology Price by Type (2020-2031)
6 Segment by Application
6.1 Global Molded Interconnect Substrate Technology Production by Application (2020-2031)
6.1.1 Global Molded Interconnect Substrate Technology Production by Application (2020-2025)
6.1.2 Global Molded Interconnect Substrate Technology Production by Application (2026-2031)
6.1.3 Global Molded Interconnect Substrate Technology Production Market Share by Application (2020-2031)
6.2 Global Molded Interconnect Substrate Technology Production Value by Application (2020-2031)
6.2.1 Global Molded Interconnect Substrate Technology Production Value by Application (2020-2025)
6.2.2 Global Molded Interconnect Substrate Technology Production Value by Application (2026-2031)
6.2.3 Global Molded Interconnect Substrate Technology Production Value Market Share by Application (2020-2031)
6.3 Global Molded Interconnect Substrate Technology Price by Application (2020-2031)
7 Key Companies Profiled
7.1 PPt
7.1.1 PPt Molded Interconnect Substrate Technology Company Information
7.1.2 PPt Molded Interconnect Substrate Technology Product Portfolio
7.1.3 PPt Molded Interconnect Substrate Technology Production, Value, Price and Gross Margin (2020-2025)
7.1.4 PPt Main Business and Markets Served
7.1.5 PPt Recent Developments/Updates
7.2 MiSpak Technology
7.2.1 MiSpak Technology Molded Interconnect Substrate Technology Company Information
7.2.2 MiSpak Technology Molded Interconnect Substrate Technology Product Portfolio
7.2.3 MiSpak Technology Molded Interconnect Substrate Technology Production, Value, Price and Gross Margin (2020-2025)
7.2.4 MiSpak Technology Main Business and Markets Served
7.2.5 MiSpak Technology Recent Developments/Updates
7.3 QDOS
7.3.1 QDOS Molded Interconnect Substrate Technology Company Information
7.3.2 QDOS Molded Interconnect Substrate Technology Product Portfolio
7.3.3 QDOS Molded Interconnect Substrate Technology Production, Value, Price and Gross Margin (2020-2025)
7.3.4 QDOS Main Business and Markets Served
7.3.5 QDOS Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Molded Interconnect Substrate Technology Industry Chain Analysis
8.2 Molded Interconnect Substrate Technology Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Molded Interconnect Substrate Technology Production Mode & Process Analysis
8.4 Molded Interconnect Substrate Technology Sales and Marketing
8.4.1 Molded Interconnect Substrate Technology Sales Channels
8.4.2 Molded Interconnect Substrate Technology Distributors
8.5 Molded Interconnect Substrate Technology Customer Analysis
9 Molded Interconnect Substrate Technology Market Dynamics
9.1 Molded Interconnect Substrate Technology Industry Trends
9.2 Molded Interconnect Substrate Technology Market Drivers
9.3 Molded Interconnect Substrate Technology Market Challenges
9.4 Molded Interconnect Substrate Technology Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
PPt
MiSpak Technology
QDOS
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*If Applicable.
