The global market for Multi-chip Module (MCM) Packaging was valued at US$ 333 million in the year 2024 and is projected to reach a revised size of US$ 440 million by 2031, growing at a CAGR of 4.1% during the forecast period.
A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits (ICs or "chips"), semiconductor dies and or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Multi-chip Module (MCM) Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multi-chip Module (MCM) Packaging.
The Multi-chip Module (MCM) Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Multi-chip Module (MCM) Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Multi-chip Module (MCM) Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Cypress
Samsung
Micron Technology
Winbond
Macronix
ISSI
Eon
Microchip
SK Hynix
Intel
Texas Instruments
ASE
Amkor
IBM
Qorvo
by Type
MCM-D
MCM-C
MCM-L
by Application
PC
SSD
Consumer Electronics
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Multi-chip Module (MCM) Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Multi-chip Module (MCM) Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Multi-chip Module (MCM) Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Multi-chip Module (MCM) Packaging Market Overview
1.1 Product Definition
1.2 Multi-chip Module (MCM) Packaging by Type
1.2.1 Global Multi-chip Module (MCM) Packaging Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 MCM-D
1.2.3 MCM-C
1.2.4 MCM-L
1.3 Multi-chip Module (MCM) Packaging by Application
1.3.1 Global Multi-chip Module (MCM) Packaging Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 PC
1.3.3 SSD
1.3.4 Consumer Electronics
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Multi-chip Module (MCM) Packaging Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Multi-chip Module (MCM) Packaging Production Estimates and Forecasts (2020-2031)
1.4.4 Global Multi-chip Module (MCM) Packaging Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Multi-chip Module (MCM) Packaging Production Market Share by Manufacturers (2020-2025)
2.2 Global Multi-chip Module (MCM) Packaging Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Multi-chip Module (MCM) Packaging, Industry Ranking, 2023 VS 2024
2.4 Global Multi-chip Module (MCM) Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Multi-chip Module (MCM) Packaging Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Multi-chip Module (MCM) Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Multi-chip Module (MCM) Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Multi-chip Module (MCM) Packaging, Date of Enter into This Industry
2.9 Multi-chip Module (MCM) Packaging Market Competitive Situation and Trends
2.9.1 Multi-chip Module (MCM) Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Multi-chip Module (MCM) Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Multi-chip Module (MCM) Packaging Production by Region
3.1 Global Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Multi-chip Module (MCM) Packaging Production Value by Region (2020-2031)
3.2.1 Global Multi-chip Module (MCM) Packaging Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Multi-chip Module (MCM) Packaging by Region (2026-2031)
3.3 Global Multi-chip Module (MCM) Packaging Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Multi-chip Module (MCM) Packaging Production Volume by Region (2020-2031)
3.4.1 Global Multi-chip Module (MCM) Packaging Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Multi-chip Module (MCM) Packaging by Region (2026-2031)
3.5 Global Multi-chip Module (MCM) Packaging Market Price Analysis by Region (2020-2025)
3.6 Global Multi-chip Module (MCM) Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2020-2031)
4 Multi-chip Module (MCM) Packaging Consumption by Region
4.1 Global Multi-chip Module (MCM) Packaging Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Multi-chip Module (MCM) Packaging Consumption by Region (2020-2031)
4.2.1 Global Multi-chip Module (MCM) Packaging Consumption by Region (2020-2025)
4.2.2 Global Multi-chip Module (MCM) Packaging Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Multi-chip Module (MCM) Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Multi-chip Module (MCM) Packaging Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Multi-chip Module (MCM) Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Multi-chip Module (MCM) Packaging Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Multi-chip Module (MCM) Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Multi-chip Module (MCM) Packaging Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Multi-chip Module (MCM) Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Multi-chip Module (MCM) Packaging Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Multi-chip Module (MCM) Packaging Production by Type (2020-2031)
5.1.1 Global Multi-chip Module (MCM) Packaging Production by Type (2020-2025)
5.1.2 Global Multi-chip Module (MCM) Packaging Production by Type (2026-2031)
5.1.3 Global Multi-chip Module (MCM) Packaging Production Market Share by Type (2020-2031)
5.2 Global Multi-chip Module (MCM) Packaging Production Value by Type (2020-2031)
5.2.1 Global Multi-chip Module (MCM) Packaging Production Value by Type (2020-2025)
5.2.2 Global Multi-chip Module (MCM) Packaging Production Value by Type (2026-2031)
5.2.3 Global Multi-chip Module (MCM) Packaging Production Value Market Share by Type (2020-2031)
5.3 Global Multi-chip Module (MCM) Packaging Price by Type (2020-2031)
6 Segment by Application
6.1 Global Multi-chip Module (MCM) Packaging Production by Application (2020-2031)
6.1.1 Global Multi-chip Module (MCM) Packaging Production by Application (2020-2025)
6.1.2 Global Multi-chip Module (MCM) Packaging Production by Application (2026-2031)
6.1.3 Global Multi-chip Module (MCM) Packaging Production Market Share by Application (2020-2031)
6.2 Global Multi-chip Module (MCM) Packaging Production Value by Application (2020-2031)
6.2.1 Global Multi-chip Module (MCM) Packaging Production Value by Application (2020-2025)
6.2.2 Global Multi-chip Module (MCM) Packaging Production Value by Application (2026-2031)
6.2.3 Global Multi-chip Module (MCM) Packaging Production Value Market Share by Application (2020-2031)
6.3 Global Multi-chip Module (MCM) Packaging Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Cypress
7.1.1 Cypress Multi-chip Module (MCM) Packaging Company Information
7.1.2 Cypress Multi-chip Module (MCM) Packaging Product Portfolio
7.1.3 Cypress Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Cypress Main Business and Markets Served
7.1.5 Cypress Recent Developments/Updates
7.2 Samsung
7.2.1 Samsung Multi-chip Module (MCM) Packaging Company Information
7.2.2 Samsung Multi-chip Module (MCM) Packaging Product Portfolio
7.2.3 Samsung Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Samsung Main Business and Markets Served
7.2.5 Samsung Recent Developments/Updates
7.3 Micron Technology
7.3.1 Micron Technology Multi-chip Module (MCM) Packaging Company Information
7.3.2 Micron Technology Multi-chip Module (MCM) Packaging Product Portfolio
7.3.3 Micron Technology Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Micron Technology Main Business and Markets Served
7.3.5 Micron Technology Recent Developments/Updates
7.4 Winbond
7.4.1 Winbond Multi-chip Module (MCM) Packaging Company Information
7.4.2 Winbond Multi-chip Module (MCM) Packaging Product Portfolio
7.4.3 Winbond Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Winbond Main Business and Markets Served
7.4.5 Winbond Recent Developments/Updates
7.5 Macronix
7.5.1 Macronix Multi-chip Module (MCM) Packaging Company Information
7.5.2 Macronix Multi-chip Module (MCM) Packaging Product Portfolio
7.5.3 Macronix Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Macronix Main Business and Markets Served
7.5.5 Macronix Recent Developments/Updates
7.6 ISSI
7.6.1 ISSI Multi-chip Module (MCM) Packaging Company Information
7.6.2 ISSI Multi-chip Module (MCM) Packaging Product Portfolio
7.6.3 ISSI Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.6.4 ISSI Main Business and Markets Served
7.6.5 ISSI Recent Developments/Updates
7.7 Eon
7.7.1 Eon Multi-chip Module (MCM) Packaging Company Information
7.7.2 Eon Multi-chip Module (MCM) Packaging Product Portfolio
7.7.3 Eon Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Eon Main Business and Markets Served
7.7.5 Eon Recent Developments/Updates
7.8 Microchip
7.8.1 Microchip Multi-chip Module (MCM) Packaging Company Information
7.8.2 Microchip Multi-chip Module (MCM) Packaging Product Portfolio
7.8.3 Microchip Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Microchip Main Business and Markets Served
7.8.5 Microchip Recent Developments/Updates
7.9 SK Hynix
7.9.1 SK Hynix Multi-chip Module (MCM) Packaging Company Information
7.9.2 SK Hynix Multi-chip Module (MCM) Packaging Product Portfolio
7.9.3 SK Hynix Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.9.4 SK Hynix Main Business and Markets Served
7.9.5 SK Hynix Recent Developments/Updates
7.10 Intel
7.10.1 Intel Multi-chip Module (MCM) Packaging Company Information
7.10.2 Intel Multi-chip Module (MCM) Packaging Product Portfolio
7.10.3 Intel Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Intel Main Business and Markets Served
7.10.5 Intel Recent Developments/Updates
7.11 Texas Instruments
7.11.1 Texas Instruments Multi-chip Module (MCM) Packaging Company Information
7.11.2 Texas Instruments Multi-chip Module (MCM) Packaging Product Portfolio
7.11.3 Texas Instruments Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Texas Instruments Main Business and Markets Served
7.11.5 Texas Instruments Recent Developments/Updates
7.12 ASE
7.12.1 ASE Multi-chip Module (MCM) Packaging Company Information
7.12.2 ASE Multi-chip Module (MCM) Packaging Product Portfolio
7.12.3 ASE Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.12.4 ASE Main Business and Markets Served
7.12.5 ASE Recent Developments/Updates
7.13 Amkor
7.13.1 Amkor Multi-chip Module (MCM) Packaging Company Information
7.13.2 Amkor Multi-chip Module (MCM) Packaging Product Portfolio
7.13.3 Amkor Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Amkor Main Business and Markets Served
7.13.5 Amkor Recent Developments/Updates
7.14 IBM
7.14.1 IBM Multi-chip Module (MCM) Packaging Company Information
7.14.2 IBM Multi-chip Module (MCM) Packaging Product Portfolio
7.14.3 IBM Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.14.4 IBM Main Business and Markets Served
7.14.5 IBM Recent Developments/Updates
7.15 Qorvo
7.15.1 Qorvo Multi-chip Module (MCM) Packaging Company Information
7.15.2 Qorvo Multi-chip Module (MCM) Packaging Product Portfolio
7.15.3 Qorvo Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Qorvo Main Business and Markets Served
7.15.5 Qorvo Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Multi-chip Module (MCM) Packaging Industry Chain Analysis
8.2 Multi-chip Module (MCM) Packaging Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Multi-chip Module (MCM) Packaging Production Mode & Process Analysis
8.4 Multi-chip Module (MCM) Packaging Sales and Marketing
8.4.1 Multi-chip Module (MCM) Packaging Sales Channels
8.4.2 Multi-chip Module (MCM) Packaging Distributors
8.5 Multi-chip Module (MCM) Packaging Customer Analysis
9 Multi-chip Module (MCM) Packaging Market Dynamics
9.1 Multi-chip Module (MCM) Packaging Industry Trends
9.2 Multi-chip Module (MCM) Packaging Market Drivers
9.3 Multi-chip Module (MCM) Packaging Market Challenges
9.4 Multi-chip Module (MCM) Packaging Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Cypress
Samsung
Micron Technology
Winbond
Macronix
ISSI
Eon
Microchip
SK Hynix
Intel
Texas Instruments
ASE
Amkor
IBM
Qorvo
听
听
*If Applicable.
