Multi-chip package (MCP) memory refers to a memory device that contains multiple memory chips in a package. The types included in the MCP memory can be NOR Flash, NAND Flash, DRAM, SRAM, etc.
The global Multi-Chip Package Memory market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Multi-Chip Package Memory, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multi-Chip Package Memory.
Report Scope
The Multi-Chip Package Memory market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Multi-Chip Package Memory market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Multi-Chip Package Memory manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Micron Technology
Cypress Semiconductor
Kingston Technology
Microsemi
Winbond Electronics
Macronix International
Kontron
ON Semiconductor
Samsung Electronics
Artesyn Technologies
Integrated Silicon Solution Inc
Segment by Type
NOR Flash
NAND Flash
DRAM
SRAM
Segment by Application
Comsumer Electronics
Auto Industry
IoT
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Multi-Chip Package Memory manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Multi-Chip Package Memory by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Multi-Chip Package Memory in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Multi-Chip Package Memory Market Overview
1.1 Product Definition
1.2 Multi-Chip Package Memory Segment by Type
1.2.1 Global Multi-Chip Package Memory Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 NOR Flash
1.2.3 NAND Flash
1.2.4 DRAM
1.2.5 SRAM
1.3 Multi-Chip Package Memory Segment by Application
1.3.1 Global Multi-Chip Package Memory Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Comsumer Electronics
1.3.3 Auto Industry
1.3.4 IoT
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Multi-Chip Package Memory Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Multi-Chip Package Memory Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Multi-Chip Package Memory Production Estimates and Forecasts (2019-2030)
1.4.4 Global Multi-Chip Package Memory Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Multi-Chip Package Memory Production Market Share by Manufacturers (2019-2024)
2.2 Global Multi-Chip Package Memory Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Multi-Chip Package Memory, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Multi-Chip Package Memory Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Multi-Chip Package Memory Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Multi-Chip Package Memory, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Multi-Chip Package Memory, Product Offered and Application
2.8 Global Key Manufacturers of Multi-Chip Package Memory, Date of Enter into This Industry
2.9 Multi-Chip Package Memory Market Competitive Situation and Trends
2.9.1 Multi-Chip Package Memory Market Concentration Rate
2.9.2 Global 5 and 10 Largest Multi-Chip Package Memory Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Multi-Chip Package Memory Production by Region
3.1 Global Multi-Chip Package Memory Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Multi-Chip Package Memory Production Value by Region (2019-2030)
3.2.1 Global Multi-Chip Package Memory Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Multi-Chip Package Memory by Region (2025-2030)
3.3 Global Multi-Chip Package Memory Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Multi-Chip Package Memory Production by Region (2019-2030)
3.4.1 Global Multi-Chip Package Memory Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Multi-Chip Package Memory by Region (2025-2030)
3.5 Global Multi-Chip Package Memory Market Price Analysis by Region (2019-2024)
3.6 Global Multi-Chip Package Memory Production and Value, Year-over-Year Growth
3.6.1 North America Multi-Chip Package Memory Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Multi-Chip Package Memory Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Multi-Chip Package Memory Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Multi-Chip Package Memory Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Multi-Chip Package Memory Production Value Estimates and Forecasts (2019-2030)
4 Multi-Chip Package Memory Consumption by Region
4.1 Global Multi-Chip Package Memory Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Multi-Chip Package Memory Consumption by Region (2019-2030)
4.2.1 Global Multi-Chip Package Memory Consumption by Region (2019-2024)
4.2.2 Global Multi-Chip Package Memory Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Multi-Chip Package Memory Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Multi-Chip Package Memory Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Multi-Chip Package Memory Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Multi-Chip Package Memory Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Multi-Chip Package Memory Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Multi-Chip Package Memory Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Multi-Chip Package Memory Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Multi-Chip Package Memory Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Multi-Chip Package Memory Production by Type (2019-2030)
5.1.1 Global Multi-Chip Package Memory Production by Type (2019-2024)
5.1.2 Global Multi-Chip Package Memory Production by Type (2025-2030)
5.1.3 Global Multi-Chip Package Memory Production Market Share by Type (2019-2030)
5.2 Global Multi-Chip Package Memory Production Value by Type (2019-2030)
5.2.1 Global Multi-Chip Package Memory Production Value by Type (2019-2024)
5.2.2 Global Multi-Chip Package Memory Production Value by Type (2025-2030)
5.2.3 Global Multi-Chip Package Memory Production Value Market Share by Type (2019-2030)
5.3 Global Multi-Chip Package Memory Price by Type (2019-2030)
6 Segment by Application
6.1 Global Multi-Chip Package Memory Production by Application (2019-2030)
6.1.1 Global Multi-Chip Package Memory Production by Application (2019-2024)
6.1.2 Global Multi-Chip Package Memory Production by Application (2025-2030)
6.1.3 Global Multi-Chip Package Memory Production Market Share by Application (2019-2030)
6.2 Global Multi-Chip Package Memory Production Value by Application (2019-2030)
6.2.1 Global Multi-Chip Package Memory Production Value by Application (2019-2024)
6.2.2 Global Multi-Chip Package Memory Production Value by Application (2025-2030)
6.2.3 Global Multi-Chip Package Memory Production Value Market Share by Application (2019-2030)
6.3 Global Multi-Chip Package Memory Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Micron Technology
7.1.1 Micron Technology Multi-Chip Package Memory Corporation Information
7.1.2 Micron Technology Multi-Chip Package Memory Product Portfolio
7.1.3 Micron Technology Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Micron Technology Main Business and Markets Served
7.1.5 Micron Technology Recent Developments/Updates
7.2 Cypress Semiconductor
7.2.1 Cypress Semiconductor Multi-Chip Package Memory Corporation Information
7.2.2 Cypress Semiconductor Multi-Chip Package Memory Product Portfolio
7.2.3 Cypress Semiconductor Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Cypress Semiconductor Main Business and Markets Served
7.2.5 Cypress Semiconductor Recent Developments/Updates
7.3 Kingston Technology
7.3.1 Kingston Technology Multi-Chip Package Memory Corporation Information
7.3.2 Kingston Technology Multi-Chip Package Memory Product Portfolio
7.3.3 Kingston Technology Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Kingston Technology Main Business and Markets Served
7.3.5 Kingston Technology Recent Developments/Updates
7.4 Microsemi
7.4.1 Microsemi Multi-Chip Package Memory Corporation Information
7.4.2 Microsemi Multi-Chip Package Memory Product Portfolio
7.4.3 Microsemi Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Microsemi Main Business and Markets Served
7.4.5 Microsemi Recent Developments/Updates
7.5 Winbond Electronics
7.5.1 Winbond Electronics Multi-Chip Package Memory Corporation Information
7.5.2 Winbond Electronics Multi-Chip Package Memory Product Portfolio
7.5.3 Winbond Electronics Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Winbond Electronics Main Business and Markets Served
7.5.5 Winbond Electronics Recent Developments/Updates
7.6 Macronix International
7.6.1 Macronix International Multi-Chip Package Memory Corporation Information
7.6.2 Macronix International Multi-Chip Package Memory Product Portfolio
7.6.3 Macronix International Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Macronix International Main Business and Markets Served
7.6.5 Macronix International Recent Developments/Updates
7.7 Kontron
7.7.1 Kontron Multi-Chip Package Memory Corporation Information
7.7.2 Kontron Multi-Chip Package Memory Product Portfolio
7.7.3 Kontron Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Kontron Main Business and Markets Served
7.7.5 Kontron Recent Developments/Updates
7.8 ON Semiconductor
7.8.1 ON Semiconductor Multi-Chip Package Memory Corporation Information
7.8.2 ON Semiconductor Multi-Chip Package Memory Product Portfolio
7.8.3 ON Semiconductor Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.8.4 ON Semiconductor Main Business and Markets Served
7.7.5 ON Semiconductor Recent Developments/Updates
7.9 Samsung Electronics
7.9.1 Samsung Electronics Multi-Chip Package Memory Corporation Information
7.9.2 Samsung Electronics Multi-Chip Package Memory Product Portfolio
7.9.3 Samsung Electronics Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Samsung Electronics Main Business and Markets Served
7.9.5 Samsung Electronics Recent Developments/Updates
7.10 Artesyn Technologies
7.10.1 Artesyn Technologies Multi-Chip Package Memory Corporation Information
7.10.2 Artesyn Technologies Multi-Chip Package Memory Product Portfolio
7.10.3 Artesyn Technologies Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Artesyn Technologies Main Business and Markets Served
7.10.5 Artesyn Technologies Recent Developments/Updates
7.11 Integrated Silicon Solution Inc
7.11.1 Integrated Silicon Solution Inc Multi-Chip Package Memory Corporation Information
7.11.2 Integrated Silicon Solution Inc Multi-Chip Package Memory Product Portfolio
7.11.3 Integrated Silicon Solution Inc Multi-Chip Package Memory Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Integrated Silicon Solution Inc Main Business and Markets Served
7.11.5 Integrated Silicon Solution Inc Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Multi-Chip Package Memory Industry Chain Analysis
8.2 Multi-Chip Package Memory Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Multi-Chip Package Memory Production Mode & Process
8.4 Multi-Chip Package Memory Sales and Marketing
8.4.1 Multi-Chip Package Memory Sales Channels
8.4.2 Multi-Chip Package Memory Distributors
8.5 Multi-Chip Package Memory Customers
9 Multi-Chip Package Memory Market Dynamics
9.1 Multi-Chip Package Memory Industry Trends
9.2 Multi-Chip Package Memory Market Drivers
9.3 Multi-Chip Package Memory Market Challenges
9.4 Multi-Chip Package Memory Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Micron Technology
Cypress Semiconductor
Kingston Technology
Microsemi
Winbond Electronics
Macronix International
Kontron
ON Semiconductor
Samsung Electronics
Artesyn Technologies
Integrated Silicon Solution Inc
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*If Applicable.
