Global Multiple Chip Package (MCP) Market Research Report 2024

Publication ID:

PB503251112

Publication Date:

March 27, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global Multiple Chip Package (MCP) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Multiple Chip Package (MCP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multiple Chip Package (MCP).
Report Scope
The Multiple Chip Package (MCP) market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Multiple Chip Package (MCP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Multiple Chip Package (MCP) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Dosilicon
Samsung
Texas Instruments
Infineon (Cypress)
Micron Technology
Macronix
Winbond Electronics Corp
Segment by Type
e.MMC-Based MCP
UFS-Based MCP (uMCP)
NAND-Based MCP
Segment by Application
Electronic Products
Industrial Manufacture
Medical Industry
Communications Industry
Other
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Multiple Chip Package (MCP) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Multiple Chip Package (MCP) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Multiple Chip Package (MCP) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Multiple Chip Package (MCP) Market Overview
1.1 Product Definition
1.2 Multiple Chip Package (MCP) Segment by Type
1.2.1 Global Multiple Chip Package (MCP) Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 e.MMC-Based MCP
1.2.3 UFS-Based MCP (uMCP)
1.2.4 NAND-Based MCP
1.3 Multiple Chip Package (MCP) Segment by Application
1.3.1 Global Multiple Chip Package (MCP) Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Electronic Products
1.3.3 Industrial Manufacture
1.3.4 Medical Industry
1.3.5 Communications Industry
1.3.6 Other
1.4 Global Market Growth Prospects
1.4.1 Global Multiple Chip Package (MCP) Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Multiple Chip Package (MCP) Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Multiple Chip Package (MCP) Production Estimates and Forecasts (2019-2030)
1.4.4 Global Multiple Chip Package (MCP) Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Multiple Chip Package (MCP) Production Market Share by Manufacturers (2019-2024)
2.2 Global Multiple Chip Package (MCP) Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Multiple Chip Package (MCP), Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Multiple Chip Package (MCP) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Multiple Chip Package (MCP) Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Multiple Chip Package (MCP), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Multiple Chip Package (MCP), Product Offered and Application
2.8 Global Key Manufacturers of Multiple Chip Package (MCP), Date of Enter into This Industry
2.9 Multiple Chip Package (MCP) Market Competitive Situation and Trends
2.9.1 Multiple Chip Package (MCP) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Multiple Chip Package (MCP) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Multiple Chip Package (MCP) Production by Region
3.1 Global Multiple Chip Package (MCP) Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Multiple Chip Package (MCP) Production Value by Region (2019-2030)
3.2.1 Global Multiple Chip Package (MCP) Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Multiple Chip Package (MCP) by Region (2025-2030)
3.3 Global Multiple Chip Package (MCP) Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Multiple Chip Package (MCP) Production by Region (2019-2030)
3.4.1 Global Multiple Chip Package (MCP) Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Multiple Chip Package (MCP) by Region (2025-2030)
3.5 Global Multiple Chip Package (MCP) Market Price Analysis by Region (2019-2024)
3.6 Global Multiple Chip Package (MCP) Production and Value, Year-over-Year Growth
3.6.1 North America Multiple Chip Package (MCP) Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Multiple Chip Package (MCP) Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Multiple Chip Package (MCP) Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Multiple Chip Package (MCP) Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Multiple Chip Package (MCP) Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan Multiple Chip Package (MCP) Production Value Estimates and Forecasts (2019-2030)
4 Multiple Chip Package (MCP) Consumption by Region
4.1 Global Multiple Chip Package (MCP) Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Multiple Chip Package (MCP) Consumption by Region (2019-2030)
4.2.1 Global Multiple Chip Package (MCP) Consumption by Region (2019-2024)
4.2.2 Global Multiple Chip Package (MCP) Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Multiple Chip Package (MCP) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Multiple Chip Package (MCP) Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Multiple Chip Package (MCP) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Multiple Chip Package (MCP) Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Multiple Chip Package (MCP) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Multiple Chip Package (MCP) Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Multiple Chip Package (MCP) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Multiple Chip Package (MCP) Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Multiple Chip Package (MCP) Production by Type (2019-2030)
5.1.1 Global Multiple Chip Package (MCP) Production by Type (2019-2024)
5.1.2 Global Multiple Chip Package (MCP) Production by Type (2025-2030)
5.1.3 Global Multiple Chip Package (MCP) Production Market Share by Type (2019-2030)
5.2 Global Multiple Chip Package (MCP) Production Value by Type (2019-2030)
5.2.1 Global Multiple Chip Package (MCP) Production Value by Type (2019-2024)
5.2.2 Global Multiple Chip Package (MCP) Production Value by Type (2025-2030)
5.2.3 Global Multiple Chip Package (MCP) Production Value Market Share by Type (2019-2030)
5.3 Global Multiple Chip Package (MCP) Price by Type (2019-2030)
6 Segment by Application
6.1 Global Multiple Chip Package (MCP) Production by Application (2019-2030)
6.1.1 Global Multiple Chip Package (MCP) Production by Application (2019-2024)
6.1.2 Global Multiple Chip Package (MCP) Production by Application (2025-2030)
6.1.3 Global Multiple Chip Package (MCP) Production Market Share by Application (2019-2030)
6.2 Global Multiple Chip Package (MCP) Production Value by Application (2019-2030)
6.2.1 Global Multiple Chip Package (MCP) Production Value by Application (2019-2024)
6.2.2 Global Multiple Chip Package (MCP) Production Value by Application (2025-2030)
6.2.3 Global Multiple Chip Package (MCP) Production Value Market Share by Application (2019-2030)
6.3 Global Multiple Chip Package (MCP) Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Dosilicon
7.1.1 Dosilicon Multiple Chip Package (MCP) Corporation Information
7.1.2 Dosilicon Multiple Chip Package (MCP) Product Portfolio
7.1.3 Dosilicon Multiple Chip Package (MCP) Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Dosilicon Main Business and Markets Served
7.1.5 Dosilicon Recent Developments/Updates
7.2 Samsung
7.2.1 Samsung Multiple Chip Package (MCP) Corporation Information
7.2.2 Samsung Multiple Chip Package (MCP) Product Portfolio
7.2.3 Samsung Multiple Chip Package (MCP) Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Samsung Main Business and Markets Served
7.2.5 Samsung Recent Developments/Updates
7.3 Texas Instruments
7.3.1 Texas Instruments Multiple Chip Package (MCP) Corporation Information
7.3.2 Texas Instruments Multiple Chip Package (MCP) Product Portfolio
7.3.3 Texas Instruments Multiple Chip Package (MCP) Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Texas Instruments Main Business and Markets Served
7.3.5 Texas Instruments Recent Developments/Updates
7.4 Infineon (Cypress)
7.4.1 Infineon (Cypress) Multiple Chip Package (MCP) Corporation Information
7.4.2 Infineon (Cypress) Multiple Chip Package (MCP) Product Portfolio
7.4.3 Infineon (Cypress) Multiple Chip Package (MCP) Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Infineon (Cypress) Main Business and Markets Served
7.4.5 Infineon (Cypress) Recent Developments/Updates
7.5 Micron Technology
7.5.1 Micron Technology Multiple Chip Package (MCP) Corporation Information
7.5.2 Micron Technology Multiple Chip Package (MCP) Product Portfolio
7.5.3 Micron Technology Multiple Chip Package (MCP) Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Micron Technology Main Business and Markets Served
7.5.5 Micron Technology Recent Developments/Updates
7.6 Macronix
7.6.1 Macronix Multiple Chip Package (MCP) Corporation Information
7.6.2 Macronix Multiple Chip Package (MCP) Product Portfolio
7.6.3 Macronix Multiple Chip Package (MCP) Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Macronix Main Business and Markets Served
7.6.5 Macronix Recent Developments/Updates
7.7 Winbond Electronics Corp
7.7.1 Winbond Electronics Corp Multiple Chip Package (MCP) Corporation Information
7.7.2 Winbond Electronics Corp Multiple Chip Package (MCP) Product Portfolio
7.7.3 Winbond Electronics Corp Multiple Chip Package (MCP) Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Winbond Electronics Corp Main Business and Markets Served
7.7.5 Winbond Electronics Corp Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Multiple Chip Package (MCP) Industry Chain Analysis
8.2 Multiple Chip Package (MCP) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Multiple Chip Package (MCP) Production Mode & Process
8.4 Multiple Chip Package (MCP) Sales and Marketing
8.4.1 Multiple Chip Package (MCP) Sales Channels
8.4.2 Multiple Chip Package (MCP) Distributors
8.5 Multiple Chip Package (MCP) Customers
9 Multiple Chip Package (MCP) Market Dynamics
9.1 Multiple Chip Package (MCP) Industry Trends
9.2 Multiple Chip Package (MCP) Market Drivers
9.3 Multiple Chip Package (MCP) Market Challenges
9.4 Multiple Chip Package (MCP) Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

Dosilicon
Samsung
Texas Instruments
Infineon (Cypress)
Micron Technology
Macronix
Winbond Electronics Corp

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