Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF chips, sensors, etc.). Similar to the memory chip packaging substrate, it plays a key role in chip packaging, providing electrical connection, mechanical support, heat dissipation management and other functions, but its design and application requirements may be different.
The global Non-Memory Chip Packaging Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Non-Memory Chip Packaging Substrate is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Non-Memory Chip Packaging Substrate is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Non-Memory Chip Packaging Substrate include Ibiden, Shinko, kyocera, LGInnotek, Samsung Electro Mechanics, AT&S, ASE Group, Unimicron, KINSUS, Hemei Jingyi Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Non-Memory Chip Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Non-Memory Chip Packaging Substrate.
The Non-Memory Chip Packaging Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Non-Memory Chip Packaging Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Non-Memory Chip Packaging Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Ibiden
Shinko
kyocera
LGInnotek
Samsung Electro Mechanics
AT&S
ASE Group
Unimicron
KINSUS
Hemei Jingyi Technology
NanYa PCB
Simmtech
by Type
Logic Chip Packaging Substrate
Communication Chip Packaging Substrate
Sensor Chip Packaging Substrate
Others
by Application
Consumer Electronics
Industrial Control
Communication Equipment
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Non-Memory Chip Packaging Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Non-Memory Chip Packaging Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Non-Memory Chip Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Non-Memory Chip Packaging Substrate Market Overview
1.1 Product Definition
1.2 Non-Memory Chip Packaging Substrate by Type
1.2.1 Global Non-Memory Chip Packaging Substrate Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Logic Chip Packaging Substrate
1.2.3 Communication Chip Packaging Substrate
1.2.4 Sensor Chip Packaging Substrate
1.2.5 Others
1.3 Non-Memory Chip Packaging Substrate by Application
1.3.1 Global Non-Memory Chip Packaging Substrate Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Industrial Control
1.3.4 Communication Equipment
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Non-Memory Chip Packaging Substrate Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Non-Memory Chip Packaging Substrate Production Estimates and Forecasts (2019-2030)
1.4.4 Global Non-Memory Chip Packaging Substrate Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Non-Memory Chip Packaging Substrate Production Market Share by Manufacturers (2019-2024)
2.2 Global Non-Memory Chip Packaging Substrate Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Non-Memory Chip Packaging Substrate, Industry Ranking, 2022 VS 2023
2.4 Global Non-Memory Chip Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Non-Memory Chip Packaging Substrate Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Product Type & Application
2.8 Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Date of Enter into This Industry
2.9 Global Non-Memory Chip Packaging Substrate Market Competitive Situation and Trends
2.9.1 Global Non-Memory Chip Packaging Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Non-Memory Chip Packaging Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Non-Memory Chip Packaging Substrate Production by Region
3.1 Global Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Non-Memory Chip Packaging Substrate Production Value by Region (2019-2030)
3.2.1 Global Non-Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Non-Memory Chip Packaging Substrate by Region (2025-2030)
3.3 Global Non-Memory Chip Packaging Substrate Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Non-Memory Chip Packaging Substrate Production by Region (2019-2030)
3.4.1 Global Non-Memory Chip Packaging Substrate Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Non-Memory Chip Packaging Substrate by Region (2025-2030)
3.5 Global Non-Memory Chip Packaging Substrate Market Price Analysis by Region (2019-2024)
3.6 Global Non-Memory Chip Packaging Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
4 Non-Memory Chip Packaging Substrate Consumption by Region
4.1 Global Non-Memory Chip Packaging Substrate Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Non-Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.2.1 Global Non-Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.2.2 Global Non-Memory Chip Packaging Substrate Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Non-Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Non-Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Non-Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Non-Memory Chip Packaging Substrate Production by Type (2019-2030)
5.1.1 Global Non-Memory Chip Packaging Substrate Production by Type (2019-2024)
5.1.2 Global Non-Memory Chip Packaging Substrate Production by Type (2025-2030)
5.1.3 Global Non-Memory Chip Packaging Substrate Production Market Share by Type (2019-2030)
5.2 Global Non-Memory Chip Packaging Substrate Production Value by Type (2019-2030)
5.2.1 Global Non-Memory Chip Packaging Substrate Production Value by Type (2019-2024)
5.2.2 Global Non-Memory Chip Packaging Substrate Production Value by Type (2025-2030)
5.2.3 Global Non-Memory Chip Packaging Substrate Production Value Market Share by Type (2019-2030)
5.3 Global Non-Memory Chip Packaging Substrate Price by Type (2019-2030)
6 Segment by Application
6.1 Global Non-Memory Chip Packaging Substrate Production by Application (2019-2030)
6.1.1 Global Non-Memory Chip Packaging Substrate Production by Application (2019-2024)
6.1.2 Global Non-Memory Chip Packaging Substrate Production by Application (2025-2030)
6.1.3 Global Non-Memory Chip Packaging Substrate Production Market Share by Application (2019-2030)
6.2 Global Non-Memory Chip Packaging Substrate Production Value by Application (2019-2030)
6.2.1 Global Non-Memory Chip Packaging Substrate Production Value by Application (2019-2024)
6.2.2 Global Non-Memory Chip Packaging Substrate Production Value by Application (2025-2030)
6.2.3 Global Non-Memory Chip Packaging Substrate Production Value Market Share by Application (2019-2030)
6.3 Global Non-Memory Chip Packaging Substrate Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Ibiden
7.1.1 Ibiden Non-Memory Chip Packaging Substrate Company Information
7.1.2 Ibiden Non-Memory Chip Packaging Substrate Product Portfolio
7.1.3 Ibiden Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Ibiden Main Business and Markets Served
7.1.5 Ibiden Recent Developments/Updates
7.2 Shinko
7.2.1 Shinko Non-Memory Chip Packaging Substrate Company Information
7.2.2 Shinko Non-Memory Chip Packaging Substrate Product Portfolio
7.2.3 Shinko Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Shinko Main Business and Markets Served
7.2.5 Shinko Recent Developments/Updates
7.3 kyocera
7.3.1 kyocera Non-Memory Chip Packaging Substrate Company Information
7.3.2 kyocera Non-Memory Chip Packaging Substrate Product Portfolio
7.3.3 kyocera Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.3.4 kyocera Main Business and Markets Served
7.3.5 kyocera Recent Developments/Updates
7.4 LGInnotek
7.4.1 LGInnotek Non-Memory Chip Packaging Substrate Company Information
7.4.2 LGInnotek Non-Memory Chip Packaging Substrate Product Portfolio
7.4.3 LGInnotek Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.4.4 LGInnotek Main Business and Markets Served
7.4.5 LGInnotek Recent Developments/Updates
7.5 Samsung Electro Mechanics
7.5.1 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Company Information
7.5.2 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Product Portfolio
7.5.3 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Samsung Electro Mechanics Main Business and Markets Served
7.5.5 Samsung Electro Mechanics Recent Developments/Updates
7.6 AT&S
7.6.1 AT&S Non-Memory Chip Packaging Substrate Company Information
7.6.2 AT&S Non-Memory Chip Packaging Substrate Product Portfolio
7.6.3 AT&S Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.6.4 AT&S Main Business and Markets Served
7.6.5 AT&S Recent Developments/Updates
7.7 ASE Group
7.7.1 ASE Group Non-Memory Chip Packaging Substrate Company Information
7.7.2 ASE Group Non-Memory Chip Packaging Substrate Product Portfolio
7.7.3 ASE Group Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.7.4 ASE Group Main Business and Markets Served
7.7.5 ASE Group Recent Developments/Updates
7.8 Unimicron
7.8.1 Unimicron Non-Memory Chip Packaging Substrate Company Information
7.8.2 Unimicron Non-Memory Chip Packaging Substrate Product Portfolio
7.8.3 Unimicron Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Unimicron Main Business and Markets Served
7.8.5 Unimicron Recent Developments/Updates
7.9 KINSUS
7.9.1 KINSUS Non-Memory Chip Packaging Substrate Company Information
7.9.2 KINSUS Non-Memory Chip Packaging Substrate Product Portfolio
7.9.3 KINSUS Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.9.4 KINSUS Main Business and Markets Served
7.9.5 KINSUS Recent Developments/Updates
7.10 Hemei Jingyi Technology
7.10.1 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Company Information
7.10.2 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Product Portfolio
7.10.3 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Hemei Jingyi Technology Main Business and Markets Served
7.10.5 Hemei Jingyi Technology Recent Developments/Updates
7.11 NanYa PCB
7.11.1 NanYa PCB Non-Memory Chip Packaging Substrate Company Information
7.11.2 NanYa PCB Non-Memory Chip Packaging Substrate Product Portfolio
7.11.3 NanYa PCB Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.11.4 NanYa PCB Main Business and Markets Served
7.11.5 NanYa PCB Recent Developments/Updates
7.12 Simmtech
7.12.1 Simmtech Non-Memory Chip Packaging Substrate Company Information
7.12.2 Simmtech Non-Memory Chip Packaging Substrate Product Portfolio
7.12.3 Simmtech Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Simmtech Main Business and Markets Served
7.12.5 Simmtech Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Non-Memory Chip Packaging Substrate Industry Chain Analysis
8.2 Non-Memory Chip Packaging Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Non-Memory Chip Packaging Substrate Production Mode & Process
8.4 Non-Memory Chip Packaging Substrate Sales and Marketing
8.4.1 Non-Memory Chip Packaging Substrate Sales Channels
8.4.2 Non-Memory Chip Packaging Substrate Distributors
8.5 Non-Memory Chip Packaging Substrate Customers
9 Non-Memory Chip Packaging Substrate Market Dynamics
9.1 Non-Memory Chip Packaging Substrate Industry Trends
9.2 Non-Memory Chip Packaging Substrate Market Drivers
9.3 Non-Memory Chip Packaging Substrate Market Challenges
9.4 Non-Memory Chip Packaging Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Ibiden
Shinko
kyocera
LGInnotek
Samsung Electro Mechanics
AT&S
ASE Group
Unimicron
KINSUS
Hemei Jingyi Technology
NanYa PCB
Simmtech
听
听
*If Applicable.
