Global Outsourced Semiconductor Assembly and Testing Market Research Report 2023

Publication ID:

PB504248450

Publication Date:

May 1, 2023

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Manufacturers [2]

Machinery [3]

Industry & Manufacturing [4]

Description:

OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services.The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries.
Highlights
The global Outsourced Semiconductor Assembly and Testing market was valued at US$ 63340 million in 2022 and is anticipated to reach US$ 85860 million by 2029, witnessing a CAGR of 5.2% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global Outsourced Semiconductor Assembly and Test (OSAT) key players include ASE Group, Amkor, JECT, SPIL, etc. Global top four manufacturers hold a share over 30%.
United States is the largest market, with a share about 30%, followed by China, and China Taiwan, both have a share about 35 percent.
In terms of product, Assembly Service is the largest segment, with a share about 80%. And in terms of application, the largest application is Communications, followed by Automotive, Computing, Consumer, etc.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Outsourced Semiconductor Assembly and Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Outsourced Semiconductor Assembly and Testing.
The Outsourced Semiconductor Assembly and Testing market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Outsourced Semiconductor Assembly and Testing market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Outsourced Semiconductor Assembly and Testing companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
ASE Technology Holding
Amkor Technology
Jiangsu Changjiang Electronics Technology
Powertech Technology Inc.
Tianshui Huatian Technology Co., LTD.
TongFu Microelectronics Co., LTD.
King Yuan Electronics Co., Ltd.
STATS ChipPAC
Siliconware Precision Industries
Unisem Group
UTAC Group
Chipbond Technology Corporation
ChipMOS Technologies
Segment by Type
Outsourced Semiconductor Testing
Outsourced Semiconductor Assembly
Segment by Application
Automotive
Consumer Electronics
Industrial
Telecommunication
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Outsourced Semiconductor Assembly and Testing companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Outsourced Semiconductor Assembly and Testing Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Outsourced Semiconductor Testing
1.2.3 Outsourced Semiconductor Assembly
1.3 Market by Application
1.3.1 Global Outsourced Semiconductor Assembly and Testing Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Automotive
1.3.3 Consumer Electronics
1.3.4 Industrial
1.3.5 Telecommunication
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Outsourced Semiconductor Assembly and Testing Market Perspective (2018-2029)
2.2 Outsourced Semiconductor Assembly and Testing Growth Trends by Region
2.2.1 Global Outsourced Semiconductor Assembly and Testing Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Outsourced Semiconductor Assembly and Testing Historic Market Size by Region (2018-2023)
2.2.3 Outsourced Semiconductor Assembly and Testing Forecasted Market Size by Region (2024-2029)
2.3 Outsourced Semiconductor Assembly and Testing Market Dynamics
2.3.1 Outsourced Semiconductor Assembly and Testing Industry Trends
2.3.2 Outsourced Semiconductor Assembly and Testing Market Drivers
2.3.3 Outsourced Semiconductor Assembly and Testing Market Challenges
2.3.4 Outsourced Semiconductor Assembly and Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Outsourced Semiconductor Assembly and Testing Players by Revenue
3.1.1 Global Top Outsourced Semiconductor Assembly and Testing Players by Revenue (2018-2023)
3.1.2 Global Outsourced Semiconductor Assembly and Testing Revenue Market Share by Players (2018-2023)
3.2 Global Outsourced Semiconductor Assembly and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Outsourced Semiconductor Assembly and Testing Revenue
3.4 Global Outsourced Semiconductor Assembly and Testing Market Concentration Ratio
3.4.1 Global Outsourced Semiconductor Assembly and Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Outsourced Semiconductor Assembly and Testing Revenue in 2022
3.5 Outsourced Semiconductor Assembly and Testing Key Players Head office and Area Served
3.6 Key Players Outsourced Semiconductor Assembly and Testing Product Solution and Service
3.7 Date of Enter into Outsourced Semiconductor Assembly and Testing Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Outsourced Semiconductor Assembly and Testing Breakdown Data by Type
4.1 Global Outsourced Semiconductor Assembly and Testing Historic Market Size by Type (2018-2023)
4.2 Global Outsourced Semiconductor Assembly and Testing Forecasted Market Size by Type (2024-2029)
5 Outsourced Semiconductor Assembly and Testing Breakdown Data by Application
5.1 Global Outsourced Semiconductor Assembly and Testing Historic Market Size by Application (2018-2023)
5.2 Global Outsourced Semiconductor Assembly and Testing Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Outsourced Semiconductor Assembly and Testing Market Size (2018-2029)
6.2 North America Outsourced Semiconductor Assembly and Testing Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Outsourced Semiconductor Assembly and Testing Market Size by Country (2018-2023)
6.4 North America Outsourced Semiconductor Assembly and Testing Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Outsourced Semiconductor Assembly and Testing Market Size (2018-2029)
7.2 Europe Outsourced Semiconductor Assembly and Testing Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Outsourced Semiconductor Assembly and Testing Market Size by Country (2018-2023)
7.4 Europe Outsourced Semiconductor Assembly and Testing Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Outsourced Semiconductor Assembly and Testing Market Size (2018-2029)
8.2 Asia-Pacific Outsourced Semiconductor Assembly and Testing Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Outsourced Semiconductor Assembly and Testing Market Size by Region (2018-2023)
8.4 Asia-Pacific Outsourced Semiconductor Assembly and Testing Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Outsourced Semiconductor Assembly and Testing Market Size (2018-2029)
9.2 Latin America Outsourced Semiconductor Assembly and Testing Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Outsourced Semiconductor Assembly and Testing Market Size by Country (2018-2023)
9.4 Latin America Outsourced Semiconductor Assembly and Testing Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Outsourced Semiconductor Assembly and Testing Market Size (2018-2029)
10.2 Middle East & Africa Outsourced Semiconductor Assembly and Testing Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Outsourced Semiconductor Assembly and Testing Market Size by Country (2018-2023)
10.4 Middle East & Africa Outsourced Semiconductor Assembly and Testing Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Technology Holding
11.1.1 ASE Technology Holding Company Detail
11.1.2 ASE Technology Holding Business Overview
11.1.3 ASE Technology Holding Outsourced Semiconductor Assembly and Testing Introduction
11.1.4 ASE Technology Holding Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.1.5 ASE Technology Holding Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Outsourced Semiconductor Assembly and Testing Introduction
11.2.4 Amkor Technology Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.2.5 Amkor Technology Recent Development
11.3 Jiangsu Changjiang Electronics Technology
11.3.1 Jiangsu Changjiang Electronics Technology Company Detail
11.3.2 Jiangsu Changjiang Electronics Technology Business Overview
11.3.3 Jiangsu Changjiang Electronics Technology Outsourced Semiconductor Assembly and Testing Introduction
11.3.4 Jiangsu Changjiang Electronics Technology Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.3.5 Jiangsu Changjiang Electronics Technology Recent Development
11.4 Powertech Technology Inc.
11.4.1 Powertech Technology Inc. Company Detail
11.4.2 Powertech Technology Inc. Business Overview
11.4.3 Powertech Technology Inc. Outsourced Semiconductor Assembly and Testing Introduction
11.4.4 Powertech Technology Inc. Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.4.5 Powertech Technology Inc. Recent Development
11.5 Tianshui Huatian Technology Co., LTD.
11.5.1 Tianshui Huatian Technology Co., LTD. Company Detail
11.5.2 Tianshui Huatian Technology Co., LTD. Business Overview
11.5.3 Tianshui Huatian Technology Co., LTD. Outsourced Semiconductor Assembly and Testing Introduction
11.5.4 Tianshui Huatian Technology Co., LTD. Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.5.5 Tianshui Huatian Technology Co., LTD. Recent Development
11.6 TongFu Microelectronics Co., LTD.
11.6.1 TongFu Microelectronics Co., LTD. Company Detail
11.6.2 TongFu Microelectronics Co., LTD. Business Overview
11.6.3 TongFu Microelectronics Co., LTD. Outsourced Semiconductor Assembly and Testing Introduction
11.6.4 TongFu Microelectronics Co., LTD. Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.6.5 TongFu Microelectronics Co., LTD. Recent Development
11.7 King Yuan Electronics Co., Ltd.
11.7.1 King Yuan Electronics Co., Ltd. Company Detail
11.7.2 King Yuan Electronics Co., Ltd. Business Overview
11.7.3 King Yuan Electronics Co., Ltd. Outsourced Semiconductor Assembly and Testing Introduction
11.7.4 King Yuan Electronics Co., Ltd. Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.7.5 King Yuan Electronics Co., Ltd. Recent Development
11.8 STATS ChipPAC
11.8.1 STATS ChipPAC Company Detail
11.8.2 STATS ChipPAC Business Overview
11.8.3 STATS ChipPAC Outsourced Semiconductor Assembly and Testing Introduction
11.8.4 STATS ChipPAC Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.8.5 STATS ChipPAC Recent Development
11.9 Siliconware Precision Industries
11.9.1 Siliconware Precision Industries Company Detail
11.9.2 Siliconware Precision Industries Business Overview
11.9.3 Siliconware Precision Industries Outsourced Semiconductor Assembly and Testing Introduction
11.9.4 Siliconware Precision Industries Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.9.5 Siliconware Precision Industries Recent Development
11.10 Unisem Group
11.10.1 Unisem Group Company Detail
11.10.2 Unisem Group Business Overview
11.10.3 Unisem Group Outsourced Semiconductor Assembly and Testing Introduction
11.10.4 Unisem Group Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.10.5 Unisem Group Recent Development
11.11 UTAC Group
11.11.1 UTAC Group Company Detail
11.11.2 UTAC Group Business Overview
11.11.3 UTAC Group Outsourced Semiconductor Assembly and Testing Introduction
11.11.4 UTAC Group Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.11.5 UTAC Group Recent Development
11.12 Chipbond Technology Corporation
11.12.1 Chipbond Technology Corporation Company Detail
11.12.2 Chipbond Technology Corporation Business Overview
11.12.3 Chipbond Technology Corporation Outsourced Semiconductor Assembly and Testing Introduction
11.12.4 Chipbond Technology Corporation Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.12.5 Chipbond Technology Corporation Recent Development
11.13 ChipMOS Technologies
11.13.1 ChipMOS Technologies Company Detail
11.13.2 ChipMOS Technologies Business Overview
11.13.3 ChipMOS Technologies Outsourced Semiconductor Assembly and Testing Introduction
11.13.4 ChipMOS Technologies Revenue in Outsourced Semiconductor Assembly and Testing Business (2018-2023)
11.13.5 ChipMOS Technologies Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

ASE Technology Holding
Amkor Technology
Jiangsu Changjiang Electronics Technology
Powertech Technology Inc.
Tianshui Huatian Technology Co., LTD.
TongFu Microelectronics Co., LTD.
King Yuan Electronics Co., Ltd.
STATS ChipPAC
Siliconware Precision Industries
Unisem Group
UTAC Group
Chipbond Technology Corporation
ChipMOS Technologies

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