Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries. This report focuses on Outsourced Semiconductor Assembly Service market.
Market Analysis and Insights: Global Outsourced Semiconductor Assembly Service Market
The global Outsourced Semiconductor Assembly Service market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The US & Canada market for Outsourced Semiconductor Assembly Service is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The China market for Outsourced Semiconductor Assembly Service is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The Europe market for Outsourced Semiconductor Assembly Service is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global key companies of Outsourced Semiconductor Assembly Service include ASE, Amkor Technology, JCET, SPIL, Powertech Technology Inc., TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc. in 2022, the global top five players had a share approximately % in terms of revenue.
Report Includes
This report presents an overview of global market for Outsourced Semiconductor Assembly Service market size. Analyses of the global market trends, with historic market revenue data for 2018 - 2022, estimates for 2023, and projections of CAGR through 2029.
This report researches the key producers of Outsourced Semiconductor Assembly Service, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Outsourced Semiconductor Assembly Service, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Outsourced Semiconductor Assembly Service revenue, market share and industry ranking of main companies, data from 2018 to 2023. Identification of the major stakeholders in the global Outsourced Semiconductor Assembly Service market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by type and by application, revenue, and growth rate, from 2018 to 2029. Evaluation and forecast the market size for Outsourced Semiconductor Assembly Service revenue, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including ASE, Amkor Technology, JCET, SPIL, Powertech Technology Inc., TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc.
By Company
ASE
Amkor Technology
JCET
SPIL
Powertech Technology Inc.
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
Segment by Type
Advanced Packaging
Traditional Packaging
Segment by Application
Automotive and Transportation
Consumer Electronics
Communication
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East, Africa, and Latin America
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Outsourced Semiconductor Assembly Service in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Outsourced Semiconductor Assembly Service companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America by type, by application and by country, revenue for each segment.
Chapter 7: Europe by type, by application and by country, revenue for each segment.
Chapter 8: China by type and by application revenue for each segment.
Chapter 9: Asia (excluding China) by type, by application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by type, by application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Outsourced Semiconductor Assembly Service revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Outsourced Semiconductor Assembly Service Market Size Growth Rate by Type, 2018 VS 2022 VS 2029
1.2.2 Advanced Packaging
1.2.3 Traditional Packaging
1.3 Market by Application
1.3.1 Global Outsourced Semiconductor Assembly Service Market Size Growth Rate by Application, 2018 VS 2022 VS 2029
1.3.2 Automotive and Transportation
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Outsourced Semiconductor Assembly Service Market Perspective (2018-2029)
2.2 Global Outsourced Semiconductor Assembly Service Growth Trends by Region
2.2.1 Outsourced Semiconductor Assembly Service Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Outsourced Semiconductor Assembly Service Historic Market Size by Region (2018-2023)
2.2.3 Outsourced Semiconductor Assembly Service Forecasted Market Size by Region (2024-2029)
2.3 Outsourced Semiconductor Assembly Service Market Dynamics
2.3.1 Outsourced Semiconductor Assembly Service Industry Trends
2.3.2 Outsourced Semiconductor Assembly Service Market Drivers
2.3.3 Outsourced Semiconductor Assembly Service Market Challenges
2.3.4 Outsourced Semiconductor Assembly Service Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Outsourced Semiconductor Assembly Service by Players
3.1.1 Global Outsourced Semiconductor Assembly Service Revenue by Players (2018-2023)
3.1.2 Global Outsourced Semiconductor Assembly Service Revenue Market Share by Players (2018-2023)
3.2 Global Outsourced Semiconductor Assembly Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Outsourced Semiconductor Assembly Service, Ranking by Revenue, 2021 VS 2022 VS 2023
3.4 Global Outsourced Semiconductor Assembly Service Market Concentration Ratio
3.4.1 Global Outsourced Semiconductor Assembly Service Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Outsourced Semiconductor Assembly Service Revenue in 2022
3.5 Global Key Players of Outsourced Semiconductor Assembly Service Head office and Area Served
3.6 Global Key Players of Outsourced Semiconductor Assembly Service, Product and Application
3.7 Global Key Players of Outsourced Semiconductor Assembly Service, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Outsourced Semiconductor Assembly Service Breakdown Data by Type
4.1 Global Outsourced Semiconductor Assembly Service Historic Market Size by Type (2018-2023)
4.2 Global Outsourced Semiconductor Assembly Service Forecasted Market Size by Type (2024-2029)
5 Outsourced Semiconductor Assembly Service Breakdown Data by Application
5.1 Global Outsourced Semiconductor Assembly Service Historic Market Size by Application (2018-2023)
5.2 Global Outsourced Semiconductor Assembly Service Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Outsourced Semiconductor Assembly Service Market Size (2018-2029)
6.2 North America Outsourced Semiconductor Assembly Service Market Size by Type
6.2.1 North America Outsourced Semiconductor Assembly Service Market Size by Type (2018-2023)
6.2.2 North America Outsourced Semiconductor Assembly Service Market Size by Type (2024-2029)
6.2.3 North America Outsourced Semiconductor Assembly Service Market Share by Type (2018-2029)
6.3 North America Outsourced Semiconductor Assembly Service Market Size by Application
6.3.1 North America Outsourced Semiconductor Assembly Service Market Size by Application (2018-2023)
6.3.2 North America Outsourced Semiconductor Assembly Service Market Size by Application (2024-2029)
6.3.3 North America Outsourced Semiconductor Assembly Service Market Share by Application (2018-2029)
6.4 North America Outsourced Semiconductor Assembly Service Market Size by Country
6.4.1 North America Outsourced Semiconductor Assembly Service Market Size by Country: 2018 VS 2022 VS 2029
6.4.2 North America Outsourced Semiconductor Assembly Service Market Size by Country (2018-2023)
6.4.3 North America Outsourced Semiconductor Assembly Service Market Size by Country (2024-2029)
6.4.4 United States
6.4.5 Canada
7 Europe
7.1 Europe Outsourced Semiconductor Assembly Service Market Size (2018-2029)
7.2 Europe Outsourced Semiconductor Assembly Service Market Size by Type
7.2.1 Europe Outsourced Semiconductor Assembly Service Market Size by Type (2018-2023)
7.2.2 Europe Outsourced Semiconductor Assembly Service Market Size by Type (2024-2029)
7.2.3 Europe Outsourced Semiconductor Assembly Service Market Share by Type (2018-2029)
7.3 Europe Outsourced Semiconductor Assembly Service Market Size by Application
7.3.1 Europe Outsourced Semiconductor Assembly Service Market Size by Application (2018-2023)
7.3.2 Europe Outsourced Semiconductor Assembly Service Market Size by Application (2024-2029)
7.3.3 Europe Outsourced Semiconductor Assembly Service Market Share by Application (2018-2029)
7.4 Europe Outsourced Semiconductor Assembly Service Market Size by Country
7.4.1 Europe Outsourced Semiconductor Assembly Service Market Size by Country: 2018 VS 2022 VS 2029
7.4.2 Europe Outsourced Semiconductor Assembly Service Market Size by Country (2018-2023)
7.4.3 Europe Outsourced Semiconductor Assembly Service Market Size by Country (2024-2029)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Outsourced Semiconductor Assembly Service Market Size (2018-2029)
8.2 China Outsourced Semiconductor Assembly Service Market Size by Type
8.2.1 China Outsourced Semiconductor Assembly Service Market Size by Type (2018-2023)
8.2.2 China Outsourced Semiconductor Assembly Service Market Size by Type (2024-2029)
8.2.3 China Outsourced Semiconductor Assembly Service Market Share by Type (2018-2029)
8.3 China Outsourced Semiconductor Assembly Service Market Size by Application
8.3.1 China Outsourced Semiconductor Assembly Service Market Size by Application (2018-2023)
8.3.2 China Outsourced Semiconductor Assembly Service Market Size by Application (2024-2029)
8.3.3 China Outsourced Semiconductor Assembly Service Market Share by Application (2018-2029)
9 Asia (excluding China)
9.1 Asia Outsourced Semiconductor Assembly Service Market Size (2018-2029)
9.2 Asia Outsourced Semiconductor Assembly Service Market Size by Type
9.2.1 Asia Outsourced Semiconductor Assembly Service Market Size by Type (2018-2023)
9.2.2 Asia Outsourced Semiconductor Assembly Service Market Size by Type (2024-2029)
9.2.3 Asia Outsourced Semiconductor Assembly Service Market Share by Type (2018-2029)
9.3 Asia Outsourced Semiconductor Assembly Service Market Size by Application
9.3.1 Asia Outsourced Semiconductor Assembly Service Market Size by Application (2018-2023)
9.3.2 Asia Outsourced Semiconductor Assembly Service Market Size by Application (2024-2029)
9.3.3 Asia Outsourced Semiconductor Assembly Service Market Share by Application (2018-2029)
9.4 Asia Outsourced Semiconductor Assembly Service Market Size by Region
9.4.1 Asia Outsourced Semiconductor Assembly Service Market Size by Region: 2018 VS 2022 VS 2029
9.4.2 Asia Outsourced Semiconductor Assembly Service Market Size by Region (2018-2023)
9.4.3 Asia Outsourced Semiconductor Assembly Service Market Size by Region (2024-2029)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size (2018-2029)
10.2 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Type
10.2.1 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Type (2018-2023)
10.2.2 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Type (2024-2029)
10.2.3 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Share by Type (2018-2029)
10.3 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Application
10.3.1 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Application (2018-2023)
10.3.2 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Application (2024-2029)
10.3.3 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Share by Application (2018-2029)
10.4 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Country
10.4.1 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Country: 2018 VS 2022 VS 2029
10.4.2 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Country (2018-2023)
10.4.3 Middle East, Africa, and Latin America Outsourced Semiconductor Assembly Service Market Size by Country (2024-2029)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 ASE
11.1.1 ASE Company Details
11.1.2 ASE Business Overview
11.1.3 ASE Outsourced Semiconductor Assembly Service Introduction
11.1.4 ASE Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.1.5 ASE Recent Developments
11.2 Amkor Technology
11.2.1 Amkor Technology Company Details
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Outsourced Semiconductor Assembly Service Introduction
11.2.4 Amkor Technology Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.2.5 Amkor Technology Recent Developments
11.3 JCET
11.3.1 JCET Company Details
11.3.2 JCET Business Overview
11.3.3 JCET Outsourced Semiconductor Assembly Service Introduction
11.3.4 JCET Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.3.5 JCET Recent Developments
11.4 SPIL
11.4.1 SPIL Company Details
11.4.2 SPIL Business Overview
11.4.3 SPIL Outsourced Semiconductor Assembly Service Introduction
11.4.4 SPIL Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.4.5 SPIL Recent Developments
11.5 Powertech Technology Inc.
11.5.1 Powertech Technology Inc. Company Details
11.5.2 Powertech Technology Inc. Business Overview
11.5.3 Powertech Technology Inc. Outsourced Semiconductor Assembly Service Introduction
11.5.4 Powertech Technology Inc. Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.5.5 Powertech Technology Inc. Recent Developments
11.6 TongFu Microelectronics
11.6.1 TongFu Microelectronics Company Details
11.6.2 TongFu Microelectronics Business Overview
11.6.3 TongFu Microelectronics Outsourced Semiconductor Assembly Service Introduction
11.6.4 TongFu Microelectronics Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.6.5 TongFu Microelectronics Recent Developments
11.7 Tianshui Huatian Technology
11.7.1 Tianshui Huatian Technology Company Details
11.7.2 Tianshui Huatian Technology Business Overview
11.7.3 Tianshui Huatian Technology Outsourced Semiconductor Assembly Service Introduction
11.7.4 Tianshui Huatian Technology Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.7.5 Tianshui Huatian Technology Recent Developments
11.8 UTAC
11.8.1 UTAC Company Details
11.8.2 UTAC Business Overview
11.8.3 UTAC Outsourced Semiconductor Assembly Service Introduction
11.8.4 UTAC Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.8.5 UTAC Recent Developments
11.9 Chipbond Technology
11.9.1 Chipbond Technology Company Details
11.9.2 Chipbond Technology Business Overview
11.9.3 Chipbond Technology Outsourced Semiconductor Assembly Service Introduction
11.9.4 Chipbond Technology Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.9.5 Chipbond Technology Recent Developments
11.10 Hana Micron
11.10.1 Hana Micron Company Details
11.10.2 Hana Micron Business Overview
11.10.3 Hana Micron Outsourced Semiconductor Assembly Service Introduction
11.10.4 Hana Micron Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.10.5 Hana Micron Recent Developments
11.11 OSE
11.11.1 OSE Company Details
11.11.2 OSE Business Overview
11.11.3 OSE Outsourced Semiconductor Assembly Service Introduction
11.11.4 OSE Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.11.5 OSE Recent Developments
11.12 Walton Advanced Engineering
11.12.1 Walton Advanced Engineering Company Details
11.12.2 Walton Advanced Engineering Business Overview
11.12.3 Walton Advanced Engineering Outsourced Semiconductor Assembly Service Introduction
11.12.4 Walton Advanced Engineering Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.12.5 Walton Advanced Engineering Recent Developments
11.13 NEPES
11.13.1 NEPES Company Details
11.13.2 NEPES Business Overview
11.13.3 NEPES Outsourced Semiconductor Assembly Service Introduction
11.13.4 NEPES Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.13.5 NEPES Recent Developments
11.14 Unisem
11.14.1 Unisem Company Details
11.14.2 Unisem Business Overview
11.14.3 Unisem Outsourced Semiconductor Assembly Service Introduction
11.14.4 Unisem Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.14.5 Unisem Recent Developments
11.15 ChipMOS Technologies
11.15.1 ChipMOS Technologies Company Details
11.15.2 ChipMOS Technologies Business Overview
11.15.3 ChipMOS Technologies Outsourced Semiconductor Assembly Service Introduction
11.15.4 ChipMOS Technologies Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.15.5 ChipMOS Technologies Recent Developments
11.16 Signetics
11.16.1 Signetics Company Details
11.16.2 Signetics Business Overview
11.16.3 Signetics Outsourced Semiconductor Assembly Service Introduction
11.16.4 Signetics Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.16.5 Signetics Recent Developments
11.17 Carsem
11.17.1 Carsem Company Details
11.17.2 Carsem Business Overview
11.17.3 Carsem Outsourced Semiconductor Assembly Service Introduction
11.17.4 Carsem Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.17.5 Carsem Recent Developments
11.18 KYEC
11.18.1 KYEC Company Details
11.18.2 KYEC Business Overview
11.18.3 KYEC Outsourced Semiconductor Assembly Service Introduction
11.18.4 KYEC Revenue in Outsourced Semiconductor Assembly Service Business (2018-2023)
11.18.5 KYEC Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
ASE
Amkor Technology
JCET
SPIL
Powertech Technology Inc.
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
听
听
*If Applicable.
