
Package on package (PoP packaging), also known as stacked packaging, is one of the very popular three-dimensional overlay technologies developed for IC packaging of mobile devices and can be used for system integration. PoP stacking uses fully tested and fully packaged chips. It is made by stacking a complete single chip or stacked chip on top of another complete single chip or stacked chip, between the bottom package and the upper package, and between the bottom package and the motherboard. The interconnection is achieved through a solder ball array.
The global Package on Package (PoP) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Package on Package (PoP) is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Package on Package (PoP) is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for Package on Package (PoP) in Smartphone is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of Package on Package (PoP) include Amkor Technology, ASE, JCET Group, PCBCart, Micron, Capcon Limited, Unimicron Technology Corporation, Powertech Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Package on Package (PoP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Package on Package (PoP).
The Package on Package (PoP) market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Package on Package (PoP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Package on Package (PoP) companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor Technology
ASE
JCET Group
PCBCart
Micron
Capcon Limited
Unimicron Technology Corporation
Powertech Technology
Segment by Type
2-Layer
3-Layer
5-Layer
Other
Segment by Application
Smartphone
Digital Camera
Mobile Gaming Device
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Package on Package (PoP) company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Package on Package (PoP) Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 2-Layer
1.2.3 3-Layer
1.2.4 5-Layer
1.2.5 Other
1.3 Market by Application
1.3.1 Global Package on Package (PoP) Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Smartphone
1.3.3 Digital Camera
1.3.4 Mobile Gaming Device
1.3.5 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Package on Package (PoP) Market Perspective (2019-2030)
2.2 Global Package on Package (PoP) Growth Trends by Region
2.2.1 Global Package on Package (PoP) Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Package on Package (PoP) Historic Market Size by Region (2019-2024)
2.2.3 Package on Package (PoP) Forecasted Market Size by Region (2025-2030)
2.3 Package on Package (PoP) Market Dynamics
2.3.1 Package on Package (PoP) Industry Trends
2.3.2 Package on Package (PoP) Market Drivers
2.3.3 Package on Package (PoP) Market Challenges
2.3.4 Package on Package (PoP) Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Package on Package (PoP) Players by Revenue
3.1.1 Global Top Package on Package (PoP) Players by Revenue (2019-2024)
3.1.2 Global Package on Package (PoP) Revenue Market Share by Players (2019-2024)
3.2 Global Package on Package (PoP) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Package on Package (PoP) Revenue
3.4 Global Package on Package (PoP) Market Concentration Ratio
3.4.1 Global Package on Package (PoP) Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Package on Package (PoP) Revenue in 2023
3.5 Global Key Players of Package on Package (PoP) Head office and Area Served
3.6 Global Key Players of Package on Package (PoP), Product and Application
3.7 Global Key Players of Package on Package (PoP), Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Package on Package (PoP) Breakdown Data by Type
4.1 Global Package on Package (PoP) Historic Market Size by Type (2019-2024)
4.2 Global Package on Package (PoP) Forecasted Market Size by Type (2025-2030)
5 Package on Package (PoP) Breakdown Data by Application
5.1 Global Package on Package (PoP) Historic Market Size by Application (2019-2024)
5.2 Global Package on Package (PoP) Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Package on Package (PoP) Market Size (2019-2030)
6.2 North America Package on Package (PoP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Package on Package (PoP) Market Size by Country (2019-2024)
6.4 North America Package on Package (PoP) Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Package on Package (PoP) Market Size (2019-2030)
7.2 Europe Package on Package (PoP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Package on Package (PoP) Market Size by Country (2019-2024)
7.4 Europe Package on Package (PoP) Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Package on Package (PoP) Market Size (2019-2030)
8.2 Asia-Pacific Package on Package (PoP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Package on Package (PoP) Market Size by Region (2019-2024)
8.4 Asia-Pacific Package on Package (PoP) Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Package on Package (PoP) Market Size (2019-2030)
9.2 Latin America Package on Package (PoP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Package on Package (PoP) Market Size by Country (2019-2024)
9.4 Latin America Package on Package (PoP) Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Package on Package (PoP) Market Size (2019-2030)
10.2 Middle East & Africa Package on Package (PoP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Package on Package (PoP) Market Size by Country (2019-2024)
10.4 Middle East & Africa Package on Package (PoP) Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor Technology
11.1.1 Amkor Technology Company Details
11.1.2 Amkor Technology Business Overview
11.1.3 Amkor Technology Package on Package (PoP) Introduction
11.1.4 Amkor Technology Revenue in Package on Package (PoP) Business (2019-2024)
11.1.5 Amkor Technology Recent Development
11.2 ASE
11.2.1 ASE Company Details
11.2.2 ASE Business Overview
11.2.3 ASE Package on Package (PoP) Introduction
11.2.4 ASE Revenue in Package on Package (PoP) Business (2019-2024)
11.2.5 ASE Recent Development
11.3 JCET Group
11.3.1 JCET Group Company Details
11.3.2 JCET Group Business Overview
11.3.3 JCET Group Package on Package (PoP) Introduction
11.3.4 JCET Group Revenue in Package on Package (PoP) Business (2019-2024)
11.3.5 JCET Group Recent Development
11.4 PCBCart
11.4.1 PCBCart Company Details
11.4.2 PCBCart Business Overview
11.4.3 PCBCart Package on Package (PoP) Introduction
11.4.4 PCBCart Revenue in Package on Package (PoP) Business (2019-2024)
11.4.5 PCBCart Recent Development
11.5 Micron
11.5.1 Micron Company Details
11.5.2 Micron Business Overview
11.5.3 Micron Package on Package (PoP) Introduction
11.5.4 Micron Revenue in Package on Package (PoP) Business (2019-2024)
11.5.5 Micron Recent Development
11.6 Capcon Limited
11.6.1 Capcon Limited Company Details
11.6.2 Capcon Limited Business Overview
11.6.3 Capcon Limited Package on Package (PoP) Introduction
11.6.4 Capcon Limited Revenue in Package on Package (PoP) Business (2019-2024)
11.6.5 Capcon Limited Recent Development
11.7 Unimicron Technology Corporation
11.7.1 Unimicron Technology Corporation Company Details
11.7.2 Unimicron Technology Corporation Business Overview
11.7.3 Unimicron Technology Corporation Package on Package (PoP) Introduction
11.7.4 Unimicron Technology Corporation Revenue in Package on Package (PoP) Business (2019-2024)
11.7.5 Unimicron Technology Corporation Recent Development
11.8 Powertech Technology
11.8.1 Powertech Technology Company Details
11.8.2 Powertech Technology Business Overview
11.8.3 Powertech Technology Package on Package (PoP) Introduction
11.8.4 Powertech Technology Revenue in Package on Package (PoP) Business (2019-2024)
11.8.5 Powertech Technology Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
Amkor Technology
ASE
JCET Group
PCBCart
Micron
Capcon Limited
Unimicron Technology Corporation
Powertech Technology
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*If Applicable.
