Global PCB and IC Package Design Software Market Research Report 2024

Publication ID:

PB505257634

Publication Date:

May 9, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

The global PCB and IC Package Design Software market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for PCB and IC Package Design Software, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding PCB and IC Package Design Software.
Report Scope
The PCB and IC Package Design Software market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global PCB and IC Package Design Software market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the PCB and IC Package Design Software companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Siemens
Altium
Zuken
Autodesk
Cadence
Synopsys
ANSYS
Novarm
WestDev
ExpressPCB
EasyEDA
Shanghai Tsingyue
National Instrument
Segment by Type
Cloud Based
On-premises
Segment by Application
Consumer Electronics
Computer
Telecommunication
Industrial/Medical
Automotive
Military/Aerospace
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of PCB and IC Package Design Software companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global PCB and IC Package Design Software Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Cloud Based
1.2.3 On-premises
1.3 Market by Application
1.3.1 Global PCB and IC Package Design Software Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Computer
1.3.4 Telecommunication
1.3.5 Industrial/Medical
1.3.6 Automotive
1.3.7 Military/Aerospace
1.3.8 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global PCB and IC Package Design Software Market Perspective (2019-2030)
2.2 PCB and IC Package Design Software Growth Trends by Region
2.2.1 Global PCB and IC Package Design Software Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 PCB and IC Package Design Software Historic Market Size by Region (2019-2024)
2.2.3 PCB and IC Package Design Software Forecasted Market Size by Region (2025-2030)
2.3 PCB and IC Package Design Software Market Dynamics
2.3.1 PCB and IC Package Design Software Industry Trends
2.3.2 PCB and IC Package Design Software Market Drivers
2.3.3 PCB and IC Package Design Software Market Challenges
2.3.4 PCB and IC Package Design Software Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top PCB and IC Package Design Software Players by Revenue
3.1.1 Global Top PCB and IC Package Design Software Players by Revenue (2019-2024)
3.1.2 Global PCB and IC Package Design Software Revenue Market Share by Players (2019-2024)
3.2 Global PCB and IC Package Design Software Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by PCB and IC Package Design Software Revenue
3.4 Global PCB and IC Package Design Software Market Concentration Ratio
3.4.1 Global PCB and IC Package Design Software Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by PCB and IC Package Design Software Revenue in 2023
3.5 PCB and IC Package Design Software Key Players Head office and Area Served
3.6 Key Players PCB and IC Package Design Software Product Solution and Service
3.7 Date of Enter into PCB and IC Package Design Software Market
3.8 Mergers & Acquisitions, Expansion Plans
4 PCB and IC Package Design Software Breakdown Data by Type
4.1 Global PCB and IC Package Design Software Historic Market Size by Type (2019-2024)
4.2 Global PCB and IC Package Design Software Forecasted Market Size by Type (2025-2030)
5 PCB and IC Package Design Software Breakdown Data by Application
5.1 Global PCB and IC Package Design Software Historic Market Size by Application (2019-2024)
5.2 Global PCB and IC Package Design Software Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America PCB and IC Package Design Software Market Size (2019-2030)
6.2 North America PCB and IC Package Design Software Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America PCB and IC Package Design Software Market Size by Country (2019-2024)
6.4 North America PCB and IC Package Design Software Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe PCB and IC Package Design Software Market Size (2019-2030)
7.2 Europe PCB and IC Package Design Software Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe PCB and IC Package Design Software Market Size by Country (2019-2024)
7.4 Europe PCB and IC Package Design Software Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific PCB and IC Package Design Software Market Size (2019-2030)
8.2 Asia-Pacific PCB and IC Package Design Software Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific PCB and IC Package Design Software Market Size by Region (2019-2024)
8.4 Asia-Pacific PCB and IC Package Design Software Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America PCB and IC Package Design Software Market Size (2019-2030)
9.2 Latin America PCB and IC Package Design Software Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America PCB and IC Package Design Software Market Size by Country (2019-2024)
9.4 Latin America PCB and IC Package Design Software Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa PCB and IC Package Design Software Market Size (2019-2030)
10.2 Middle East & Africa PCB and IC Package Design Software Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa PCB and IC Package Design Software Market Size by Country (2019-2024)
10.4 Middle East & Africa PCB and IC Package Design Software Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Siemens
11.1.1 Siemens Company Detail
11.1.2 Siemens Business Overview
11.1.3 Siemens PCB and IC Package Design Software Introduction
11.1.4 Siemens Revenue in PCB and IC Package Design Software Business (2019-2024)
11.1.5 Siemens Recent Development
11.2 Altium
11.2.1 Altium Company Detail
11.2.2 Altium Business Overview
11.2.3 Altium PCB and IC Package Design Software Introduction
11.2.4 Altium Revenue in PCB and IC Package Design Software Business (2019-2024)
11.2.5 Altium Recent Development
11.3 Zuken
11.3.1 Zuken Company Detail
11.3.2 Zuken Business Overview
11.3.3 Zuken PCB and IC Package Design Software Introduction
11.3.4 Zuken Revenue in PCB and IC Package Design Software Business (2019-2024)
11.3.5 Zuken Recent Development
11.4 Autodesk
11.4.1 Autodesk Company Detail
11.4.2 Autodesk Business Overview
11.4.3 Autodesk PCB and IC Package Design Software Introduction
11.4.4 Autodesk Revenue in PCB and IC Package Design Software Business (2019-2024)
11.4.5 Autodesk Recent Development
11.5 Cadence
11.5.1 Cadence Company Detail
11.5.2 Cadence Business Overview
11.5.3 Cadence PCB and IC Package Design Software Introduction
11.5.4 Cadence Revenue in PCB and IC Package Design Software Business (2019-2024)
11.5.5 Cadence Recent Development
11.6 Synopsys
11.6.1 Synopsys Company Detail
11.6.2 Synopsys Business Overview
11.6.3 Synopsys PCB and IC Package Design Software Introduction
11.6.4 Synopsys Revenue in PCB and IC Package Design Software Business (2019-2024)
11.6.5 Synopsys Recent Development
11.7 ANSYS
11.7.1 ANSYS Company Detail
11.7.2 ANSYS Business Overview
11.7.3 ANSYS PCB and IC Package Design Software Introduction
11.7.4 ANSYS Revenue in PCB and IC Package Design Software Business (2019-2024)
11.7.5 ANSYS Recent Development
11.8 Novarm
11.8.1 Novarm Company Detail
11.8.2 Novarm Business Overview
11.8.3 Novarm PCB and IC Package Design Software Introduction
11.8.4 Novarm Revenue in PCB and IC Package Design Software Business (2019-2024)
11.8.5 Novarm Recent Development
11.9 WestDev
11.9.1 WestDev Company Detail
11.9.2 WestDev Business Overview
11.9.3 WestDev PCB and IC Package Design Software Introduction
11.9.4 WestDev Revenue in PCB and IC Package Design Software Business (2019-2024)
11.9.5 WestDev Recent Development
11.10 ExpressPCB
11.10.1 ExpressPCB Company Detail
11.10.2 ExpressPCB Business Overview
11.10.3 ExpressPCB PCB and IC Package Design Software Introduction
11.10.4 ExpressPCB Revenue in PCB and IC Package Design Software Business (2019-2024)
11.10.5 ExpressPCB Recent Development
11.11 EasyEDA
11.11.1 EasyEDA Company Detail
11.11.2 EasyEDA Business Overview
11.11.3 EasyEDA PCB and IC Package Design Software Introduction
11.11.4 EasyEDA Revenue in PCB and IC Package Design Software Business (2019-2024)
11.11.5 EasyEDA Recent Development
11.12 Shanghai Tsingyue
11.12.1 Shanghai Tsingyue Company Detail
11.12.2 Shanghai Tsingyue Business Overview
11.12.3 Shanghai Tsingyue PCB and IC Package Design Software Introduction
11.12.4 Shanghai Tsingyue Revenue in PCB and IC Package Design Software Business (2019-2024)
11.12.5 Shanghai Tsingyue Recent Development
11.13 National Instrument
11.13.1 National Instrument Company Detail
11.13.2 National Instrument Business Overview
11.13.3 National Instrument PCB and IC Package Design Software Introduction
11.13.4 National Instrument Revenue in PCB and IC Package Design Software Business (2019-2024)
11.13.5 National Instrument Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Siemens
Altium
Zuken
Autodesk
Cadence
Synopsys
ANSYS
Novarm
WestDev
ExpressPCB
EasyEDA
Shanghai Tsingyue
National Instrument

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