Global PCB Encapsulation Market Research Report 2024

Publication ID:

PB510240045

Publication Date:

October 31, 2024

Pages:

105

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Specialty Chemicals [2]

Manufacturing (Chemicals) [3]

Chemicals [4]

Description:

PCB encapsulation is the process of covering printed circuit boards (PCBs) with a protective material to safeguard them from environmental factors such as moisture, dust, and chemicals. This technique enhances the durability and reliability of electronic components by preventing corrosion and short circuits.
The global PCB Encapsulation market was valued at US$ 3265 million in 2023 and is anticipated to reach US$ 5109 million by 2030, witnessing a CAGR of 7.5% during the forecast period 2024-2030.
North American market for PCB Encapsulation is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for PCB Encapsulation is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of PCB Encapsulation include Henkel, H.B. Fuller, Parker-Hannifin, Dow, DuPont, Nagase ChemteX, Huntsman International, Wacker Chemie, Shin-Etsu Chemical, Panacol-Elosol, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for PCB Encapsulation, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding PCB Encapsulation.
The PCB Encapsulation market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global PCB Encapsulation market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the PCB Encapsulation manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Henkel
H.B. Fuller
Parker-Hannifin
Dow
DuPont
Nagase ChemteX
Huntsman International
Wacker Chemie
Shin-Etsu Chemical
Panacol-Elosol
Dymax
Chase
MG Chemicals
Master Bond
by Type
Epoxy
Silicone
Acrylic
Polyurethane
Others
by Application
Consumer Electronics
Automotive Electronics
Aerospace
Medical Equipment
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of PCB Encapsulation manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of PCB Encapsulation by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of PCB Encapsulation in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 PCB Encapsulation Market Overview
1.1 Product Definition
1.2 PCB Encapsulation by Type
1.2.1 Global PCB Encapsulation Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Epoxy
1.2.3 Silicone
1.2.4 Acrylic
1.2.5 Polyurethane
1.2.6 Others
1.3 PCB Encapsulation by Application
1.3.1 Global PCB Encapsulation Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automotive Electronics
1.3.4 Aerospace
1.3.5 Medical Equipment
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global PCB Encapsulation Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global PCB Encapsulation Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global PCB Encapsulation Production Estimates and Forecasts (2019-2030)
1.4.4 Global PCB Encapsulation Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global PCB Encapsulation Production Market Share by Manufacturers (2019-2024)
2.2 Global PCB Encapsulation Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of PCB Encapsulation, Industry Ranking, 2022 VS 2023
2.4 Global PCB Encapsulation Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global PCB Encapsulation Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of PCB Encapsulation, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of PCB Encapsulation, Product Offered and Application
2.8 Global Key Manufacturers of PCB Encapsulation, Date of Enter into This Industry
2.9 PCB Encapsulation Market Competitive Situation and Trends
2.9.1 PCB Encapsulation Market Concentration Rate
2.9.2 Global 5 and 10 Largest PCB Encapsulation Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 PCB Encapsulation Production by Region
3.1 Global PCB Encapsulation Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global PCB Encapsulation Production Value by Region (2019-2030)
3.2.1 Global PCB Encapsulation Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of PCB Encapsulation by Region (2025-2030)
3.3 Global PCB Encapsulation Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global PCB Encapsulation Production by Region (2019-2030)
3.4.1 Global PCB Encapsulation Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of PCB Encapsulation by Region (2025-2030)
3.5 Global PCB Encapsulation Market Price Analysis by Region (2019-2024)
3.6 Global PCB Encapsulation Production and Value, Year-over-Year Growth
3.6.1 North America PCB Encapsulation Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe PCB Encapsulation Production Value Estimates and Forecasts (2019-2030)
3.6.3 China PCB Encapsulation Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan PCB Encapsulation Production Value Estimates and Forecasts (2019-2030)
4 PCB Encapsulation Consumption by Region
4.1 Global PCB Encapsulation Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global PCB Encapsulation Consumption by Region (2019-2030)
4.2.1 Global PCB Encapsulation Consumption by Region (2019-2030)
4.2.2 Global PCB Encapsulation Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America PCB Encapsulation Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America PCB Encapsulation Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe PCB Encapsulation Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe PCB Encapsulation Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific PCB Encapsulation Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific PCB Encapsulation Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa PCB Encapsulation Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa PCB Encapsulation Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global PCB Encapsulation Production by Type (2019-2030)
5.1.1 Global PCB Encapsulation Production by Type (2019-2024)
5.1.2 Global PCB Encapsulation Production by Type (2025-2030)
5.1.3 Global PCB Encapsulation Production Market Share by Type (2019-2030)
5.2 Global PCB Encapsulation Production Value by Type (2019-2030)
5.2.1 Global PCB Encapsulation Production Value by Type (2019-2024)
5.2.2 Global PCB Encapsulation Production Value by Type (2025-2030)
5.2.3 Global PCB Encapsulation Production Value Market Share by Type (2019-2030)
5.3 Global PCB Encapsulation Price by Type (2019-2030)
6 Segment by Application
6.1 Global PCB Encapsulation Production by Application (2019-2030)
6.1.1 Global PCB Encapsulation Production by Application (2019-2024)
6.1.2 Global PCB Encapsulation Production by Application (2025-2030)
6.1.3 Global PCB Encapsulation Production Market Share by Application (2019-2030)
6.2 Global PCB Encapsulation Production Value by Application (2019-2030)
6.2.1 Global PCB Encapsulation Production Value by Application (2019-2024)
6.2.2 Global PCB Encapsulation Production Value by Application (2025-2030)
6.2.3 Global PCB Encapsulation Production Value Market Share by Application (2019-2030)
6.3 Global PCB Encapsulation Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Henkel
7.1.1 Henkel PCB Encapsulation Company Information
7.1.2 Henkel PCB Encapsulation Product Portfolio
7.1.3 Henkel PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Henkel Main Business and Markets Served
7.1.5 Henkel Recent Developments/Updates
7.2 H.B. Fuller
7.2.1 H.B. Fuller PCB Encapsulation Company Information
7.2.2 H.B. Fuller PCB Encapsulation Product Portfolio
7.2.3 H.B. Fuller PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.2.4 H.B. Fuller Main Business and Markets Served
7.2.5 H.B. Fuller Recent Developments/Updates
7.3 Parker-Hannifin
7.3.1 Parker-Hannifin PCB Encapsulation Company Information
7.3.2 Parker-Hannifin PCB Encapsulation Product Portfolio
7.3.3 Parker-Hannifin PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Parker-Hannifin Main Business and Markets Served
7.3.5 Parker-Hannifin Recent Developments/Updates
7.4 Dow
7.4.1 Dow PCB Encapsulation Company Information
7.4.2 Dow PCB Encapsulation Product Portfolio
7.4.3 Dow PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Dow Main Business and Markets Served
7.4.5 Dow Recent Developments/Updates
7.5 DuPont
7.5.1 DuPont PCB Encapsulation Company Information
7.5.2 DuPont PCB Encapsulation Product Portfolio
7.5.3 DuPont PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.5.4 DuPont Main Business and Markets Served
7.5.5 DuPont Recent Developments/Updates
7.6 Nagase ChemteX
7.6.1 Nagase ChemteX PCB Encapsulation Company Information
7.6.2 Nagase ChemteX PCB Encapsulation Product Portfolio
7.6.3 Nagase ChemteX PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Nagase ChemteX Main Business and Markets Served
7.6.5 Nagase ChemteX Recent Developments/Updates
7.7 Huntsman International
7.7.1 Huntsman International PCB Encapsulation Company Information
7.7.2 Huntsman International PCB Encapsulation Product Portfolio
7.7.3 Huntsman International PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Huntsman International Main Business and Markets Served
7.7.5 Huntsman International Recent Developments/Updates
7.8 Wacker Chemie
7.8.1 Wacker Chemie PCB Encapsulation Company Information
7.8.2 Wacker Chemie PCB Encapsulation Product Portfolio
7.8.3 Wacker Chemie PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Wacker Chemie Main Business and Markets Served
7.8.5 Wacker Chemie Recent Developments/Updates
7.9 Shin-Etsu Chemical
7.9.1 Shin-Etsu Chemical PCB Encapsulation Company Information
7.9.2 Shin-Etsu Chemical PCB Encapsulation Product Portfolio
7.9.3 Shin-Etsu Chemical PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Shin-Etsu Chemical Main Business and Markets Served
7.9.5 Shin-Etsu Chemical Recent Developments/Updates
7.10 Panacol-Elosol
7.10.1 Panacol-Elosol PCB Encapsulation Company Information
7.10.2 Panacol-Elosol PCB Encapsulation Product Portfolio
7.10.3 Panacol-Elosol PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Panacol-Elosol Main Business and Markets Served
7.10.5 Panacol-Elosol Recent Developments/Updates
7.11 Dymax
7.11.1 Dymax PCB Encapsulation Company Information
7.11.2 Dymax PCB Encapsulation Product Portfolio
7.11.3 Dymax PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Dymax Main Business and Markets Served
7.11.5 Dymax Recent Developments/Updates
7.12 Chase
7.12.1 Chase PCB Encapsulation Company Information
7.12.2 Chase PCB Encapsulation Product Portfolio
7.12.3 Chase PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Chase Main Business and Markets Served
7.12.5 Chase Recent Developments/Updates
7.13 MG Chemicals
7.13.1 MG Chemicals PCB Encapsulation Company Information
7.13.2 MG Chemicals PCB Encapsulation Product Portfolio
7.13.3 MG Chemicals PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.13.4 MG Chemicals Main Business and Markets Served
7.13.5 MG Chemicals Recent Developments/Updates
7.14 Master Bond
7.14.1 Master Bond PCB Encapsulation Company Information
7.14.2 Master Bond PCB Encapsulation Product Portfolio
7.14.3 Master Bond PCB Encapsulation Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Master Bond Main Business and Markets Served
7.14.5 Master Bond Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 PCB Encapsulation Industry Chain Analysis
8.2 PCB Encapsulation Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 PCB Encapsulation Production Mode & Process
8.4 PCB Encapsulation Sales and Marketing
8.4.1 PCB Encapsulation Sales Channels
8.4.2 PCB Encapsulation Distributors
8.5 PCB Encapsulation Customers
9 PCB Encapsulation Market Dynamics
9.1 PCB Encapsulation Industry Trends
9.2 PCB Encapsulation Market Drivers
9.3 PCB Encapsulation Market Challenges
9.4 PCB Encapsulation Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

Henkel
H.B. Fuller
Parker-Hannifin
Dow
DuPont
Nagase ChemteX
Huntsman International
Wacker Chemie
Shin-Etsu Chemical
Panacol-Elosol
Dymax
Chase
MG Chemicals
Master Bond

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.

91制片厂