Plated Through Hole Prototyping Board is a circuit board for electronic prototype development and testing, with plated through hole and through hole structure.
Features of plated through hole prototype boards include:
Through hole structure: The prototype board has a series of through holes, which are used to mount and connect electronic components, such as resistors, capacitors, integrated circuits, etc. Vias allow electronic components to make electrical connections between different layers.
Perforated structure: The perforated holes on the prototype board are usually for the convenience of installing and fixing the prototype board, such as studs, threaded holes or other accessories.
Plated: Unlike unplated through-hole prototype boards, plated through-hole through-hole prototype boards are electroplated, meaning that the walls of the holes are coated with a layer of metal, usually copper. This plating provides electrical connectivity and reliability to ensure signal transmission and connection of electronic components.
Plated through-hole through-hole prototype boards are often used in the electronic prototyping and functional verification stages. Plated through-holes provide a stable electrical connection that supports higher frequency and higher current applications. Engineers can quickly build and test circuits, evaluate performance, and debug on the prototyping board.
The global Plated Through Hole Prototyping Board market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Plated Through Hole Prototyping Board is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Plated Through Hole Prototyping Board is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Plated Through Hole Prototyping Board include Adafruit Industries LLC, Bud Industries, Chip Quik Inc., DFRobot, DIGIKEY STANDARD, Digilent, Inc., MED, Pimoroni Ltd and PTSoIns ., etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Plated Through Hole Prototyping Board, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Plated Through Hole Prototyping Board.
Report Scope
The Plated Through Hole Prototyping Board market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Plated Through Hole Prototyping Board market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Plated Through Hole Prototyping Board manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Adafruit Industries LLC
Bud Industries
Chip Quik Inc.
DFRobot
DIGIKEY STANDARD
Digilent, Inc.
MED
Pimoroni Ltd
PTSoIns .
SparkFun Electronics
Twin Industries
Vector Electronics
WAGO Corporation
Roth Elektronik
Segment by Type
Rigid Analog Board
Flexible Analog Board
Segment by Application
School
Electronic Company
Other
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Plated Through Hole Prototyping Board manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Plated Through Hole Prototyping Board by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Plated Through Hole Prototyping Board in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Plated Through Hole Prototyping Board Market Overview
1.1 Product Definition
1.2 Plated Through Hole Prototyping Board Segment by Type
1.2.1 Global Plated Through Hole Prototyping Board Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Rigid Analog Board
1.2.3 Flexible Analog Board
1.3 Plated Through Hole Prototyping Board Segment by Application
1.3.1 Global Plated Through Hole Prototyping Board Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 School
1.3.3 Electronic Company
1.3.4 Other
1.4 Global Market Growth Prospects
1.4.1 Global Plated Through Hole Prototyping Board Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Plated Through Hole Prototyping Board Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Plated Through Hole Prototyping Board Production Estimates and Forecasts (2019-2030)
1.4.4 Global Plated Through Hole Prototyping Board Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Plated Through Hole Prototyping Board Production Market Share by Manufacturers (2019-2024)
2.2 Global Plated Through Hole Prototyping Board Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Plated Through Hole Prototyping Board, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Plated Through Hole Prototyping Board Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Plated Through Hole Prototyping Board Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Plated Through Hole Prototyping Board, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Plated Through Hole Prototyping Board, Product Offered and Application
2.8 Global Key Manufacturers of Plated Through Hole Prototyping Board, Date of Enter into This Industry
2.9 Plated Through Hole Prototyping Board Market Competitive Situation and Trends
2.9.1 Plated Through Hole Prototyping Board Market Concentration Rate
2.9.2 Global 5 and 10 Largest Plated Through Hole Prototyping Board Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Plated Through Hole Prototyping Board Production by Region
3.1 Global Plated Through Hole Prototyping Board Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Plated Through Hole Prototyping Board Production Value by Region (2019-2030)
3.2.1 Global Plated Through Hole Prototyping Board Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Plated Through Hole Prototyping Board by Region (2025-2030)
3.3 Global Plated Through Hole Prototyping Board Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Plated Through Hole Prototyping Board Production by Region (2019-2030)
3.4.1 Global Plated Through Hole Prototyping Board Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Plated Through Hole Prototyping Board by Region (2025-2030)
3.5 Global Plated Through Hole Prototyping Board Market Price Analysis by Region (2019-2024)
3.6 Global Plated Through Hole Prototyping Board Production and Value, Year-over-Year Growth
3.6.1 North America Plated Through Hole Prototyping Board Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Plated Through Hole Prototyping Board Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Plated Through Hole Prototyping Board Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Plated Through Hole Prototyping Board Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Plated Through Hole Prototyping Board Production Value Estimates and Forecasts (2019-2030)
4 Plated Through Hole Prototyping Board Consumption by Region
4.1 Global Plated Through Hole Prototyping Board Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Plated Through Hole Prototyping Board Consumption by Region (2019-2030)
4.2.1 Global Plated Through Hole Prototyping Board Consumption by Region (2019-2024)
4.2.2 Global Plated Through Hole Prototyping Board Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Plated Through Hole Prototyping Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Plated Through Hole Prototyping Board Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Plated Through Hole Prototyping Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Plated Through Hole Prototyping Board Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Plated Through Hole Prototyping Board Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Plated Through Hole Prototyping Board Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Plated Through Hole Prototyping Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Plated Through Hole Prototyping Board Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Plated Through Hole Prototyping Board Production by Type (2019-2030)
5.1.1 Global Plated Through Hole Prototyping Board Production by Type (2019-2024)
5.1.2 Global Plated Through Hole Prototyping Board Production by Type (2025-2030)
5.1.3 Global Plated Through Hole Prototyping Board Production Market Share by Type (2019-2030)
5.2 Global Plated Through Hole Prototyping Board Production Value by Type (2019-2030)
5.2.1 Global Plated Through Hole Prototyping Board Production Value by Type (2019-2024)
5.2.2 Global Plated Through Hole Prototyping Board Production Value by Type (2025-2030)
5.2.3 Global Plated Through Hole Prototyping Board Production Value Market Share by Type (2019-2030)
5.3 Global Plated Through Hole Prototyping Board Price by Type (2019-2030)
6 Segment by Application
6.1 Global Plated Through Hole Prototyping Board Production by Application (2019-2030)
6.1.1 Global Plated Through Hole Prototyping Board Production by Application (2019-2024)
6.1.2 Global Plated Through Hole Prototyping Board Production by Application (2025-2030)
6.1.3 Global Plated Through Hole Prototyping Board Production Market Share by Application (2019-2030)
6.2 Global Plated Through Hole Prototyping Board Production Value by Application (2019-2030)
6.2.1 Global Plated Through Hole Prototyping Board Production Value by Application (2019-2024)
6.2.2 Global Plated Through Hole Prototyping Board Production Value by Application (2025-2030)
6.2.3 Global Plated Through Hole Prototyping Board Production Value Market Share by Application (2019-2030)
6.3 Global Plated Through Hole Prototyping Board Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Adafruit Industries LLC
7.1.1 Adafruit Industries LLC Plated Through Hole Prototyping Board Corporation Information
7.1.2 Adafruit Industries LLC Plated Through Hole Prototyping Board Product Portfolio
7.1.3 Adafruit Industries LLC Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Adafruit Industries LLC Main Business and Markets Served
7.1.5 Adafruit Industries LLC Recent Developments/Updates
7.2 Bud Industries
7.2.1 Bud Industries Plated Through Hole Prototyping Board Corporation Information
7.2.2 Bud Industries Plated Through Hole Prototyping Board Product Portfolio
7.2.3 Bud Industries Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Bud Industries Main Business and Markets Served
7.2.5 Bud Industries Recent Developments/Updates
7.3 Chip Quik Inc.
7.3.1 Chip Quik Inc. Plated Through Hole Prototyping Board Corporation Information
7.3.2 Chip Quik Inc. Plated Through Hole Prototyping Board Product Portfolio
7.3.3 Chip Quik Inc. Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Chip Quik Inc. Main Business and Markets Served
7.3.5 Chip Quik Inc. Recent Developments/Updates
7.4 DFRobot
7.4.1 DFRobot Plated Through Hole Prototyping Board Corporation Information
7.4.2 DFRobot Plated Through Hole Prototyping Board Product Portfolio
7.4.3 DFRobot Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.4.4 DFRobot Main Business and Markets Served
7.4.5 DFRobot Recent Developments/Updates
7.5 DIGIKEY STANDARD
7.5.1 DIGIKEY STANDARD Plated Through Hole Prototyping Board Corporation Information
7.5.2 DIGIKEY STANDARD Plated Through Hole Prototyping Board Product Portfolio
7.5.3 DIGIKEY STANDARD Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.5.4 DIGIKEY STANDARD Main Business and Markets Served
7.5.5 DIGIKEY STANDARD Recent Developments/Updates
7.6 Digilent, Inc.
7.6.1 Digilent, Inc. Plated Through Hole Prototyping Board Corporation Information
7.6.2 Digilent, Inc. Plated Through Hole Prototyping Board Product Portfolio
7.6.3 Digilent, Inc. Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Digilent, Inc. Main Business and Markets Served
7.6.5 Digilent, Inc. Recent Developments/Updates
7.7 MED
7.7.1 MED Plated Through Hole Prototyping Board Corporation Information
7.7.2 MED Plated Through Hole Prototyping Board Product Portfolio
7.7.3 MED Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.7.4 MED Main Business and Markets Served
7.7.5 MED Recent Developments/Updates
7.8 Pimoroni Ltd
7.8.1 Pimoroni Ltd Plated Through Hole Prototyping Board Corporation Information
7.8.2 Pimoroni Ltd Plated Through Hole Prototyping Board Product Portfolio
7.8.3 Pimoroni Ltd Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Pimoroni Ltd Main Business and Markets Served
7.7.5 Pimoroni Ltd Recent Developments/Updates
7.9 PTSoIns .
7.9.1 PTSoIns . Plated Through Hole Prototyping Board Corporation Information
7.9.2 PTSoIns . Plated Through Hole Prototyping Board Product Portfolio
7.9.3 PTSoIns . Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.9.4 PTSoIns . Main Business and Markets Served
7.9.5 PTSoIns . Recent Developments/Updates
7.10 SparkFun Electronics
7.10.1 SparkFun Electronics Plated Through Hole Prototyping Board Corporation Information
7.10.2 SparkFun Electronics Plated Through Hole Prototyping Board Product Portfolio
7.10.3 SparkFun Electronics Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.10.4 SparkFun Electronics Main Business and Markets Served
7.10.5 SparkFun Electronics Recent Developments/Updates
7.11 Twin Industries
7.11.1 Twin Industries Plated Through Hole Prototyping Board Corporation Information
7.11.2 Twin Industries Plated Through Hole Prototyping Board Product Portfolio
7.11.3 Twin Industries Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Twin Industries Main Business and Markets Served
7.11.5 Twin Industries Recent Developments/Updates
7.12 Vector Electronics
7.12.1 Vector Electronics Plated Through Hole Prototyping Board Corporation Information
7.12.2 Vector Electronics Plated Through Hole Prototyping Board Product Portfolio
7.12.3 Vector Electronics Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Vector Electronics Main Business and Markets Served
7.12.5 Vector Electronics Recent Developments/Updates
7.13 WAGO Corporation
7.13.1 WAGO Corporation Plated Through Hole Prototyping Board Corporation Information
7.13.2 WAGO Corporation Plated Through Hole Prototyping Board Product Portfolio
7.13.3 WAGO Corporation Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.13.4 WAGO Corporation Main Business and Markets Served
7.13.5 WAGO Corporation Recent Developments/Updates
7.14 Roth Elektronik
7.14.1 Roth Elektronik Plated Through Hole Prototyping Board Corporation Information
7.14.2 Roth Elektronik Plated Through Hole Prototyping Board Product Portfolio
7.14.3 Roth Elektronik Plated Through Hole Prototyping Board Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Roth Elektronik Main Business and Markets Served
7.14.5 Roth Elektronik Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Plated Through Hole Prototyping Board Industry Chain Analysis
8.2 Plated Through Hole Prototyping Board Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Plated Through Hole Prototyping Board Production Mode & Process
8.4 Plated Through Hole Prototyping Board Sales and Marketing
8.4.1 Plated Through Hole Prototyping Board Sales Channels
8.4.2 Plated Through Hole Prototyping Board Distributors
8.5 Plated Through Hole Prototyping Board Customers
9 Plated Through Hole Prototyping Board Market Dynamics
9.1 Plated Through Hole Prototyping Board Industry Trends
9.2 Plated Through Hole Prototyping Board Market Drivers
9.3 Plated Through Hole Prototyping Board Market Challenges
9.4 Plated Through Hole Prototyping Board Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Adafruit Industries LLC
Bud Industries
Chip Quik Inc.
DFRobot
DIGIKEY STANDARD
Digilent, Inc.
MED
Pimoroni Ltd
PTSoIns .
SparkFun Electronics
Twin Industries
Vector Electronics
WAGO Corporation
Roth Elektronik
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*If Applicable.
