
Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
Market Analysis and Insights: Global Plating for Microelectronics Market
Due to the COVID-19 pandemic, the global Plating for Microelectronics market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2029 with a CAGR of % during the forecast period 2023-2029. Fully considering the economic change by this health crisis, Gold accounting for % of the Plating for Microelectronics global market in 2022, is projected to value US$ million by 2029, growing at a revised % CAGR from 2023 to 2029. While MEMS segment is altered to an % CAGR throughout this forecast period.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
Global Plating for Microelectronics Scope and Market Size
The global Plating for Microelectronics market is segmented by company, region (country), by Type and by Application. Players, stakeholders, and other participants in the global Plating for Microelectronics market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2018-2029.
Segment by Type
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Segment by Application
MEMS
PCB
IC
Photoelectron
Others
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
By Company
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Plating for Microelectronics Market Size by Type (2018 VS 2022 VS 2029)
1.2.2 Gold
1.2.3 Zinc
1.2.4 Nickel
1.2.5 Bronze
1.2.6 Tin
1.2.7 Copper
1.2.8 Others
1.3 Market by Application
1.3.1 Global Plating for Microelectronics Market Share by Application (2018 VS 2022 VS 2029)
1.3.2 MEMS
1.3.3 PCB
1.3.4 IC
1.3.5 Photoelectron
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
2 Global Growth Trends
2.1 Global Plating for Microelectronics Market Perspective (2018-2029)
2.2 Global Plating for Microelectronics Market Size by Region: 2018 VS 2022 VS 2029
2.3 Global Plating for Microelectronics Revenue Market Share by Region (2018-2023)
2.4 Global Plating for Microelectronics Revenue Forecast by Region (2024-2029)
2.5 Geographic Market Analysis: Market Facts & Figures
2.5.1 United States Plating for Microelectronics Estimates and Projections (2018-2029)
2.5.2 Europe Plating for Microelectronics Estimates and Projections (2018-2029)
2.5.3 China Plating for Microelectronics Estimates and Projections (2018-2029)
2.5.4 Japan Plating for Microelectronics Estimates and Projections (2018-2029)
2.5.5 Southeast Asia Plating for Microelectronics Estimates and Projections (2018-2029)
2.5.6 India Plating for Microelectronics Estimates and Projections (2018-2029)
3 Global Plating for Microelectronics Competition Landscape by Players
3.1 Global Top Plating for Microelectronics Players by Revenue (2018-2023)
3.1.1 Global Top Plating for Microelectronics Players by Revenue (2018-2023)
3.1.2 Global Plating for Microelectronics Revenue Market Share by Players (2018-2023)
3.2 Global Plating for Microelectronics Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
3.3 Players Covered: Ranking by Plating for Microelectronics Revenue
3.4 Global Plating for Microelectronics Market Concentration Ratio
3.4.1 Global Plating for Microelectronics Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Plating for Microelectronics Revenue in 2022
3.5 Plating for Microelectronics Key Players Head office and Area Served
3.6 Key Players Plating for Microelectronics Product Solution and Service
3.7 Date of Enter into Plating for Microelectronics Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Plating for Microelectronics Breakdown Data by Type
4.1 Global Plating for Microelectronics Historic Market Size by Type (2018-2023)
4.2 Global Plating for Microelectronics Forecasted Market Size by Type (2024-2029)
5 Plating for Microelectronics Breakdown Data by Application
5.1 Global Plating for Microelectronics Historic Market Size by Application (2018-2023)
5.2 Global Plating for Microelectronics Forecasted Market Size by Application (2024-2029)
6 United States Plating for Microelectronics Market Facts & Figures
6.1 United States Plating for Microelectronics Revenue by Company (2018-2023)
6.2 United States Plating for Microelectronics Market Size by Type
6.2.1 United States Plating for Microelectronics Market Size by Type (2018-2023)
6.2.2 United States Plating for Microelectronics Market Size by Type (2024-2029)
6.2.3 United States Plating for Microelectronics Market Share by Type (2018-2029)
6.3 United States Plating for Microelectronics Market Size by Application
6.3.1 United States Plating for Microelectronics Market Size by Application (2018-2023)
6.3.2 United States Plating for Microelectronics Market Size by Application (2024-2029)
6.3.3 United States Plating for Microelectronics Market Share by Application (2018-2029)
7 Europe Plating for Microelectronics Market Facts & Figures
7.1 Europe Plating for Microelectronics Revenue by Company (2018-2023)
7.2 Europe Plating for Microelectronics Market Size by Type
7.2.1 Europe Plating for Microelectronics Market Size by Type (2018-2023)
7.2.2 Europe Plating for Microelectronics Market Size by Type (2024-2029)
7.2.3 Europe Plating for Microelectronics Market Share by Type (2018-2029)
7.3 Europe Plating for Microelectronics Market Size by Application
7.3.1 Europe Plating for Microelectronics Market Size by Application (2018-2023)
7.3.2 Europe Plating for Microelectronics Market Size by Application (2024-2029)
7.3.3 Europe Plating for Microelectronics Market Share by Application (2018-2029)
8 China Plating for Microelectronics Market Facts & Figures
8.1 China Plating for Microelectronics Revenue by Company (2018-2023)
8.2 China Plating for Microelectronics Market Size by Type
8.2.1 China Plating for Microelectronics Market Size by Type (2018-2023)
8.2.2 China Plating for Microelectronics Market Size by Type (2024-2029)
8.2.3 China Plating for Microelectronics Market Share by Type (2018-2029)
8.3 China Plating for Microelectronics Market Size by Application
8.3.1 China Plating for Microelectronics Market Size by Application (2018-2023)
8.3.2 China Plating for Microelectronics Market Size by Application (2024-2029)
8.3.3 China Plating for Microelectronics Market Share by Application (2018-2029)
9 Japan Plating for Microelectronics Market Facts & Figures
9.1 Japan Plating for Microelectronics Revenue by Company (2018-2023)
9.2 Japan Plating for Microelectronics Market Size by Type
9.2.1 Japan Plating for Microelectronics Market Size by Type (2018-2023)
9.2.2 Japan Plating for Microelectronics Market Size by Type (2024-2029)
9.2.3 Japan Plating for Microelectronics Market Share by Type (2018-2029)
9.3 Japan Plating for Microelectronics Market Size by Application
9.3.1 Japan Plating for Microelectronics Market Size by Application (2018-2023)
9.3.2 Japan Plating for Microelectronics Market Size by Application (2024-2029)
9.3.3 Japan Plating for Microelectronics Market Share by Application (2018-2029)
10 Southeast Asia Plating for Microelectronics Market Facts & Figures
10.1 Southeast Asia Plating for Microelectronics Revenue by Company (2018-2023)
10.2 Southeast Asia Plating for Microelectronics Market Size by Type
10.2.1 Southeast Asia Plating for Microelectronics Market Size by Type (2018-2023)
10.2.2 Southeast Asia Plating for Microelectronics Market Size by Type (2024-2029)
10.2.3 Southeast Asia Plating for Microelectronics Market Share by Type (2018-2029)
10.3 Southeast Asia Plating for Microelectronics Market Size by Application
10.3.1 Southeast Asia Plating for Microelectronics Market Size by Application (2018-2023)
10.3.2 Southeast Asia Plating for Microelectronics Market Size by Application (2024-2029)
10.3.3 Southeast Asia Plating for Microelectronics Market Share by Application (2018-2029)
11 India Plating for Microelectronics Market Facts & Figures
11.1 India Plating for Microelectronics Revenue by Company (2018-2023)
11.2 India Plating for Microelectronics Market Size by Type
11.2.1 India Plating for Microelectronics Market Size by Type (2018-2023)
11.2.2 India Plating for Microelectronics Market Size by Type (2024-2029)
11.2.3 India Plating for Microelectronics Market Share by Type (2018-2029)
11.3 India Plating for Microelectronics Market Size by Application
11.3.1 India Plating for Microelectronics Market Size by Application (2018-2023)
11.3.2 India Plating for Microelectronics Market Size by Application (2024-2029)
11.3.3 India Plating for Microelectronics Market Share by Application (2018-2029)
12 Key Players Profiles
12.1 DOW
12.1.1 DOW Company Details
12.1.2 DOW Business Overview
12.1.3 DOW Plating for Microelectronics Introduction
12.1.4 DOW Revenue in Plating for Microelectronics Business (2018-2023)
12.1.5 DOW Recent Development
12.2 Mitsubishi Materials Corporation
12.2.1 Mitsubishi Materials Corporation Company Details
12.2.2 Mitsubishi Materials Corporation Business Overview
12.2.3 Mitsubishi Materials Corporation Plating for Microelectronics Introduction
12.2.4 Mitsubishi Materials Corporation Revenue in Plating for Microelectronics Business (2018-2023)
12.2.5 Mitsubishi Materials Corporation Recent Development
12.3 Heraeus
12.3.1 Heraeus Company Details
12.3.2 Heraeus Business Overview
12.3.3 Heraeus Plating for Microelectronics Introduction
12.3.4 Heraeus Revenue in Plating for Microelectronics Business (2018-2023)
12.3.5 Heraeus Recent Development
12.4 XiLong Scientific
12.4.1 XiLong Scientific Company Details
12.4.2 XiLong Scientific Business Overview
12.4.3 XiLong Scientific Plating for Microelectronics Introduction
12.4.4 XiLong Scientific Revenue in Plating for Microelectronics Business (2018-2023)
12.4.5 XiLong Scientific Recent Development
12.5 Atotech
12.5.1 Atotech Company Details
12.5.2 Atotech Business Overview
12.5.3 Atotech Plating for Microelectronics Introduction
12.5.4 Atotech Revenue in Plating for Microelectronics Business (2018-2023)
12.5.5 Atotech Recent Development
12.6 Yamato Denki
12.6.1 Yamato Denki Company Details
12.6.2 Yamato Denki Business Overview
12.6.3 Yamato Denki Plating for Microelectronics Introduction
12.6.4 Yamato Denki Revenue in Plating for Microelectronics Business (2018-2023)
12.6.5 Yamato Denki Recent Development
12.7 Meltex
12.7.1 Meltex Company Details
12.7.2 Meltex Business Overview
12.7.3 Meltex Plating for Microelectronics Introduction
12.7.4 Meltex Revenue in Plating for Microelectronics Business (2018-2023)
12.7.5 Meltex Recent Development
12.8 Ishihara Chemical
12.8.1 Ishihara Chemical Company Details
12.8.2 Ishihara Chemical Business Overview
12.8.3 Ishihara Chemical Plating for Microelectronics Introduction
12.8.4 Ishihara Chemical Revenue in Plating for Microelectronics Business (2018-2023)
12.8.5 Ishihara Chemical Recent Development
12.9 Raschig GmbH
12.9.1 Raschig GmbH Company Details
12.9.2 Raschig GmbH Business Overview
12.9.3 Raschig GmbH Plating for Microelectronics Introduction
12.9.4 Raschig GmbH Revenue in Plating for Microelectronics Business (2018-2023)
12.9.5 Raschig GmbH Recent Development
12.10 Japan Pure Chemical
12.10.1 Japan Pure Chemical Company Details
12.10.2 Japan Pure Chemical Business Overview
12.10.3 Japan Pure Chemical Plating for Microelectronics Introduction
12.10.4 Japan Pure Chemical Revenue in Plating for Microelectronics Business (2018-2023)
12.10.5 Japan Pure Chemical Recent Development
12.11 Coatech
12.11.1 Coatech Company Details
12.11.2 Coatech Business Overview
12.11.3 Coatech Plating for Microelectronics Introduction
12.11.4 Coatech Revenue in Plating for Microelectronics Business (2018-2023)
12.11.5 Coatech Recent Development
12.12 MAGNETO special anodes
12.12.1 MAGNETO special anodes Company Details
12.12.2 MAGNETO special anodes Business Overview
12.12.3 MAGNETO special anodes Plating for Microelectronics Introduction
12.12.4 MAGNETO special anodes Revenue in Plating for Microelectronics Business (2018-2023)
12.12.5 MAGNETO special anodes Recent Development
12.13 Vopelius Chemie AG
12.13.1 Vopelius Chemie AG Company Details
12.13.2 Vopelius Chemie AG Business Overview
12.13.3 Vopelius Chemie AG Plating for Microelectronics Introduction
12.13.4 Vopelius Chemie AG Revenue in Plating for Microelectronics Business (2018-2023)
12.13.5 Vopelius Chemie AG Recent Development
12.14 Moses Lake Industries
12.14.1 Moses Lake Industries Company Details
12.14.2 Moses Lake Industries Business Overview
12.14.3 Moses Lake Industries Plating for Microelectronics Introduction
12.14.4 Moses Lake Industries Revenue in Plating for Microelectronics Business (2018-2023)
12.14.5 Moses Lake Industries Recent Development
12.15 JCU International
12.15.1 JCU International Company Details
12.15.2 JCU International Business Overview
12.15.3 JCU International Plating for Microelectronics Introduction
12.15.4 JCU International Revenue in Plating for Microelectronics Business (2018-2023)
12.15.5 JCU International Recent Development
13 Market Dynamics
13.1 Plating for Microelectronics Industry Trends
13.2 Plating for Microelectronics Market Drivers
13.3 Plating for Microelectronics Market Challenges
13.4 Plating for Microelectronics Market Restraints
14 Research Findings and Conclusion
15 Appendix
15.1 Research Methodology
15.1.1 Methodology/Research Approach
15.1.2 Data Source
15.2 Author List
15.3 Disclaimer
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
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*If Applicable.
