A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices.
The global Power Module Packaging market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density.听
In terms of production side, this report researches the Power Module Packaging production, growth rate, market share by manufacturers and by region (region level and country level), from 2018 to 2023, and forecast to 2029.
In terms of consumption side, this report focuses on the sales of Power Module Packaging by region (region level and country level), by company, by Type and by Application. from 2018 to 2023 and forecast to 2029.
Report Includes:
This report presents an overview of global market for Power Module Packaging, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2018 - 2022, estimates for 2023, and projections of CAGR through 2029.
This report researches the key producers of Power Module Packaging, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Power Module Packaging, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Power Module Packaging sales, revenue, market share and industry ranking of main manufacturers, data from 2018 to 2023. Identification of the major stakeholders in the global Power Module Packaging market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2018 to 2029. Evaluation and forecast the market size for Power Module Packaging sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including Texas Instruments Incorporated, Star Automations, DyDac Controls, SEMIKRON, IXYS Corporation, Infineon Technologies AG, Mitsubishi Electric Corporation, Fuji Electric and Sanken Electric, etc.
By Company
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric
Sanken Electric
Sansha Electric
ON Semiconductor
STMicroelectronics
Hitachi Power Semiconductor Device
ROHM
Danfoss
Segment by Type
GaN Module
SiC Module
FET Module
IGBT Module
Others
Segment by Application
Electric Vehicles (EV)
Rail Tractions
Wind Turbines
Photovoltaic Equipment
Others
Production by Region
North America
Europe
China
Japan
South Korea
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Power Module Packaging production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Power Module Packaging in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of Power Module Packaging manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by type, by application and by country, sales and revenue for each segment.
Chapter 8: Europe by type, by application and by country, sales and revenue for each segment.
Chapter 9: China by type and by application sales and revenue for each segment.
Chapter 10: Asia (excluding China) by type, by application and by region, sales and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by type, by application and by country, sales and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Power Module Packaging sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
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1 Study Coverage
1.1 Power Module Packaging Product Introduction
1.2 Market by Type
1.2.1 Global Power Module Packaging Market Size by Type, 2018 VS 2022 VS 2029
1.2.2 GaN Module
1.2.3 SiC Module
1.2.4 FET Module
1.2.5 IGBT Module
1.2.6 Others
1.3 Market by Application
1.3.1 Global Power Module Packaging Market Size by Application, 2018 VS 2022 VS 2029
1.3.2 Electric Vehicles (EV)
1.3.3 Rail Tractions
1.3.4 Wind Turbines
1.3.5 Photovoltaic Equipment
1.3.6 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Power Module Packaging Production
2.1 Global Power Module Packaging Production Capacity (2018-2029)
2.2 Global Power Module Packaging Production by Region: 2018 VS 2022 VS 2029
2.3 Global Power Module Packaging Production by Region
2.3.1 Global Power Module Packaging Historic Production by Region (2018-2023)
2.3.2 Global Power Module Packaging Forecasted Production by Region (2024-2029)
2.3.3 Global Power Module Packaging Production Market Share by Region (2018-2029)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global Power Module Packaging Revenue Estimates and Forecasts 2018-2029
3.2 Global Power Module Packaging Revenue by Region
3.2.1 Global Power Module Packaging Revenue by Region: 2018 VS 2022 VS 2029
3.2.2 Global Power Module Packaging Revenue by Region (2018-2023)
3.2.3 Global Power Module Packaging Revenue by Region (2024-2029)
3.2.4 Global Power Module Packaging Revenue Market Share by Region (2018-2029)
3.3 Global Power Module Packaging Sales Estimates and Forecasts 2018-2029
3.4 Global Power Module Packaging Sales by Region
3.4.1 Global Power Module Packaging Sales by Region: 2018 VS 2022 VS 2029
3.4.2 Global Power Module Packaging Sales by Region (2018-2023)
3.4.3 Global Power Module Packaging Sales by Region (2024-2029)
3.4.4 Global Power Module Packaging Sales Market Share by Region (2018-2029)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Power Module Packaging Sales by Manufacturers
4.1.1 Global Power Module Packaging Sales by Manufacturers (2018-2023)
4.1.2 Global Power Module Packaging Sales Market Share by Manufacturers (2018-2023)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Power Module Packaging in 2022
4.2 Global Power Module Packaging Revenue by Manufacturers
4.2.1 Global Power Module Packaging Revenue by Manufacturers (2018-2023)
4.2.2 Global Power Module Packaging Revenue Market Share by Manufacturers (2018-2023)
4.2.3 Global Top 10 and Top 5 Companies by Power Module Packaging Revenue in 2022
4.3 Global Power Module Packaging Sales Price by Manufacturers
4.4 Global Key Players of Power Module Packaging, Industry Ranking, 2021 VS 2022 VS 2023
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Power Module Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Power Module Packaging, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Power Module Packaging, Product Offered and Application
4.8 Global Key Manufacturers of Power Module Packaging, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Power Module Packaging Sales by Type
5.1.1 Global Power Module Packaging Historical Sales by Type (2018-2023)
5.1.2 Global Power Module Packaging Forecasted Sales by Type (2024-2029)
5.1.3 Global Power Module Packaging Sales Market Share by Type (2018-2029)
5.2 Global Power Module Packaging Revenue by Type
5.2.1 Global Power Module Packaging Historical Revenue by Type (2018-2023)
5.2.2 Global Power Module Packaging Forecasted Revenue by Type (2024-2029)
5.2.3 Global Power Module Packaging Revenue Market Share by Type (2018-2029)
5.3 Global Power Module Packaging Price by Type
5.3.1 Global Power Module Packaging Price by Type (2018-2023)
5.3.2 Global Power Module Packaging Price Forecast by Type (2024-2029)
6 Market Size by Application
6.1 Global Power Module Packaging Sales by Application
6.1.1 Global Power Module Packaging Historical Sales by Application (2018-2023)
6.1.2 Global Power Module Packaging Forecasted Sales by Application (2024-2029)
6.1.3 Global Power Module Packaging Sales Market Share by Application (2018-2029)
6.2 Global Power Module Packaging Revenue by Application
6.2.1 Global Power Module Packaging Historical Revenue by Application (2018-2023)
6.2.2 Global Power Module Packaging Forecasted Revenue by Application (2024-2029)
6.2.3 Global Power Module Packaging Revenue Market Share by Application (2018-2029)
6.3 Global Power Module Packaging Price by Application
6.3.1 Global Power Module Packaging Price by Application (2018-2023)
6.3.2 Global Power Module Packaging Price Forecast by Application (2024-2029)
7 US & Canada
7.1 US & Canada Power Module Packaging Market Size by Type
7.1.1 US & Canada Power Module Packaging Sales by Type (2018-2029)
7.1.2 US & Canada Power Module Packaging Revenue by Type (2018-2029)
7.2 US & Canada Power Module Packaging Market Size by Application
7.2.1 US & Canada Power Module Packaging Sales by Application (2018-2029)
7.2.2 US & Canada Power Module Packaging Revenue by Application (2018-2029)
7.3 US & Canada Power Module Packaging Sales by Country
7.3.1 US & Canada Power Module Packaging Revenue by Country: 2018 VS 2022 VS 2029
7.3.2 US & Canada Power Module Packaging Sales by Country (2018-2029)
7.3.3 US & Canada Power Module Packaging Revenue by Country (2018-2029)
7.3.4 U.S.
7.3.5 Canada
8 Europe
8.1 Europe Power Module Packaging Market Size by Type
8.1.1 Europe Power Module Packaging Sales by Type (2018-2029)
8.1.2 Europe Power Module Packaging Revenue by Type (2018-2029)
8.2 Europe Power Module Packaging Market Size by Application
8.2.1 Europe Power Module Packaging Sales by Application (2018-2029)
8.2.2 Europe Power Module Packaging Revenue by Application (2018-2029)
8.3 Europe Power Module Packaging Sales by Country
8.3.1 Europe Power Module Packaging Revenue by Country: 2018 VS 2022 VS 2029
8.3.2 Europe Power Module Packaging Sales by Country (2018-2029)
8.3.3 Europe Power Module Packaging Revenue by Country (2018-2029)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Power Module Packaging Market Size by Type
9.1.1 China Power Module Packaging Sales by Type (2018-2029)
9.1.2 China Power Module Packaging Revenue by Type (2018-2029)
9.2 China Power Module Packaging Market Size by Application
9.2.1 China Power Module Packaging Sales by Application (2018-2029)
9.2.2 China Power Module Packaging Revenue by Application (2018-2029)
10 Asia (excluding China)
10.1 Asia Power Module Packaging Market Size by Type
10.1.1 Asia Power Module Packaging Sales by Type (2018-2029)
10.1.2 Asia Power Module Packaging Revenue by Type (2018-2029)
10.2 Asia Power Module Packaging Market Size by Application
10.2.1 Asia Power Module Packaging Sales by Application (2018-2029)
10.2.2 Asia Power Module Packaging Revenue by Application (2018-2029)
10.3 Asia Power Module Packaging Sales by Region
10.3.1 Asia Power Module Packaging Revenue by Region: 2018 VS 2022 VS 2029
10.3.2 Asia Power Module Packaging Revenue by Region (2018-2029)
10.3.3 Asia Power Module Packaging Sales by Region (2018-2029)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Power Module Packaging Market Size by Type
11.1.1 Middle East, Africa and Latin America Power Module Packaging Sales by Type (2018-2029)
11.1.2 Middle East, Africa and Latin America Power Module Packaging Revenue by Type (2018-2029)
11.2 Middle East, Africa and Latin America Power Module Packaging Market Size by Application
11.2.1 Middle East, Africa and Latin America Power Module Packaging Sales by Application (2018-2029)
11.2.2 Middle East, Africa and Latin America Power Module Packaging Revenue by Application (2018-2029)
11.3 Middle East, Africa and Latin America Power Module Packaging Sales by Country
11.3.1 Middle East, Africa and Latin America Power Module Packaging Revenue by Country: 2018 VS 2022 VS 2029
11.3.2 Middle East, Africa and Latin America Power Module Packaging Revenue by Country (2018-2029)
11.3.3 Middle East, Africa and Latin America Power Module Packaging Sales by Country (2018-2029)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 Texas Instruments Incorporated
12.1.1 Texas Instruments Incorporated Company Information
12.1.2 Texas Instruments Incorporated Overview
12.1.3 Texas Instruments Incorporated Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.1.4 Texas Instruments Incorporated Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Texas Instruments Incorporated Recent Developments
12.2 Star Automations
12.2.1 Star Automations Company Information
12.2.2 Star Automations Overview
12.2.3 Star Automations Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.2.4 Star Automations Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Star Automations Recent Developments
12.3 DyDac Controls
12.3.1 DyDac Controls Company Information
12.3.2 DyDac Controls Overview
12.3.3 DyDac Controls Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.3.4 DyDac Controls Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 DyDac Controls Recent Developments
12.4 SEMIKRON
12.4.1 SEMIKRON Company Information
12.4.2 SEMIKRON Overview
12.4.3 SEMIKRON Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.4.4 SEMIKRON Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 SEMIKRON Recent Developments
12.5 IXYS Corporation
12.5.1 IXYS Corporation Company Information
12.5.2 IXYS Corporation Overview
12.5.3 IXYS Corporation Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.5.4 IXYS Corporation Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 IXYS Corporation Recent Developments
12.6 Infineon Technologies AG
12.6.1 Infineon Technologies AG Company Information
12.6.2 Infineon Technologies AG Overview
12.6.3 Infineon Technologies AG Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.6.4 Infineon Technologies AG Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Infineon Technologies AG Recent Developments
12.7 Mitsubishi Electric Corporation
12.7.1 Mitsubishi Electric Corporation Company Information
12.7.2 Mitsubishi Electric Corporation Overview
12.7.3 Mitsubishi Electric Corporation Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.7.4 Mitsubishi Electric Corporation Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Mitsubishi Electric Corporation Recent Developments
12.8 Fuji Electric
12.8.1 Fuji Electric Company Information
12.8.2 Fuji Electric Overview
12.8.3 Fuji Electric Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.8.4 Fuji Electric Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Fuji Electric Recent Developments
12.9 Sanken Electric
12.9.1 Sanken Electric Company Information
12.9.2 Sanken Electric Overview
12.9.3 Sanken Electric Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.9.4 Sanken Electric Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Sanken Electric Recent Developments
12.10 Sansha Electric
12.10.1 Sansha Electric Company Information
12.10.2 Sansha Electric Overview
12.10.3 Sansha Electric Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.10.4 Sansha Electric Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Sansha Electric Recent Developments
12.11 ON Semiconductor
12.11.1 ON Semiconductor Company Information
12.11.2 ON Semiconductor Overview
12.11.3 ON Semiconductor Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.11.4 ON Semiconductor Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 ON Semiconductor Recent Developments
12.12 STMicroelectronics
12.12.1 STMicroelectronics Company Information
12.12.2 STMicroelectronics Overview
12.12.3 STMicroelectronics Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.12.4 STMicroelectronics Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 STMicroelectronics Recent Developments
12.13 Hitachi Power Semiconductor Device
12.13.1 Hitachi Power Semiconductor Device Company Information
12.13.2 Hitachi Power Semiconductor Device Overview
12.13.3 Hitachi Power Semiconductor Device Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.13.4 Hitachi Power Semiconductor Device Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 Hitachi Power Semiconductor Device Recent Developments
12.14 ROHM
12.14.1 ROHM Company Information
12.14.2 ROHM Overview
12.14.3 ROHM Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.14.4 ROHM Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 ROHM Recent Developments
12.15 Danfoss
12.15.1 Danfoss Company Information
12.15.2 Danfoss Overview
12.15.3 Danfoss Power Module Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.15.4 Danfoss Power Module Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 Danfoss Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Power Module Packaging Industry Chain Analysis
13.2 Power Module Packaging Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Power Module Packaging Production Mode & Process
13.4 Power Module Packaging Sales and Marketing
13.4.1 Power Module Packaging Sales Channels
13.4.2 Power Module Packaging Distributors
13.5 Power Module Packaging Customers
14 Power Module Packaging Market Dynamics
14.1 Power Module Packaging Industry Trends
14.2 Power Module Packaging Market Drivers
14.3 Power Module Packaging Market Challenges
14.4 Power Module Packaging Market Restraints
15 Key Finding in The Global Power Module Packaging Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric
Sanken Electric
Sansha Electric
ON Semiconductor
STMicroelectronics
Hitachi Power Semiconductor Device
ROHM
Danfoss
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*If Applicable.
