Traditional packaging usually refers to a process in which wafers are first cut into individual chips and then packaged. Advanced packaging such as wafer-level chip-scale packaging is a technology that packages and tests the entire wafer and then cuts it into individual finished chips. The size of the packaged chip is the same as that of the bare chip. The probe cards produced by some domestic and foreign manufacturers are only used before packaging. The main goal is to establish electrical connections between test equipment and wafer circuits so that these circuits can be verified and tested before cutting and packaging. The manufacturers of probe cards used in advanced packaging are counted here to clearly illustrate the manufacturers who produce probe cards that can be applied to WLCSP, SIP and other technologies.
The global Probe Card for Advanced Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Probe Card for Advanced Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Probe Card for Advanced Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Probe Card for Advanced Packaging include FormFactor, Nidec SV Probe, Feinmetall, Will Technology, MJC, STAr Technologies, Inc., Japan Electronic Materials (JEM) and Shenzhen DGT, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Probe Card for Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Probe Card for Advanced Packaging.
Report Scope
The Probe Card for Advanced Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Probe Card for Advanced Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Probe Card for Advanced Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
FormFactor
Nidec SV Probe
Feinmetall
Will Technology
MJC
STAr Technologies, Inc.
Japan Electronic Materials (JEM)
Shenzhen DGT
Segment by Type
MEMS Probe Card
Vertical Probe Card
Cantilever Probe Card
Others
Segment by Application
WLCSP
SIP
Package in Package
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Probe Card for Advanced Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Probe Card for Advanced Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Probe Card for Advanced Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Probe Card for Advanced Packaging Market Overview
1.1 Product Definition
1.2 Probe Card for Advanced Packaging Segment by Type
1.2.1 Global Probe Card for Advanced Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 MEMS Probe Card
1.2.3 Vertical Probe Card
1.2.4 Cantilever Probe Card
1.2.5 Others
1.3 Probe Card for Advanced Packaging Segment by Application
1.3.1 Global Probe Card for Advanced Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 WLCSP
1.3.3 SIP
1.3.4 Package in Package
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Probe Card for Advanced Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Probe Card for Advanced Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Probe Card for Advanced Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Probe Card for Advanced Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Probe Card for Advanced Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Probe Card for Advanced Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Probe Card for Advanced Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Probe Card for Advanced Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Probe Card for Advanced Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Probe Card for Advanced Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Probe Card for Advanced Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Probe Card for Advanced Packaging, Date of Enter into This Industry
2.9 Probe Card for Advanced Packaging Market Competitive Situation and Trends
2.9.1 Probe Card for Advanced Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Probe Card for Advanced Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Probe Card for Advanced Packaging Production by Region
3.1 Global Probe Card for Advanced Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Probe Card for Advanced Packaging Production Value by Region (2019-2030)
3.2.1 Global Probe Card for Advanced Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Probe Card for Advanced Packaging by Region (2025-2030)
3.3 Global Probe Card for Advanced Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Probe Card for Advanced Packaging Production by Region (2019-2030)
3.4.1 Global Probe Card for Advanced Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Probe Card for Advanced Packaging by Region (2025-2030)
3.5 Global Probe Card for Advanced Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Probe Card for Advanced Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Probe Card for Advanced Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Probe Card for Advanced Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Probe Card for Advanced Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Probe Card for Advanced Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Probe Card for Advanced Packaging Production Value Estimates and Forecasts (2019-2030)
4 Probe Card for Advanced Packaging Consumption by Region
4.1 Global Probe Card for Advanced Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Probe Card for Advanced Packaging Consumption by Region (2019-2030)
4.2.1 Global Probe Card for Advanced Packaging Consumption by Region (2019-2024)
4.2.2 Global Probe Card for Advanced Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Probe Card for Advanced Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Probe Card for Advanced Packaging Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Probe Card for Advanced Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Probe Card for Advanced Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Probe Card for Advanced Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Probe Card for Advanced Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Probe Card for Advanced Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Probe Card for Advanced Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Probe Card for Advanced Packaging Production by Type (2019-2030)
5.1.1 Global Probe Card for Advanced Packaging Production by Type (2019-2024)
5.1.2 Global Probe Card for Advanced Packaging Production by Type (2025-2030)
5.1.3 Global Probe Card for Advanced Packaging Production Market Share by Type (2019-2030)
5.2 Global Probe Card for Advanced Packaging Production Value by Type (2019-2030)
5.2.1 Global Probe Card for Advanced Packaging Production Value by Type (2019-2024)
5.2.2 Global Probe Card for Advanced Packaging Production Value by Type (2025-2030)
5.2.3 Global Probe Card for Advanced Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Probe Card for Advanced Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Probe Card for Advanced Packaging Production by Application (2019-2030)
6.1.1 Global Probe Card for Advanced Packaging Production by Application (2019-2024)
6.1.2 Global Probe Card for Advanced Packaging Production by Application (2025-2030)
6.1.3 Global Probe Card for Advanced Packaging Production Market Share by Application (2019-2030)
6.2 Global Probe Card for Advanced Packaging Production Value by Application (2019-2030)
6.2.1 Global Probe Card for Advanced Packaging Production Value by Application (2019-2024)
6.2.2 Global Probe Card for Advanced Packaging Production Value by Application (2025-2030)
6.2.3 Global Probe Card for Advanced Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Probe Card for Advanced Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 FormFactor
7.1.1 FormFactor Probe Card for Advanced Packaging Corporation Information
7.1.2 FormFactor Probe Card for Advanced Packaging Product Portfolio
7.1.3 FormFactor Probe Card for Advanced Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 FormFactor Main Business and Markets Served
7.1.5 FormFactor Recent Developments/Updates
7.2 Nidec SV Probe
7.2.1 Nidec SV Probe Probe Card for Advanced Packaging Corporation Information
7.2.2 Nidec SV Probe Probe Card for Advanced Packaging Product Portfolio
7.2.3 Nidec SV Probe Probe Card for Advanced Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Nidec SV Probe Main Business and Markets Served
7.2.5 Nidec SV Probe Recent Developments/Updates
7.3 Feinmetall
7.3.1 Feinmetall Probe Card for Advanced Packaging Corporation Information
7.3.2 Feinmetall Probe Card for Advanced Packaging Product Portfolio
7.3.3 Feinmetall Probe Card for Advanced Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Feinmetall Main Business and Markets Served
7.3.5 Feinmetall Recent Developments/Updates
7.4 Will Technology
7.4.1 Will Technology Probe Card for Advanced Packaging Corporation Information
7.4.2 Will Technology Probe Card for Advanced Packaging Product Portfolio
7.4.3 Will Technology Probe Card for Advanced Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Will Technology Main Business and Markets Served
7.4.5 Will Technology Recent Developments/Updates
7.5 MJC
7.5.1 MJC Probe Card for Advanced Packaging Corporation Information
7.5.2 MJC Probe Card for Advanced Packaging Product Portfolio
7.5.3 MJC Probe Card for Advanced Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 MJC Main Business and Markets Served
7.5.5 MJC Recent Developments/Updates
7.6 STAr Technologies, Inc.
7.6.1 STAr Technologies, Inc. Probe Card for Advanced Packaging Corporation Information
7.6.2 STAr Technologies, Inc. Probe Card for Advanced Packaging Product Portfolio
7.6.3 STAr Technologies, Inc. Probe Card for Advanced Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 STAr Technologies, Inc. Main Business and Markets Served
7.6.5 STAr Technologies, Inc. Recent Developments/Updates
7.7 Japan Electronic Materials (JEM)
7.7.1 Japan Electronic Materials (JEM) Probe Card for Advanced Packaging Corporation Information
7.7.2 Japan Electronic Materials (JEM) Probe Card for Advanced Packaging Product Portfolio
7.7.3 Japan Electronic Materials (JEM) Probe Card for Advanced Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Japan Electronic Materials (JEM) Main Business and Markets Served
7.7.5 Japan Electronic Materials (JEM) Recent Developments/Updates
7.8 Shenzhen DGT
7.8.1 Shenzhen DGT Probe Card for Advanced Packaging Corporation Information
7.8.2 Shenzhen DGT Probe Card for Advanced Packaging Product Portfolio
7.8.3 Shenzhen DGT Probe Card for Advanced Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Shenzhen DGT Main Business and Markets Served
7.7.5 Shenzhen DGT Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Probe Card for Advanced Packaging Industry Chain Analysis
8.2 Probe Card for Advanced Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Probe Card for Advanced Packaging Production Mode & Process
8.4 Probe Card for Advanced Packaging Sales and Marketing
8.4.1 Probe Card for Advanced Packaging Sales Channels
8.4.2 Probe Card for Advanced Packaging Distributors
8.5 Probe Card for Advanced Packaging Customers
9 Probe Card for Advanced Packaging Market Dynamics
9.1 Probe Card for Advanced Packaging Industry Trends
9.2 Probe Card for Advanced Packaging Market Drivers
9.3 Probe Card for Advanced Packaging Market Challenges
9.4 Probe Card for Advanced Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FormFactor
Nidec SV Probe
Feinmetall
Will Technology
MJC
STAr Technologies, Inc.
Japan Electronic Materials (JEM)
Shenzhen DGT
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*If Applicable.
