Highlights
The global Radiation-Hardened Electronics for Space Application market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Radiation-Hardened Electronics for Space Application is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Radiation-Hardened Electronics for Space Application is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global market for Radiation-Hardened Electronics for Space Application in Satellite is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Radiation-Hardened Electronics for Space Application include 3D Plus, Analog Devices, Inc., Apogee Semiconductor, Cobham Plc, Data Device Corporation, Exxelia, General Dynamics, GSI Technology, Inc. and Infineon Technologies, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Radiation-Hardened Electronics for Space Application, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Radiation-Hardened Electronics for Space Application.
The Radiation-Hardened Electronics for Space Application market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Radiation-Hardened Electronics for Space Application market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Radiation-Hardened Electronics for Space Application companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
3D Plus
Analog Devices, Inc.
Apogee Semiconductor
Cobham Plc
Data Device Corporation
Exxelia
General Dynamics
GSI Technology, Inc.
Infineon Technologies
Mercury Systems, Inc.
Microchip Technology, Inc.
Micropac Industries
Renesas Electronics Corporation
Solid State Devices, Inc.
STMicroelectronics N.V.
Teledyne Technologies
Texas Instruments
Vorago Technologies
Xilinx, Inc.
Segment by Type
Silicon Material
Gallium Nitride Material
Silicon Carbide Material
Others
Segment by Application
Satellite
Launch Vehicle
Deep Space Probe
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Radiation-Hardened Electronics for Space Application companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Radiation-Hardened Electronics for Space Application Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Silicon Material
1.2.3 Gallium Nitride Material
1.2.4 Silicon Carbide Material
1.2.5 Others
1.3 Market by Application
1.3.1 Global Radiation-Hardened Electronics for Space Application Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Satellite
1.3.3 Launch Vehicle
1.3.4 Deep Space Probe
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Radiation-Hardened Electronics for Space Application Market Perspective (2018-2029)
2.2 Radiation-Hardened Electronics for Space Application Growth Trends by Region
2.2.1 Global Radiation-Hardened Electronics for Space Application Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Radiation-Hardened Electronics for Space Application Historic Market Size by Region (2018-2023)
2.2.3 Radiation-Hardened Electronics for Space Application Forecasted Market Size by Region (2024-2029)
2.3 Radiation-Hardened Electronics for Space Application Market Dynamics
2.3.1 Radiation-Hardened Electronics for Space Application Industry Trends
2.3.2 Radiation-Hardened Electronics for Space Application Market Drivers
2.3.3 Radiation-Hardened Electronics for Space Application Market Challenges
2.3.4 Radiation-Hardened Electronics for Space Application Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Radiation-Hardened Electronics for Space Application Players by Revenue
3.1.1 Global Top Radiation-Hardened Electronics for Space Application Players by Revenue (2018-2023)
3.1.2 Global Radiation-Hardened Electronics for Space Application Revenue Market Share by Players (2018-2023)
3.2 Global Radiation-Hardened Electronics for Space Application Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Radiation-Hardened Electronics for Space Application Revenue
3.4 Global Radiation-Hardened Electronics for Space Application Market Concentration Ratio
3.4.1 Global Radiation-Hardened Electronics for Space Application Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Radiation-Hardened Electronics for Space Application Revenue in 2022
3.5 Radiation-Hardened Electronics for Space Application Key Players Head office and Area Served
3.6 Key Players Radiation-Hardened Electronics for Space Application Product Solution and Service
3.7 Date of Enter into Radiation-Hardened Electronics for Space Application Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Radiation-Hardened Electronics for Space Application Breakdown Data by Type
4.1 Global Radiation-Hardened Electronics for Space Application Historic Market Size by Type (2018-2023)
4.2 Global Radiation-Hardened Electronics for Space Application Forecasted Market Size by Type (2024-2029)
5 Radiation-Hardened Electronics for Space Application Breakdown Data by Application
5.1 Global Radiation-Hardened Electronics for Space Application Historic Market Size by Application (2018-2023)
5.2 Global Radiation-Hardened Electronics for Space Application Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Radiation-Hardened Electronics for Space Application Market Size (2018-2029)
6.2 North America Radiation-Hardened Electronics for Space Application Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Radiation-Hardened Electronics for Space Application Market Size by Country (2018-2023)
6.4 North America Radiation-Hardened Electronics for Space Application Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Radiation-Hardened Electronics for Space Application Market Size (2018-2029)
7.2 Europe Radiation-Hardened Electronics for Space Application Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Radiation-Hardened Electronics for Space Application Market Size by Country (2018-2023)
7.4 Europe Radiation-Hardened Electronics for Space Application Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Radiation-Hardened Electronics for Space Application Market Size (2018-2029)
8.2 Asia-Pacific Radiation-Hardened Electronics for Space Application Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Radiation-Hardened Electronics for Space Application Market Size by Region (2018-2023)
8.4 Asia-Pacific Radiation-Hardened Electronics for Space Application Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Radiation-Hardened Electronics for Space Application Market Size (2018-2029)
9.2 Latin America Radiation-Hardened Electronics for Space Application Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Radiation-Hardened Electronics for Space Application Market Size by Country (2018-2023)
9.4 Latin America Radiation-Hardened Electronics for Space Application Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Radiation-Hardened Electronics for Space Application Market Size (2018-2029)
10.2 Middle East & Africa Radiation-Hardened Electronics for Space Application Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Radiation-Hardened Electronics for Space Application Market Size by Country (2018-2023)
10.4 Middle East & Africa Radiation-Hardened Electronics for Space Application Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 3D Plus
11.1.1 3D Plus Company Detail
11.1.2 3D Plus Business Overview
11.1.3 3D Plus Radiation-Hardened Electronics for Space Application Introduction
11.1.4 3D Plus Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.1.5 3D Plus Recent Development
11.2 Analog Devices, Inc.
11.2.1 Analog Devices, Inc. Company Detail
11.2.2 Analog Devices, Inc. Business Overview
11.2.3 Analog Devices, Inc. Radiation-Hardened Electronics for Space Application Introduction
11.2.4 Analog Devices, Inc. Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.2.5 Analog Devices, Inc. Recent Development
11.3 Apogee Semiconductor
11.3.1 Apogee Semiconductor Company Detail
11.3.2 Apogee Semiconductor Business Overview
11.3.3 Apogee Semiconductor Radiation-Hardened Electronics for Space Application Introduction
11.3.4 Apogee Semiconductor Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.3.5 Apogee Semiconductor Recent Development
11.4 Cobham Plc
11.4.1 Cobham Plc Company Detail
11.4.2 Cobham Plc Business Overview
11.4.3 Cobham Plc Radiation-Hardened Electronics for Space Application Introduction
11.4.4 Cobham Plc Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.4.5 Cobham Plc Recent Development
11.5 Data Device Corporation
11.5.1 Data Device Corporation Company Detail
11.5.2 Data Device Corporation Business Overview
11.5.3 Data Device Corporation Radiation-Hardened Electronics for Space Application Introduction
11.5.4 Data Device Corporation Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.5.5 Data Device Corporation Recent Development
11.6 Exxelia
11.6.1 Exxelia Company Detail
11.6.2 Exxelia Business Overview
11.6.3 Exxelia Radiation-Hardened Electronics for Space Application Introduction
11.6.4 Exxelia Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.6.5 Exxelia Recent Development
11.7 General Dynamics
11.7.1 General Dynamics Company Detail
11.7.2 General Dynamics Business Overview
11.7.3 General Dynamics Radiation-Hardened Electronics for Space Application Introduction
11.7.4 General Dynamics Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.7.5 General Dynamics Recent Development
11.8 GSI Technology, Inc.
11.8.1 GSI Technology, Inc. Company Detail
11.8.2 GSI Technology, Inc. Business Overview
11.8.3 GSI Technology, Inc. Radiation-Hardened Electronics for Space Application Introduction
11.8.4 GSI Technology, Inc. Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.8.5 GSI Technology, Inc. Recent Development
11.9 Infineon Technologies
11.9.1 Infineon Technologies Company Detail
11.9.2 Infineon Technologies Business Overview
11.9.3 Infineon Technologies Radiation-Hardened Electronics for Space Application Introduction
11.9.4 Infineon Technologies Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.9.5 Infineon Technologies Recent Development
11.10 Mercury Systems, Inc.
11.10.1 Mercury Systems, Inc. Company Detail
11.10.2 Mercury Systems, Inc. Business Overview
11.10.3 Mercury Systems, Inc. Radiation-Hardened Electronics for Space Application Introduction
11.10.4 Mercury Systems, Inc. Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.10.5 Mercury Systems, Inc. Recent Development
11.11 Microchip Technology, Inc.
11.11.1 Microchip Technology, Inc. Company Detail
11.11.2 Microchip Technology, Inc. Business Overview
11.11.3 Microchip Technology, Inc. Radiation-Hardened Electronics for Space Application Introduction
11.11.4 Microchip Technology, Inc. Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.11.5 Microchip Technology, Inc. Recent Development
11.12 Micropac Industries
11.12.1 Micropac Industries Company Detail
11.12.2 Micropac Industries Business Overview
11.12.3 Micropac Industries Radiation-Hardened Electronics for Space Application Introduction
11.12.4 Micropac Industries Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.12.5 Micropac Industries Recent Development
11.13 Renesas Electronics Corporation
11.13.1 Renesas Electronics Corporation Company Detail
11.13.2 Renesas Electronics Corporation Business Overview
11.13.3 Renesas Electronics Corporation Radiation-Hardened Electronics for Space Application Introduction
11.13.4 Renesas Electronics Corporation Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.13.5 Renesas Electronics Corporation Recent Development
11.14 Solid State Devices, Inc.
11.14.1 Solid State Devices, Inc. Company Detail
11.14.2 Solid State Devices, Inc. Business Overview
11.14.3 Solid State Devices, Inc. Radiation-Hardened Electronics for Space Application Introduction
11.14.4 Solid State Devices, Inc. Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.14.5 Solid State Devices, Inc. Recent Development
11.15 STMicroelectronics N.V.
11.15.1 STMicroelectronics N.V. Company Detail
11.15.2 STMicroelectronics N.V. Business Overview
11.15.3 STMicroelectronics N.V. Radiation-Hardened Electronics for Space Application Introduction
11.15.4 STMicroelectronics N.V. Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.15.5 STMicroelectronics N.V. Recent Development
11.16 Teledyne Technologies
11.16.1 Teledyne Technologies Company Detail
11.16.2 Teledyne Technologies Business Overview
11.16.3 Teledyne Technologies Radiation-Hardened Electronics for Space Application Introduction
11.16.4 Teledyne Technologies Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.16.5 Teledyne Technologies Recent Development
11.17 Texas Instruments
11.17.1 Texas Instruments Company Detail
11.17.2 Texas Instruments Business Overview
11.17.3 Texas Instruments Radiation-Hardened Electronics for Space Application Introduction
11.17.4 Texas Instruments Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.17.5 Texas Instruments Recent Development
11.18 Vorago Technologies
11.18.1 Vorago Technologies Company Detail
11.18.2 Vorago Technologies Business Overview
11.18.3 Vorago Technologies Radiation-Hardened Electronics for Space Application Introduction
11.18.4 Vorago Technologies Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.18.5 Vorago Technologies Recent Development
11.19 Xilinx, Inc.
11.19.1 Xilinx, Inc. Company Detail
11.19.2 Xilinx, Inc. Business Overview
11.19.3 Xilinx, Inc. Radiation-Hardened Electronics for Space Application Introduction
11.19.4 Xilinx, Inc. Revenue in Radiation-Hardened Electronics for Space Application Business (2018-2023)
11.19.5 Xilinx, Inc. Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
3D Plus
Analog Devices, Inc.
Apogee Semiconductor
Cobham Plc
Data Device Corporation
Exxelia
General Dynamics
GSI Technology, Inc.
Infineon Technologies
Mercury Systems, Inc.
Microchip Technology, Inc.
Micropac Industries
Renesas Electronics Corporation
Solid State Devices, Inc.
STMicroelectronics N.V.
Teledyne Technologies
Texas Instruments
Vorago Technologies
Xilinx, Inc.
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听
*If Applicable.
