The global market for Rigid IC Package Substrates was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
North American market for Rigid IC Package Substrates is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Rigid IC Package Substrates is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Rigid IC Package Substrates include Unimicron, Ibiden, Semco, Nan Ya PCB Corporation, Shinko, Simmtech, Kinsus, Daeduck, LG Innotek, Kyocera, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Rigid IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Rigid IC Package Substrates.
The Rigid IC Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Rigid IC Package Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Rigid IC Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron
Ibiden
Semco
Nan Ya PCB Corporation
Shinko
Simmtech
Kinsus
Daeduck
LG Innotek
Kyocera
ASE Material
Shennan Circuit
AT&S
Korea Circuit
by Type
WB CSP
FC BGA
FC CSP
Others
by Application
Smart Phone
PC
Wearable Device
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Rigid IC Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Rigid IC Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Rigid IC Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Rigid IC Package Substrates Market Overview
1.1 Product Definition
1.2 Rigid IC Package Substrates by Type
1.2.1 Global Rigid IC Package Substrates Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 WB CSP
1.2.3 FC BGA
1.2.4 FC CSP
1.2.5 Others
1.3 Rigid IC Package Substrates by Application
1.3.1 Global Rigid IC Package Substrates Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phone
1.3.3 PC
1.3.4 Wearable Device
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Rigid IC Package Substrates Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Rigid IC Package Substrates Production Estimates and Forecasts (2020-2031)
1.4.4 Global Rigid IC Package Substrates Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Rigid IC Package Substrates Production Market Share by Manufacturers (2020-2025)
2.2 Global Rigid IC Package Substrates Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Rigid IC Package Substrates, Industry Ranking, 2023 VS 2024
2.4 Global Rigid IC Package Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Rigid IC Package Substrates Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Rigid IC Package Substrates, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Rigid IC Package Substrates, Product Offered and Application
2.8 Global Key Manufacturers of Rigid IC Package Substrates, Date of Enter into This Industry
2.9 Rigid IC Package Substrates Market Competitive Situation and Trends
2.9.1 Rigid IC Package Substrates Market Concentration Rate
2.9.2 Global 5 and 10 Largest Rigid IC Package Substrates Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Rigid IC Package Substrates Production by Region
3.1 Global Rigid IC Package Substrates Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Rigid IC Package Substrates Production Value by Region (2020-2031)
3.2.1 Global Rigid IC Package Substrates Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Rigid IC Package Substrates by Region (2026-2031)
3.3 Global Rigid IC Package Substrates Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Rigid IC Package Substrates Production Volume by Region (2020-2031)
3.4.1 Global Rigid IC Package Substrates Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Rigid IC Package Substrates by Region (2026-2031)
3.5 Global Rigid IC Package Substrates Market Price Analysis by Region (2020-2025)
3.6 Global Rigid IC Package Substrates Production and Value, Year-over-Year Growth
3.6.1 North America Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
4 Rigid IC Package Substrates Consumption by Region
4.1 Global Rigid IC Package Substrates Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Rigid IC Package Substrates Consumption by Region (2020-2031)
4.2.1 Global Rigid IC Package Substrates Consumption by Region (2020-2025)
4.2.2 Global Rigid IC Package Substrates Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Rigid IC Package Substrates Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Rigid IC Package Substrates Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Rigid IC Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Rigid IC Package Substrates Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Rigid IC Package Substrates Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Rigid IC Package Substrates Production by Type (2020-2031)
5.1.1 Global Rigid IC Package Substrates Production by Type (2020-2025)
5.1.2 Global Rigid IC Package Substrates Production by Type (2026-2031)
5.1.3 Global Rigid IC Package Substrates Production Market Share by Type (2020-2031)
5.2 Global Rigid IC Package Substrates Production Value by Type (2020-2031)
5.2.1 Global Rigid IC Package Substrates Production Value by Type (2020-2025)
5.2.2 Global Rigid IC Package Substrates Production Value by Type (2026-2031)
5.2.3 Global Rigid IC Package Substrates Production Value Market Share by Type (2020-2031)
5.3 Global Rigid IC Package Substrates Price by Type (2020-2031)
6 Segment by Application
6.1 Global Rigid IC Package Substrates Production by Application (2020-2031)
6.1.1 Global Rigid IC Package Substrates Production by Application (2020-2025)
6.1.2 Global Rigid IC Package Substrates Production by Application (2026-2031)
6.1.3 Global Rigid IC Package Substrates Production Market Share by Application (2020-2031)
6.2 Global Rigid IC Package Substrates Production Value by Application (2020-2031)
6.2.1 Global Rigid IC Package Substrates Production Value by Application (2020-2025)
6.2.2 Global Rigid IC Package Substrates Production Value by Application (2026-2031)
6.2.3 Global Rigid IC Package Substrates Production Value Market Share by Application (2020-2031)
6.3 Global Rigid IC Package Substrates Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron Rigid IC Package Substrates Company Information
7.1.2 Unimicron Rigid IC Package Substrates Product Portfolio
7.1.3 Unimicron Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 Ibiden
7.2.1 Ibiden Rigid IC Package Substrates Company Information
7.2.2 Ibiden Rigid IC Package Substrates Product Portfolio
7.2.3 Ibiden Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Ibiden Main Business and Markets Served
7.2.5 Ibiden Recent Developments/Updates
7.3 Semco
7.3.1 Semco Rigid IC Package Substrates Company Information
7.3.2 Semco Rigid IC Package Substrates Product Portfolio
7.3.3 Semco Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Semco Main Business and Markets Served
7.3.5 Semco Recent Developments/Updates
7.4 Nan Ya PCB Corporation
7.4.1 Nan Ya PCB Corporation Rigid IC Package Substrates Company Information
7.4.2 Nan Ya PCB Corporation Rigid IC Package Substrates Product Portfolio
7.4.3 Nan Ya PCB Corporation Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Nan Ya PCB Corporation Main Business and Markets Served
7.4.5 Nan Ya PCB Corporation Recent Developments/Updates
7.5 Shinko
7.5.1 Shinko Rigid IC Package Substrates Company Information
7.5.2 Shinko Rigid IC Package Substrates Product Portfolio
7.5.3 Shinko Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Shinko Main Business and Markets Served
7.5.5 Shinko Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech Rigid IC Package Substrates Company Information
7.6.2 Simmtech Rigid IC Package Substrates Product Portfolio
7.6.3 Simmtech Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Kinsus
7.7.1 Kinsus Rigid IC Package Substrates Company Information
7.7.2 Kinsus Rigid IC Package Substrates Product Portfolio
7.7.3 Kinsus Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Kinsus Main Business and Markets Served
7.7.5 Kinsus Recent Developments/Updates
7.8 Daeduck
7.8.1 Daeduck Rigid IC Package Substrates Company Information
7.8.2 Daeduck Rigid IC Package Substrates Product Portfolio
7.8.3 Daeduck Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Daeduck Main Business and Markets Served
7.8.5 Daeduck Recent Developments/Updates
7.9 LG Innotek
7.9.1 LG Innotek Rigid IC Package Substrates Company Information
7.9.2 LG Innotek Rigid IC Package Substrates Product Portfolio
7.9.3 LG Innotek Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.9.4 LG Innotek Main Business and Markets Served
7.9.5 LG Innotek Recent Developments/Updates
7.10 Kyocera
7.10.1 Kyocera Rigid IC Package Substrates Company Information
7.10.2 Kyocera Rigid IC Package Substrates Product Portfolio
7.10.3 Kyocera Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Kyocera Main Business and Markets Served
7.10.5 Kyocera Recent Developments/Updates
7.11 ASE Material
7.11.1 ASE Material Rigid IC Package Substrates Company Information
7.11.2 ASE Material Rigid IC Package Substrates Product Portfolio
7.11.3 ASE Material Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.11.4 ASE Material Main Business and Markets Served
7.11.5 ASE Material Recent Developments/Updates
7.12 Shennan Circuit
7.12.1 Shennan Circuit Rigid IC Package Substrates Company Information
7.12.2 Shennan Circuit Rigid IC Package Substrates Product Portfolio
7.12.3 Shennan Circuit Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Shennan Circuit Main Business and Markets Served
7.12.5 Shennan Circuit Recent Developments/Updates
7.13 AT&S
7.13.1 AT&S Rigid IC Package Substrates Company Information
7.13.2 AT&S Rigid IC Package Substrates Product Portfolio
7.13.3 AT&S Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.13.4 AT&S Main Business and Markets Served
7.13.5 AT&S Recent Developments/Updates
7.14 Korea Circuit
7.14.1 Korea Circuit Rigid IC Package Substrates Company Information
7.14.2 Korea Circuit Rigid IC Package Substrates Product Portfolio
7.14.3 Korea Circuit Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Korea Circuit Main Business and Markets Served
7.14.5 Korea Circuit Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Rigid IC Package Substrates Industry Chain Analysis
8.2 Rigid IC Package Substrates Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Rigid IC Package Substrates Production Mode & Process Analysis
8.4 Rigid IC Package Substrates Sales and Marketing
8.4.1 Rigid IC Package Substrates Sales Channels
8.4.2 Rigid IC Package Substrates Distributors
8.5 Rigid IC Package Substrates Customer Analysis
9 Rigid IC Package Substrates Market Dynamics
9.1 Rigid IC Package Substrates Industry Trends
9.2 Rigid IC Package Substrates Market Drivers
9.3 Rigid IC Package Substrates Market Challenges
9.4 Rigid IC Package Substrates Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Unimicron
Ibiden
Semco
Nan Ya PCB Corporation
Shinko
Simmtech
Kinsus
Daeduck
LG Innotek
Kyocera
ASE Material
Shennan Circuit
AT&S
Korea Circuit
听
听
*If Applicable.
