Packaging is an essential part of semiconductor manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level.
The package is the container that holds the semiconductor die. The packaging may be done by a separate vendor, the OSAT, although foundries are expanding their packaging efforts. The package protects the die, connects the chip to a board or other chips, and may dissipate heat.
Many types of packages in use today, and more are either in research at universities or ready for production 鈥� everything from complex stacked die with through-silicon via to fan-outs and complex systems on chip. Packages come in different materials, can be standard or custom, and they can have active or passive cooling.
Packages used to be considered a fairly non-critical part of the semiconductor design. They are now essential on every level, and there is a race on between foundries and OSATs to grab a larger share of this market as complexity and profitability increases.
The global Semiconductor Assembly and Testing Services (SATS) market was valued at US$ 70600 million in 2023 and is anticipated to reach US$ 110410 million by 2030, witnessing a CAGR of 6.6% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly and Testing Services (SATS), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly and Testing Services (SATS).
The Semiconductor Assembly and Testing Services (SATS) market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Assembly and Testing Services (SATS) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Assembly and Testing Services (SATS) companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE (SPIL)
Amkor Technology
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
HT-tech
UTAC
King Yuan Electronics Corp. (KYEC)
ChipMOS TECHNOLOGIES
Chipbond Technology Corporation
Carsem
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Unisem Group
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Union Semiconductor锛圚efei锛塁o., Ltd.
Hefei Chipmore Technology Co.,Ltd.
Chippacking
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
Shanghai V-Test Semiconductor Tech
KESM Industries Berhad
Foshan Blue Rocket Electronics
TSMC
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Sony Semiconductor Solutions Corporation (SSS)
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas Electronics
Microchip Technology
Onsemi
Segment by Type
Packaging Services
Testing Services
Segment by Application
Communication
Computing and Networking
Consumer Electronics
Industrial
Automotive Electronics
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Assembly and Testing Services (SATS) company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor Assembly and Testing Services (SATS) Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Packaging Services
1.2.3 Testing Services
1.3 Market by Application
1.3.1 Global Semiconductor Assembly and Testing Services (SATS) Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Communication
1.3.3 Computing and Networking
1.3.4 Consumer Electronics
1.3.5 Industrial
1.3.6 Automotive Electronics
1.3.7 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor Assembly and Testing Services (SATS) Market Perspective (2019-2030)
2.2 Global Semiconductor Assembly and Testing Services (SATS) Growth Trends by Region
2.2.1 Global Semiconductor Assembly and Testing Services (SATS) Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor Assembly and Testing Services (SATS) Historic Market Size by Region (2019-2024)
2.2.3 Semiconductor Assembly and Testing Services (SATS) Forecasted Market Size by Region (2025-2030)
2.3 Semiconductor Assembly and Testing Services (SATS) Market Dynamics
2.3.1 Semiconductor Assembly and Testing Services (SATS) Industry Trends
2.3.2 Semiconductor Assembly and Testing Services (SATS) Market Drivers
2.3.3 Semiconductor Assembly and Testing Services (SATS) Market Challenges
2.3.4 Semiconductor Assembly and Testing Services (SATS) Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Semiconductor Assembly and Testing Services (SATS) Players by Revenue
3.1.1 Global Top Semiconductor Assembly and Testing Services (SATS) Players by Revenue (2019-2024)
3.1.2 Global Semiconductor Assembly and Testing Services (SATS) Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor Assembly and Testing Services (SATS) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Semiconductor Assembly and Testing Services (SATS) Revenue
3.4 Global Semiconductor Assembly and Testing Services (SATS) Market Concentration Ratio
3.4.1 Global Semiconductor Assembly and Testing Services (SATS) Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Assembly and Testing Services (SATS) Revenue in 2023
3.5 Global Key Players of Semiconductor Assembly and Testing Services (SATS) Head office and Area Served
3.6 Global Key Players of Semiconductor Assembly and Testing Services (SATS), Product and Application
3.7 Global Key Players of Semiconductor Assembly and Testing Services (SATS), Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor Assembly and Testing Services (SATS) Breakdown Data by Type
4.1 Global Semiconductor Assembly and Testing Services (SATS) Historic Market Size by Type (2019-2024)
4.2 Global Semiconductor Assembly and Testing Services (SATS) Forecasted Market Size by Type (2025-2030)
5 Semiconductor Assembly and Testing Services (SATS) Breakdown Data by Application
5.1 Global Semiconductor Assembly and Testing Services (SATS) Historic Market Size by Application (2019-2024)
5.2 Global Semiconductor Assembly and Testing Services (SATS) Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor Assembly and Testing Services (SATS) Market Size (2019-2030)
6.2 North America Semiconductor Assembly and Testing Services (SATS) Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Semiconductor Assembly and Testing Services (SATS) Market Size by Country (2019-2024)
6.4 North America Semiconductor Assembly and Testing Services (SATS) Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Semiconductor Assembly and Testing Services (SATS) Market Size (2019-2030)
7.2 Europe Semiconductor Assembly and Testing Services (SATS) Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Semiconductor Assembly and Testing Services (SATS) Market Size by Country (2019-2024)
7.4 Europe Semiconductor Assembly and Testing Services (SATS) Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor Assembly and Testing Services (SATS) Market Size (2019-2030)
8.2 Asia-Pacific Semiconductor Assembly and Testing Services (SATS) Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Semiconductor Assembly and Testing Services (SATS) Market Size by Region (2019-2024)
8.4 Asia-Pacific Semiconductor Assembly and Testing Services (SATS) Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Semiconductor Assembly and Testing Services (SATS) Market Size (2019-2030)
9.2 Latin America Semiconductor Assembly and Testing Services (SATS) Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Semiconductor Assembly and Testing Services (SATS) Market Size by Country (2019-2024)
9.4 Latin America Semiconductor Assembly and Testing Services (SATS) Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor Assembly and Testing Services (SATS) Market Size (2019-2030)
10.2 Middle East & Africa Semiconductor Assembly and Testing Services (SATS) Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Semiconductor Assembly and Testing Services (SATS) Market Size by Country (2019-2024)
10.4 Middle East & Africa Semiconductor Assembly and Testing Services (SATS) Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE (SPIL)
11.1.1 ASE (SPIL) Company Details
11.1.2 ASE (SPIL) Business Overview
11.1.3 ASE (SPIL) Semiconductor Assembly and Testing Services (SATS) Introduction
11.1.4 ASE (SPIL) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.1.5 ASE (SPIL) Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Details
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Semiconductor Assembly and Testing Services (SATS) Introduction
11.2.4 Amkor Technology Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.2.5 Amkor Technology Recent Development
11.3 JCET (STATS ChipPAC)
11.3.1 JCET (STATS ChipPAC) Company Details
11.3.2 JCET (STATS ChipPAC) Business Overview
11.3.3 JCET (STATS ChipPAC) Semiconductor Assembly and Testing Services (SATS) Introduction
11.3.4 JCET (STATS ChipPAC) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.3.5 JCET (STATS ChipPAC) Recent Development
11.4 Tongfu Microelectronics (TFME)
11.4.1 Tongfu Microelectronics (TFME) Company Details
11.4.2 Tongfu Microelectronics (TFME) Business Overview
11.4.3 Tongfu Microelectronics (TFME) Semiconductor Assembly and Testing Services (SATS) Introduction
11.4.4 Tongfu Microelectronics (TFME) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.4.5 Tongfu Microelectronics (TFME) Recent Development
11.5 Powertech Technology Inc. (PTI)
11.5.1 Powertech Technology Inc. (PTI) Company Details
11.5.2 Powertech Technology Inc. (PTI) Business Overview
11.5.3 Powertech Technology Inc. (PTI) Semiconductor Assembly and Testing Services (SATS) Introduction
11.5.4 Powertech Technology Inc. (PTI) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.5.5 Powertech Technology Inc. (PTI) Recent Development
11.6 HT-tech
11.6.1 HT-tech Company Details
11.6.2 HT-tech Business Overview
11.6.3 HT-tech Semiconductor Assembly and Testing Services (SATS) Introduction
11.6.4 HT-tech Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.6.5 HT-tech Recent Development
11.7 UTAC
11.7.1 UTAC Company Details
11.7.2 UTAC Business Overview
11.7.3 UTAC Semiconductor Assembly and Testing Services (SATS) Introduction
11.7.4 UTAC Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.7.5 UTAC Recent Development
11.8 King Yuan Electronics Corp. (KYEC)
11.8.1 King Yuan Electronics Corp. (KYEC) Company Details
11.8.2 King Yuan Electronics Corp. (KYEC) Business Overview
11.8.3 King Yuan Electronics Corp. (KYEC) Semiconductor Assembly and Testing Services (SATS) Introduction
11.8.4 King Yuan Electronics Corp. (KYEC) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.8.5 King Yuan Electronics Corp. (KYEC) Recent Development
11.9 ChipMOS TECHNOLOGIES
11.9.1 ChipMOS TECHNOLOGIES Company Details
11.9.2 ChipMOS TECHNOLOGIES Business Overview
11.9.3 ChipMOS TECHNOLOGIES Semiconductor Assembly and Testing Services (SATS) Introduction
11.9.4 ChipMOS TECHNOLOGIES Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.9.5 ChipMOS TECHNOLOGIES Recent Development
11.10 Chipbond Technology Corporation
11.10.1 Chipbond Technology Corporation Company Details
11.10.2 Chipbond Technology Corporation Business Overview
11.10.3 Chipbond Technology Corporation Semiconductor Assembly and Testing Services (SATS) Introduction
11.10.4 Chipbond Technology Corporation Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.10.5 Chipbond Technology Corporation Recent Development
11.11 Carsem
11.11.1 Carsem Company Details
11.11.2 Carsem Business Overview
11.11.3 Carsem Semiconductor Assembly and Testing Services (SATS) Introduction
11.11.4 Carsem Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.11.5 Carsem Recent Development
11.12 SFA Semicon
11.12.1 SFA Semicon Company Details
11.12.2 SFA Semicon Business Overview
11.12.3 SFA Semicon Semiconductor Assembly and Testing Services (SATS) Introduction
11.12.4 SFA Semicon Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.12.5 SFA Semicon Recent Development
11.13 Forehope Electronic (Ningbo) Co.,Ltd.
11.13.1 Forehope Electronic (Ningbo) Co.,Ltd. Company Details
11.13.2 Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
11.13.3 Forehope Electronic (Ningbo) Co.,Ltd. Semiconductor Assembly and Testing Services (SATS) Introduction
11.13.4 Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.13.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
11.14 Unisem Group
11.14.1 Unisem Group Company Details
11.14.2 Unisem Group Business Overview
11.14.3 Unisem Group Semiconductor Assembly and Testing Services (SATS) Introduction
11.14.4 Unisem Group Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.14.5 Unisem Group Recent Development
11.15 OSE CORP.
11.15.1 OSE CORP. Company Details
11.15.2 OSE CORP. Business Overview
11.15.3 OSE CORP. Semiconductor Assembly and Testing Services (SATS) Introduction
11.15.4 OSE CORP. Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.15.5 OSE CORP. Recent Development
11.16 Sigurd Microelectronics
11.16.1 Sigurd Microelectronics Company Details
11.16.2 Sigurd Microelectronics Business Overview
11.16.3 Sigurd Microelectronics Semiconductor Assembly and Testing Services (SATS) Introduction
11.16.4 Sigurd Microelectronics Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.16.5 Sigurd Microelectronics Recent Development
11.17 Natronix Semiconductor Technology
11.17.1 Natronix Semiconductor Technology Company Details
11.17.2 Natronix Semiconductor Technology Business Overview
11.17.3 Natronix Semiconductor Technology Semiconductor Assembly and Testing Services (SATS) Introduction
11.17.4 Natronix Semiconductor Technology Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.17.5 Natronix Semiconductor Technology Recent Development
11.18 Nepes
11.18.1 Nepes Company Details
11.18.2 Nepes Business Overview
11.18.3 Nepes Semiconductor Assembly and Testing Services (SATS) Introduction
11.18.4 Nepes Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.18.5 Nepes Recent Development
11.19 Union Semiconductor锛圚efei锛塁o., Ltd.
11.19.1 Union Semiconductor锛圚efei锛塁o., Ltd. Company Details
11.19.2 Union Semiconductor锛圚efei锛塁o., Ltd. Business Overview
11.19.3 Union Semiconductor锛圚efei锛塁o., Ltd. Semiconductor Assembly and Testing Services (SATS) Introduction
11.19.4 Union Semiconductor锛圚efei锛塁o., Ltd. Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.19.5 Union Semiconductor锛圚efei锛塁o., Ltd. Recent Development
11.20 Hefei Chipmore Technology Co.,Ltd.
11.20.1 Hefei Chipmore Technology Co.,Ltd. Company Details
11.20.2 Hefei Chipmore Technology Co.,Ltd. Business Overview
11.20.3 Hefei Chipmore Technology Co.,Ltd. Semiconductor Assembly and Testing Services (SATS) Introduction
11.20.4 Hefei Chipmore Technology Co.,Ltd. Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.20.5 Hefei Chipmore Technology Co.,Ltd. Recent Development
11.21 Chippacking
11.21.1 Chippacking Company Details
11.21.2 Chippacking Business Overview
11.21.3 Chippacking Semiconductor Assembly and Testing Services (SATS) Introduction
11.21.4 Chippacking Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.21.5 Chippacking Recent Development
11.22 China Wafer Level CSP Co., Ltd
11.22.1 China Wafer Level CSP Co., Ltd Company Details
11.22.2 China Wafer Level CSP Co., Ltd Business Overview
11.22.3 China Wafer Level CSP Co., Ltd Semiconductor Assembly and Testing Services (SATS) Introduction
11.22.4 China Wafer Level CSP Co., Ltd Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.22.5 China Wafer Level CSP Co., Ltd Recent Development
11.23 Ningbo ChipEx Semiconductor Co., Ltd
11.23.1 Ningbo ChipEx Semiconductor Co., Ltd Company Details
11.23.2 Ningbo ChipEx Semiconductor Co., Ltd Business Overview
11.23.3 Ningbo ChipEx Semiconductor Co., Ltd Semiconductor Assembly and Testing Services (SATS) Introduction
11.23.4 Ningbo ChipEx Semiconductor Co., Ltd Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.23.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Development
11.24 Guangdong Leadyo IC Testing
11.24.1 Guangdong Leadyo IC Testing Company Details
11.24.2 Guangdong Leadyo IC Testing Business Overview
11.24.3 Guangdong Leadyo IC Testing Semiconductor Assembly and Testing Services (SATS) Introduction
11.24.4 Guangdong Leadyo IC Testing Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.24.5 Guangdong Leadyo IC Testing Recent Development
11.25 Unimos Microelectronics (Shanghai)
11.25.1 Unimos Microelectronics (Shanghai) Company Details
11.25.2 Unimos Microelectronics (Shanghai) Business Overview
11.25.3 Unimos Microelectronics (Shanghai) Semiconductor Assembly and Testing Services (SATS) Introduction
11.25.4 Unimos Microelectronics (Shanghai) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.25.5 Unimos Microelectronics (Shanghai) Recent Development
11.26 Sino Technology
11.26.1 Sino Technology Company Details
11.26.2 Sino Technology Business Overview
11.26.3 Sino Technology Semiconductor Assembly and Testing Services (SATS) Introduction
11.26.4 Sino Technology Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.26.5 Sino Technology Recent Development
11.27 Taiji Semiconductor (Suzhou)
11.27.1 Taiji Semiconductor (Suzhou) Company Details
11.27.2 Taiji Semiconductor (Suzhou) Business Overview
11.27.3 Taiji Semiconductor (Suzhou) Semiconductor Assembly and Testing Services (SATS) Introduction
11.27.4 Taiji Semiconductor (Suzhou) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.27.5 Taiji Semiconductor (Suzhou) Recent Development
11.28 Shanghai V-Test Semiconductor Tech
11.28.1 Shanghai V-Test Semiconductor Tech Company Details
11.28.2 Shanghai V-Test Semiconductor Tech Business Overview
11.28.3 Shanghai V-Test Semiconductor Tech Semiconductor Assembly and Testing Services (SATS) Introduction
11.28.4 Shanghai V-Test Semiconductor Tech Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.28.5 Shanghai V-Test Semiconductor Tech Recent Development
11.29 KESM Industries Berhad
11.29.1 KESM Industries Berhad Company Details
11.29.2 KESM Industries Berhad Business Overview
11.29.3 KESM Industries Berhad Semiconductor Assembly and Testing Services (SATS) Introduction
11.29.4 KESM Industries Berhad Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.29.5 KESM Industries Berhad Recent Development
11.30 Foshan Blue Rocket Electronics
11.30.1 Foshan Blue Rocket Electronics Company Details
11.30.2 Foshan Blue Rocket Electronics Business Overview
11.30.3 Foshan Blue Rocket Electronics Semiconductor Assembly and Testing Services (SATS) Introduction
11.30.4 Foshan Blue Rocket Electronics Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.30.5 Foshan Blue Rocket Electronics Recent Development
11.31 TSMC
11.31.1 TSMC Company Details
11.31.2 TSMC Business Overview
11.31.3 TSMC Semiconductor Assembly and Testing Services (SATS) Introduction
11.31.4 TSMC Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.31.5 TSMC Recent Development
11.32 Samsung
11.32.1 Samsung Company Details
11.32.2 Samsung Business Overview
11.32.3 Samsung Semiconductor Assembly and Testing Services (SATS) Introduction
11.32.4 Samsung Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.32.5 Samsung Recent Development
11.33 Intel
11.33.1 Intel Company Details
11.33.2 Intel Business Overview
11.33.3 Intel Semiconductor Assembly and Testing Services (SATS) Introduction
11.33.4 Intel Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.33.5 Intel Recent Development
11.34 SK Hynix
11.34.1 SK Hynix Company Details
11.34.2 SK Hynix Business Overview
11.34.3 SK Hynix Semiconductor Assembly and Testing Services (SATS) Introduction
11.34.4 SK Hynix Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.34.5 SK Hynix Recent Development
11.35 Micron Technology
11.35.1 Micron Technology Company Details
11.35.2 Micron Technology Business Overview
11.35.3 Micron Technology Semiconductor Assembly and Testing Services (SATS) Introduction
11.35.4 Micron Technology Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.35.5 Micron Technology Recent Development
11.36 Texas Instruments (TI)
11.36.1 Texas Instruments (TI) Company Details
11.36.2 Texas Instruments (TI) Business Overview
11.36.3 Texas Instruments (TI) Semiconductor Assembly and Testing Services (SATS) Introduction
11.36.4 Texas Instruments (TI) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.36.5 Texas Instruments (TI) Recent Development
11.37 STMicroelectronics
11.37.1 STMicroelectronics Company Details
11.37.2 STMicroelectronics Business Overview
11.37.3 STMicroelectronics Semiconductor Assembly and Testing Services (SATS) Introduction
11.37.4 STMicroelectronics Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.37.5 STMicroelectronics Recent Development
11.38 Kioxia
11.38.1 Kioxia Company Details
11.38.2 Kioxia Business Overview
11.38.3 Kioxia Semiconductor Assembly and Testing Services (SATS) Introduction
11.38.4 Kioxia Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.38.5 Kioxia Recent Development
11.39 Sony Semiconductor Solutions Corporation (SSS)
11.39.1 Sony Semiconductor Solutions Corporation (SSS) Company Details
11.39.2 Sony Semiconductor Solutions Corporation (SSS) Business Overview
11.39.3 Sony Semiconductor Solutions Corporation (SSS) Semiconductor Assembly and Testing Services (SATS) Introduction
11.39.4 Sony Semiconductor Solutions Corporation (SSS) Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.39.5 Sony Semiconductor Solutions Corporation (SSS) Recent Development
11.40 Infineon
11.40.1 Infineon Company Details
11.40.2 Infineon Business Overview
11.40.3 Infineon Semiconductor Assembly and Testing Services (SATS) Introduction
11.40.4 Infineon Revenue in Semiconductor Assembly and Testing Services (SATS) Business (2019-2024)
11.40.5 Infineon Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
ASE (SPIL)
Amkor Technology
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
HT-tech
UTAC
King Yuan Electronics Corp. (KYEC)
ChipMOS TECHNOLOGIES
Chipbond Technology Corporation
Carsem
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Unisem Group
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Union Semiconductor锛圚efei锛塁o., Ltd.
Hefei Chipmore Technology Co.,Ltd.
Chippacking
China Wafer Level CSP Co., Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
Shanghai V-Test Semiconductor Tech
KESM Industries Berhad
Foshan Blue Rocket Electronics
TSMC
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Sony Semiconductor Solutions Corporation (SSS)
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas Electronics
Microchip Technology
Onsemi
听
听
*If Applicable.
