

The so-called "Molding" refers to the molding process in which the semiconductor is electrically insulated from the outside by resin encapsulation. It protects the chip by injecting fluid resin from the gate around the semiconductor chip and curing it. Automatic molding machine refers to the fully automatic semiconductor packaging process equipment that automatically transports the lead frame from the feeding box for plastic sealing, and then removes the residual glue and then transports it to the discharging box.
The prices in this report are for individual machines and do not include molds.
The global Semiconductor Molding Systems market is projected to grow from US$ 397.9 million in 2024 to US$ 712.6 million by 2030, at a Compound Annual Growth Rate (CAGR) of 10.2% during the forecast period.
Global core semiconductor molding systems manufacturers include TOWA, ASMPT etc.The top 2 companies hold a share about 70%.Japan is the largest market, with a share about 75%, followed by China and Europe with the share about 15% and 10%.In terms of product, fully automatic is the largest segment, with a share over 60%. And in terms of application, the largest application is BGA packaging, followed by wafer level packaging.
In terms of production side, this report researches the Semiconductor Molding Systems production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of Semiconductor Molding Systems by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for Semiconductor Molding Systems, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Semiconductor Molding Systems, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Semiconductor Molding Systems, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Semiconductor Molding Systems sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Semiconductor Molding Systems market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Semiconductor Molding Systems sales, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
Segment by Type
Fully Automatic
Semi-automatic
Manual
Segment by Application
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
Production by Region
North America
Europe
China
Japan
Southeast Asia
South Korea
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Semiconductor Molding Systems production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Semiconductor Molding Systems in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of Semiconductor Molding Systems manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Semiconductor Molding Systems sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 Semiconductor Molding Systems Product Introduction
1.2 Market by Type
1.2.1 Global Semiconductor Molding Systems Market Size by Type, 2019 VS 2023 VS 2030
1.2.2 Fully Automatic
1.2.3 Semi-automatic
1.2.4 Manual
1.3 Market by Application
1.3.1 Global Semiconductor Molding Systems Market Size by Application, 2019 VS 2023 VS 2030
1.3.2 Wafer Level Packaging
1.3.3 BGA Packaging
1.3.4 Flat Panel Packaging
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Semiconductor Molding Systems Production
2.1 Global Semiconductor Molding Systems Production Capacity (2019-2030)
2.2 Global Semiconductor Molding Systems Production by Region: 2019 VS 2023 VS 2030
2.3 Global Semiconductor Molding Systems Production by Region
2.3.1 Global Semiconductor Molding Systems Historic Production by Region (2019-2024)
2.3.2 Global Semiconductor Molding Systems Forecasted Production by Region (2025-2030)
2.3.3 Global Semiconductor Molding Systems Production Market Share by Region (2019-2030)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 Southeast Asia
2.9 South Korea
3 Executive Summary
3.1 Global Semiconductor Molding Systems Revenue Estimates and Forecasts 2019-2030
3.2 Global Semiconductor Molding Systems Revenue by Region
3.2.1 Global Semiconductor Molding Systems Revenue by Region: 2019 VS 2023 VS 2030
3.2.2 Global Semiconductor Molding Systems Revenue by Region (2019-2024)
3.2.3 Global Semiconductor Molding Systems Revenue by Region (2025-2030)
3.2.4 Global Semiconductor Molding Systems Revenue Market Share by Region (2019-2030)
3.3 Global Semiconductor Molding Systems Sales Estimates and Forecasts 2019-2030
3.4 Global Semiconductor Molding Systems Sales by Region
3.4.1 Global Semiconductor Molding Systems Sales by Region: 2019 VS 2023 VS 2030
3.4.2 Global Semiconductor Molding Systems Sales by Region (2019-2024)
3.4.3 Global Semiconductor Molding Systems Sales by Region (2025-2030)
3.4.4 Global Semiconductor Molding Systems Sales Market Share by Region (2019-2030)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Semiconductor Molding Systems Sales by Manufacturers
4.1.1 Global Semiconductor Molding Systems Sales by Manufacturers (2019-2024)
4.1.2 Global Semiconductor Molding Systems Sales Market Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Semiconductor Molding Systems in 2023
4.2 Global Semiconductor Molding Systems Revenue by Manufacturers
4.2.1 Global Semiconductor Molding Systems Revenue by Manufacturers (2019-2024)
4.2.2 Global Semiconductor Molding Systems Revenue Market Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by Semiconductor Molding Systems Revenue in 2023
4.3 Global Semiconductor Molding Systems Sales Price by Manufacturers
4.4 Global Key Players of Semiconductor Molding Systems, Industry Ranking, 2022 VS 2023 VS 2024
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Semiconductor Molding Systems Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Semiconductor Molding Systems, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Semiconductor Molding Systems, Product Offered and Application
4.8 Global Key Manufacturers of Semiconductor Molding Systems, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Semiconductor Molding Systems Sales by Type
5.1.1 Global Semiconductor Molding Systems Historical Sales by Type (2019-2024)
5.1.2 Global Semiconductor Molding Systems Forecasted Sales by Type (2025-2030)
5.1.3 Global Semiconductor Molding Systems Sales Market Share by Type (2019-2030)
5.2 Global Semiconductor Molding Systems Revenue by Type
5.2.1 Global Semiconductor Molding Systems Historical Revenue by Type (2019-2024)
5.2.2 Global Semiconductor Molding Systems Forecasted Revenue by Type (2025-2030)
5.2.3 Global Semiconductor Molding Systems Revenue Market Share by Type (2019-2030)
5.3 Global Semiconductor Molding Systems Price by Type
5.3.1 Global Semiconductor Molding Systems Price by Type (2019-2024)
5.3.2 Global Semiconductor Molding Systems Price Forecast by Type (2025-2030)
6 Market Size by Application
6.1 Global Semiconductor Molding Systems Sales by Application
6.1.1 Global Semiconductor Molding Systems Historical Sales by Application (2019-2024)
6.1.2 Global Semiconductor Molding Systems Forecasted Sales by Application (2025-2030)
6.1.3 Global Semiconductor Molding Systems Sales Market Share by Application (2019-2030)
6.2 Global Semiconductor Molding Systems Revenue by Application
6.2.1 Global Semiconductor Molding Systems Historical Revenue by Application (2019-2024)
6.2.2 Global Semiconductor Molding Systems Forecasted Revenue by Application (2025-2030)
6.2.3 Global Semiconductor Molding Systems Revenue Market Share by Application (2019-2030)
6.3 Global Semiconductor Molding Systems Price by Application
6.3.1 Global Semiconductor Molding Systems Price by Application (2019-2024)
6.3.2 Global Semiconductor Molding Systems Price Forecast by Application (2025-2030)
7 US & Canada
7.1 US & Canada Semiconductor Molding Systems Market Size by Type
7.1.1 US & Canada Semiconductor Molding Systems Sales by Type (2019-2030)
7.1.2 US & Canada Semiconductor Molding Systems Revenue by Type (2019-2030)
7.2 US & Canada Semiconductor Molding Systems Market Size by Application
7.2.1 US & Canada Semiconductor Molding Systems Sales by Application (2019-2030)
7.2.2 US & Canada Semiconductor Molding Systems Revenue by Application (2019-2030)
7.3 US & Canada Semiconductor Molding Systems Sales by Country
7.3.1 US & Canada Semiconductor Molding Systems Revenue by Country: 2019 VS 2023 VS 2030
7.3.2 US & Canada Semiconductor Molding Systems Sales by Country (2019-2030)
7.3.3 US & Canada Semiconductor Molding Systems Revenue by Country (2019-2030)
7.3.4 United States
7.3.5 Canada
8 Europe
8.1 Europe Semiconductor Molding Systems Market Size by Type
8.1.1 Europe Semiconductor Molding Systems Sales by Type (2019-2030)
8.1.2 Europe Semiconductor Molding Systems Revenue by Type (2019-2030)
8.2 Europe Semiconductor Molding Systems Market Size by Application
8.2.1 Europe Semiconductor Molding Systems Sales by Application (2019-2030)
8.2.2 Europe Semiconductor Molding Systems Revenue by Application (2019-2030)
8.3 Europe Semiconductor Molding Systems Sales by Country
8.3.1 Europe Semiconductor Molding Systems Revenue by Country: 2019 VS 2023 VS 2030
8.3.2 Europe Semiconductor Molding Systems Sales by Country (2019-2030)
8.3.3 Europe Semiconductor Molding Systems Revenue by Country (2019-2030)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Semiconductor Molding Systems Market Size by Type
9.1.1 China Semiconductor Molding Systems Sales by Type (2019-2030)
9.1.2 China Semiconductor Molding Systems Revenue by Type (2019-2030)
9.2 China Semiconductor Molding Systems Market Size by Application
9.2.1 China Semiconductor Molding Systems Sales by Application (2019-2030)
9.2.2 China Semiconductor Molding Systems Revenue by Application (2019-2030)
10 Asia (excluding China)
10.1 Asia Semiconductor Molding Systems Market Size by Type
10.1.1 Asia Semiconductor Molding Systems Sales by Type (2019-2030)
10.1.2 Asia Semiconductor Molding Systems Revenue by Type (2019-2030)
10.2 Asia Semiconductor Molding Systems Market Size by Application
10.2.1 Asia Semiconductor Molding Systems Sales by Application (2019-2030)
10.2.2 Asia Semiconductor Molding Systems Revenue by Application (2019-2030)
10.3 Asia Semiconductor Molding Systems Sales by Region
10.3.1 Asia Semiconductor Molding Systems Revenue by Region: 2019 VS 2023 VS 2030
10.3.2 Asia Semiconductor Molding Systems Revenue by Region (2019-2030)
10.3.3 Asia Semiconductor Molding Systems Sales by Region (2019-2030)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Semiconductor Molding Systems Market Size by Type
11.1.1 Middle East, Africa and Latin America Semiconductor Molding Systems Sales by Type (2019-2030)
11.1.2 Middle East, Africa and Latin America Semiconductor Molding Systems Revenue by Type (2019-2030)
11.2 Middle East, Africa and Latin America Semiconductor Molding Systems Market Size by Application
11.2.1 Middle East, Africa and Latin America Semiconductor Molding Systems Sales by Application (2019-2030)
11.2.2 Middle East, Africa and Latin America Semiconductor Molding Systems Revenue by Application (2019-2030)
11.3 Middle East, Africa and Latin America Semiconductor Molding Systems Sales by Country
11.3.1 Middle East, Africa and Latin America Semiconductor Molding Systems Revenue by Country: 2019 VS 2023 VS 2030
11.3.2 Middle East, Africa and Latin America Semiconductor Molding Systems Revenue by Country (2019-2030)
11.3.3 Middle East, Africa and Latin America Semiconductor Molding Systems Sales by Country (2019-2030)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 TOWA
12.1.1 TOWA Company Information
12.1.2 TOWA Overview
12.1.3 TOWA Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.1.4 TOWA Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 TOWA Recent Developments
12.2 ASMPT
12.2.1 ASMPT Company Information
12.2.2 ASMPT Overview
12.2.3 ASMPT Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.2.4 ASMPT Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 ASMPT Recent Developments
12.3 Besi
12.3.1 Besi Company Information
12.3.2 Besi Overview
12.3.3 Besi Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.3.4 Besi Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Besi Recent Developments
12.4 I-PEX
12.4.1 I-PEX Company Information
12.4.2 I-PEX Overview
12.4.3 I-PEX Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.4.4 I-PEX Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 I-PEX Recent Developments
12.5 Yamada
12.5.1 Yamada Company Information
12.5.2 Yamada Overview
12.5.3 Yamada Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.5.4 Yamada Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Yamada Recent Developments
12.6 TAKARA TOOL & DIE
12.6.1 TAKARA TOOL & DIE Company Information
12.6.2 TAKARA TOOL & DIE Overview
12.6.3 TAKARA TOOL & DIE Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.6.4 TAKARA TOOL & DIE Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 TAKARA TOOL & DIE Recent Developments
12.7 Asahi Engineering
12.7.1 Asahi Engineering Company Information
12.7.2 Asahi Engineering Overview
12.7.3 Asahi Engineering Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.7.4 Asahi Engineering Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Asahi Engineering Recent Developments
12.8 Tongling Fushi Sanjia
12.8.1 Tongling Fushi Sanjia Company Information
12.8.2 Tongling Fushi Sanjia Overview
12.8.3 Tongling Fushi Sanjia Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.8.4 Tongling Fushi Sanjia Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Tongling Fushi Sanjia Recent Developments
12.9 Nextool Technology
12.9.1 Nextool Technology Company Information
12.9.2 Nextool Technology Overview
12.9.3 Nextool Technology Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.9.4 Nextool Technology Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Nextool Technology Recent Developments
12.10 DAHUA Technology
12.10.1 DAHUA Technology Company Information
12.10.2 DAHUA Technology Overview
12.10.3 DAHUA Technology Semiconductor Molding Systems Sales, Price, Revenue and Gross Margin (2019-2024)
12.10.4 DAHUA Technology Semiconductor Molding Systems Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 DAHUA Technology Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Semiconductor Molding Systems Industry Chain Analysis
13.2 Semiconductor Molding Systems Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Semiconductor Molding Systems Production Mode & Process
13.4 Semiconductor Molding Systems Sales and Marketing
13.4.1 Semiconductor Molding Systems Sales Channels
13.4.2 Semiconductor Molding Systems Distributors
13.5 Semiconductor Molding Systems Customers
14 Semiconductor Molding Systems Market Dynamics
14.1 Semiconductor Molding Systems Industry Trends
14.2 Semiconductor Molding Systems Market Drivers
14.3 Semiconductor Molding Systems Market Challenges
14.4 Semiconductor Molding Systems Market Restraints
15 Key Finding in The Global Semiconductor Molding Systems Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
Ìý
Ìý
*If Applicable.