The global market for Semiconductor Package Substrate for Mobile Devices was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
A semiconductor package substrate is a key component in the assembly of mobile devices such as smartphones, tablets, and wearable gadgets. The substrate is typically made of a material with good electrical conductivity, such as copper or a copper-based alloy. In addition, the semiconductor package substrate can include structures called bond pads, which are areas of exposed metal that allow direct connections to be made between the substrate and other electronic components, such as integrated circuits or system-on-chip devices.
North American market for Semiconductor Package Substrate for Mobile Devices is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Semiconductor Package Substrate for Mobile Devices is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Semiconductor Package Substrate for Mobile Devices include Simmtech, Kyocera, Daeduck Electronics, Shinko Electric, Ibiden, Unimicron, Samsung Electro-Mechanics, ASE Group, Millennium Circuits, LG Chem, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Package Substrate for Mobile Devices, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Package Substrate for Mobile Devices.
The Semiconductor Package Substrate for Mobile Devices market size, estimations, and forecasts are provided in terms of output/shipments (K Square Meters) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Semiconductor Package Substrate for Mobile Devices market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Package Substrate for Mobile Devices manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Simmtech
Kyocera
Daeduck Electronics
Shinko Electric
Ibiden
Unimicron
Samsung Electro-Mechanics
ASE Group
Millennium Circuits
LG Chem
Nanya
Shenzhen Rayming Technology
HOREXS Group
Kinsus
TTM Technologies
Qinhuangdao Zhen Ding Technology
Shennan Circuits Company
Shenzhen Pastprint Technology
Zhuhai ACCESS Semiconductor
by Type
MCP/UTCSP
FC-CSP
SiP
PBGA/CSP
Other
by Application
Smartphone
PC
Wearable Devices
Others
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Package Substrate for Mobile Devices manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Package Substrate for Mobile Devices by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Package Substrate for Mobile Devices in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Semiconductor Package Substrate for Mobile Devices Market Overview
1.1 Product Definition
1.2 Semiconductor Package Substrate for Mobile Devices by Type
1.2.1 Global Semiconductor Package Substrate for Mobile Devices Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 MCP/UTCSP
1.2.3 FC-CSP
1.2.4 SiP
1.2.5 PBGA/CSP
1.2.6 Other
1.3 Semiconductor Package Substrate for Mobile Devices by Application
1.3.1 Global Semiconductor Package Substrate for Mobile Devices Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smartphone
1.3.3 PC
1.3.4 Wearable Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Package Substrate for Mobile Devices Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Semiconductor Package Substrate for Mobile Devices Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Semiconductor Package Substrate for Mobile Devices Production Estimates and Forecasts (2020-2031)
1.4.4 Global Semiconductor Package Substrate for Mobile Devices Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Package Substrate for Mobile Devices Production Market Share by Manufacturers (2020-2025)
2.2 Global Semiconductor Package Substrate for Mobile Devices Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Semiconductor Package Substrate for Mobile Devices, Industry Ranking, 2023 VS 2024
2.4 Global Semiconductor Package Substrate for Mobile Devices Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Semiconductor Package Substrate for Mobile Devices Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Semiconductor Package Substrate for Mobile Devices, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Package Substrate for Mobile Devices, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Package Substrate for Mobile Devices, Date of Enter into This Industry
2.9 Semiconductor Package Substrate for Mobile Devices Market Competitive Situation and Trends
2.9.1 Semiconductor Package Substrate for Mobile Devices Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Package Substrate for Mobile Devices Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Package Substrate for Mobile Devices Production by Region
3.1 Global Semiconductor Package Substrate for Mobile Devices Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Semiconductor Package Substrate for Mobile Devices Production Value by Region (2020-2031)
3.2.1 Global Semiconductor Package Substrate for Mobile Devices Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Semiconductor Package Substrate for Mobile Devices by Region (2026-2031)
3.3 Global Semiconductor Package Substrate for Mobile Devices Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Semiconductor Package Substrate for Mobile Devices Production Volume by Region (2020-2031)
3.4.1 Global Semiconductor Package Substrate for Mobile Devices Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Semiconductor Package Substrate for Mobile Devices by Region (2026-2031)
3.5 Global Semiconductor Package Substrate for Mobile Devices Market Price Analysis by Region (2020-2025)
3.6 Global Semiconductor Package Substrate for Mobile Devices Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Package Substrate for Mobile Devices Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Semiconductor Package Substrate for Mobile Devices Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Semiconductor Package Substrate for Mobile Devices Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Semiconductor Package Substrate for Mobile Devices Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Semiconductor Package Substrate for Mobile Devices Production Value Estimates and Forecasts (2020-2031)
3.6.6 Taiwan Semiconductor Package Substrate for Mobile Devices Production Value Estimates and Forecasts (2020-2031)
4 Semiconductor Package Substrate for Mobile Devices Consumption by Region
4.1 Global Semiconductor Package Substrate for Mobile Devices Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Semiconductor Package Substrate for Mobile Devices Consumption by Region (2020-2031)
4.2.1 Global Semiconductor Package Substrate for Mobile Devices Consumption by Region (2020-2025)
4.2.2 Global Semiconductor Package Substrate for Mobile Devices Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Semiconductor Package Substrate for Mobile Devices Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Semiconductor Package Substrate for Mobile Devices Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Package Substrate for Mobile Devices Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Semiconductor Package Substrate for Mobile Devices Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Package Substrate for Mobile Devices Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Semiconductor Package Substrate for Mobile Devices Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Package Substrate for Mobile Devices Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Semiconductor Package Substrate for Mobile Devices Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Semiconductor Package Substrate for Mobile Devices Production by Type (2020-2031)
5.1.1 Global Semiconductor Package Substrate for Mobile Devices Production by Type (2020-2025)
5.1.2 Global Semiconductor Package Substrate for Mobile Devices Production by Type (2026-2031)
5.1.3 Global Semiconductor Package Substrate for Mobile Devices Production Market Share by Type (2020-2031)
5.2 Global Semiconductor Package Substrate for Mobile Devices Production Value by Type (2020-2031)
5.2.1 Global Semiconductor Package Substrate for Mobile Devices Production Value by Type (2020-2025)
5.2.2 Global Semiconductor Package Substrate for Mobile Devices Production Value by Type (2026-2031)
5.2.3 Global Semiconductor Package Substrate for Mobile Devices Production Value Market Share by Type (2020-2031)
5.3 Global Semiconductor Package Substrate for Mobile Devices Price by Type (2020-2031)
6 Segment by Application
6.1 Global Semiconductor Package Substrate for Mobile Devices Production by Application (2020-2031)
6.1.1 Global Semiconductor Package Substrate for Mobile Devices Production by Application (2020-2025)
6.1.2 Global Semiconductor Package Substrate for Mobile Devices Production by Application (2026-2031)
6.1.3 Global Semiconductor Package Substrate for Mobile Devices Production Market Share by Application (2020-2031)
6.2 Global Semiconductor Package Substrate for Mobile Devices Production Value by Application (2020-2031)
6.2.1 Global Semiconductor Package Substrate for Mobile Devices Production Value by Application (2020-2025)
6.2.2 Global Semiconductor Package Substrate for Mobile Devices Production Value by Application (2026-2031)
6.2.3 Global Semiconductor Package Substrate for Mobile Devices Production Value Market Share by Application (2020-2031)
6.3 Global Semiconductor Package Substrate for Mobile Devices Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Simmtech
7.1.1 Simmtech Semiconductor Package Substrate for Mobile Devices Company Information
7.1.2 Simmtech Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.1.3 Simmtech Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Simmtech Main Business and Markets Served
7.1.5 Simmtech Recent Developments/Updates
7.2 Kyocera
7.2.1 Kyocera Semiconductor Package Substrate for Mobile Devices Company Information
7.2.2 Kyocera Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.2.3 Kyocera Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Kyocera Main Business and Markets Served
7.2.5 Kyocera Recent Developments/Updates
7.3 Daeduck Electronics
7.3.1 Daeduck Electronics Semiconductor Package Substrate for Mobile Devices Company Information
7.3.2 Daeduck Electronics Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.3.3 Daeduck Electronics Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Daeduck Electronics Main Business and Markets Served
7.3.5 Daeduck Electronics Recent Developments/Updates
7.4 Shinko Electric
7.4.1 Shinko Electric Semiconductor Package Substrate for Mobile Devices Company Information
7.4.2 Shinko Electric Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.4.3 Shinko Electric Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Shinko Electric Main Business and Markets Served
7.4.5 Shinko Electric Recent Developments/Updates
7.5 Ibiden
7.5.1 Ibiden Semiconductor Package Substrate for Mobile Devices Company Information
7.5.2 Ibiden Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.5.3 Ibiden Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Ibiden Main Business and Markets Served
7.5.5 Ibiden Recent Developments/Updates
7.6 Unimicron
7.6.1 Unimicron Semiconductor Package Substrate for Mobile Devices Company Information
7.6.2 Unimicron Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.6.3 Unimicron Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Unimicron Main Business and Markets Served
7.6.5 Unimicron Recent Developments/Updates
7.7 Samsung Electro-Mechanics
7.7.1 Samsung Electro-Mechanics Semiconductor Package Substrate for Mobile Devices Company Information
7.7.2 Samsung Electro-Mechanics Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.7.3 Samsung Electro-Mechanics Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Samsung Electro-Mechanics Main Business and Markets Served
7.7.5 Samsung Electro-Mechanics Recent Developments/Updates
7.8 ASE Group
7.8.1 ASE Group Semiconductor Package Substrate for Mobile Devices Company Information
7.8.2 ASE Group Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.8.3 ASE Group Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.8.4 ASE Group Main Business and Markets Served
7.8.5 ASE Group Recent Developments/Updates
7.9 Millennium Circuits
7.9.1 Millennium Circuits Semiconductor Package Substrate for Mobile Devices Company Information
7.9.2 Millennium Circuits Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.9.3 Millennium Circuits Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Millennium Circuits Main Business and Markets Served
7.9.5 Millennium Circuits Recent Developments/Updates
7.10 LG Chem
7.10.1 LG Chem Semiconductor Package Substrate for Mobile Devices Company Information
7.10.2 LG Chem Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.10.3 LG Chem Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.10.4 LG Chem Main Business and Markets Served
7.10.5 LG Chem Recent Developments/Updates
7.11 Nanya
7.11.1 Nanya Semiconductor Package Substrate for Mobile Devices Company Information
7.11.2 Nanya Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.11.3 Nanya Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Nanya Main Business and Markets Served
7.11.5 Nanya Recent Developments/Updates
7.12 Shenzhen Rayming Technology
7.12.1 Shenzhen Rayming Technology Semiconductor Package Substrate for Mobile Devices Company Information
7.12.2 Shenzhen Rayming Technology Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.12.3 Shenzhen Rayming Technology Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Shenzhen Rayming Technology Main Business and Markets Served
7.12.5 Shenzhen Rayming Technology Recent Developments/Updates
7.13 HOREXS Group
7.13.1 HOREXS Group Semiconductor Package Substrate for Mobile Devices Company Information
7.13.2 HOREXS Group Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.13.3 HOREXS Group Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.13.4 HOREXS Group Main Business and Markets Served
7.13.5 HOREXS Group Recent Developments/Updates
7.14 Kinsus
7.14.1 Kinsus Semiconductor Package Substrate for Mobile Devices Company Information
7.14.2 Kinsus Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.14.3 Kinsus Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Kinsus Main Business and Markets Served
7.14.5 Kinsus Recent Developments/Updates
7.15 TTM Technologies
7.15.1 TTM Technologies Semiconductor Package Substrate for Mobile Devices Company Information
7.15.2 TTM Technologies Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.15.3 TTM Technologies Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.15.4 TTM Technologies Main Business and Markets Served
7.15.5 TTM Technologies Recent Developments/Updates
7.16 Qinhuangdao Zhen Ding Technology
7.16.1 Qinhuangdao Zhen Ding Technology Semiconductor Package Substrate for Mobile Devices Company Information
7.16.2 Qinhuangdao Zhen Ding Technology Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.16.3 Qinhuangdao Zhen Ding Technology Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Qinhuangdao Zhen Ding Technology Main Business and Markets Served
7.16.5 Qinhuangdao Zhen Ding Technology Recent Developments/Updates
7.17 Shennan Circuits Company
7.17.1 Shennan Circuits Company Semiconductor Package Substrate for Mobile Devices Company Information
7.17.2 Shennan Circuits Company Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.17.3 Shennan Circuits Company Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Shennan Circuits Company Main Business and Markets Served
7.17.5 Shennan Circuits Company Recent Developments/Updates
7.18 Shenzhen Pastprint Technology
7.18.1 Shenzhen Pastprint Technology Semiconductor Package Substrate for Mobile Devices Company Information
7.18.2 Shenzhen Pastprint Technology Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.18.3 Shenzhen Pastprint Technology Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Shenzhen Pastprint Technology Main Business and Markets Served
7.18.5 Shenzhen Pastprint Technology Recent Developments/Updates
7.19 Zhuhai ACCESS Semiconductor
7.19.1 Zhuhai ACCESS Semiconductor Semiconductor Package Substrate for Mobile Devices Company Information
7.19.2 Zhuhai ACCESS Semiconductor Semiconductor Package Substrate for Mobile Devices Product Portfolio
7.19.3 Zhuhai ACCESS Semiconductor Semiconductor Package Substrate for Mobile Devices Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Zhuhai ACCESS Semiconductor Main Business and Markets Served
7.19.5 Zhuhai ACCESS Semiconductor Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Package Substrate for Mobile Devices Industry Chain Analysis
8.2 Semiconductor Package Substrate for Mobile Devices Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Package Substrate for Mobile Devices Production Mode & Process Analysis
8.4 Semiconductor Package Substrate for Mobile Devices Sales and Marketing
8.4.1 Semiconductor Package Substrate for Mobile Devices Sales Channels
8.4.2 Semiconductor Package Substrate for Mobile Devices Distributors
8.5 Semiconductor Package Substrate for Mobile Devices Customer Analysis
9 Semiconductor Package Substrate for Mobile Devices Market Dynamics
9.1 Semiconductor Package Substrate for Mobile Devices Industry Trends
9.2 Semiconductor Package Substrate for Mobile Devices Market Drivers
9.3 Semiconductor Package Substrate for Mobile Devices Market Challenges
9.4 Semiconductor Package Substrate for Mobile Devices Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Simmtech
Kyocera
Daeduck Electronics
Shinko Electric
Ibiden
Unimicron
Samsung Electro-Mechanics
ASE Group
Millennium Circuits
LG Chem
Nanya
Shenzhen Rayming Technology
HOREXS Group
Kinsus
TTM Technologies
Qinhuangdao Zhen Ding Technology
Shennan Circuits Company
Shenzhen Pastprint Technology
Zhuhai ACCESS Semiconductor
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*If Applicable.
