Semiconductor package substrate is a core part in semiconductor packaging process, which is a high density board of fine circuit that connects semiconductor's electrical signal to the mainboard.
The global Semiconductor Package Substrates market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
In terms of production side, this report researches the Semiconductor Package Substrates production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of Semiconductor Package Substrates by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for Semiconductor Package Substrates, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Semiconductor Package Substrates, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Semiconductor Package Substrates, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Semiconductor Package Substrates sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Semiconductor Package Substrates market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Semiconductor Package Substrates sales, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
SIMMTECH
KYOCERA
Eastern
LG Innotek
Samsung Electro-Mechanics
Daeduck
Unimicron
ASE Group
TTM Technologies
Segment by Type
MCP/UTCSP
FC-CSP
SiP
PBGA/CSP
BOC
FMC
Automotive Substrate
Segment by Application
Mobile Devices
Automotive Industry
Others
Production by Region
North America
Europe
China
Japan
South Korea
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Semiconductor Package Substrates production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Semiconductor Package Substrates in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of Semiconductor Package Substrates manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Semiconductor Package Substrates sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 Semiconductor Package Substrates Product Introduction
1.2 Market by Type
1.2.1 Global Semiconductor Package Substrates Market Size by Type, 2019 VS 2023 VS 2030
1.2.2 MCP/UTCSP
1.2.3 FC-CSP
1.2.4 SiP
1.2.5 PBGA/CSP
1.2.6 BOC
1.2.7 FMC
1.2.8 Automotive Substrate
1.3 Market by Application
1.3.1 Global Semiconductor Package Substrates Market Size by Application, 2019 VS 2023 VS 2030
1.3.2 Mobile Devices
1.3.3 Automotive Industry
1.3.4 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Semiconductor Package Substrates Production
2.1 Global Semiconductor Package Substrates Production Capacity (2019-2030)
2.2 Global Semiconductor Package Substrates Production by Region: 2019 VS 2023 VS 2030
2.3 Global Semiconductor Package Substrates Production by Region
2.3.1 Global Semiconductor Package Substrates Historic Production by Region (2019-2024)
2.3.2 Global Semiconductor Package Substrates Forecasted Production by Region (2025-2030)
2.3.3 Global Semiconductor Package Substrates Production Market Share by Region (2019-2030)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global Semiconductor Package Substrates Revenue Estimates and Forecasts 2019-2030
3.2 Global Semiconductor Package Substrates Revenue by Region
3.2.1 Global Semiconductor Package Substrates Revenue by Region: 2019 VS 2023 VS 2030
3.2.2 Global Semiconductor Package Substrates Revenue by Region (2019-2024)
3.2.3 Global Semiconductor Package Substrates Revenue by Region (2025-2030)
3.2.4 Global Semiconductor Package Substrates Revenue Market Share by Region (2019-2030)
3.3 Global Semiconductor Package Substrates Sales Estimates and Forecasts 2019-2030
3.4 Global Semiconductor Package Substrates Sales by Region
3.4.1 Global Semiconductor Package Substrates Sales by Region: 2019 VS 2023 VS 2030
3.4.2 Global Semiconductor Package Substrates Sales by Region (2019-2024)
3.4.3 Global Semiconductor Package Substrates Sales by Region (2025-2030)
3.4.4 Global Semiconductor Package Substrates Sales Market Share by Region (2019-2030)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Semiconductor Package Substrates Sales by Manufacturers
4.1.1 Global Semiconductor Package Substrates Sales by Manufacturers (2019-2024)
4.1.2 Global Semiconductor Package Substrates Sales Market Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Semiconductor Package Substrates in 2023
4.2 Global Semiconductor Package Substrates Revenue by Manufacturers
4.2.1 Global Semiconductor Package Substrates Revenue by Manufacturers (2019-2024)
4.2.2 Global Semiconductor Package Substrates Revenue Market Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by Semiconductor Package Substrates Revenue in 2023
4.3 Global Semiconductor Package Substrates Sales Price by Manufacturers
4.4 Global Key Players of Semiconductor Package Substrates, Industry Ranking, 2022 VS 2023 VS 2024
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Semiconductor Package Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Semiconductor Package Substrates, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Semiconductor Package Substrates, Product Offered and Application
4.8 Global Key Manufacturers of Semiconductor Package Substrates, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Semiconductor Package Substrates Sales by Type
5.1.1 Global Semiconductor Package Substrates Historical Sales by Type (2019-2024)
5.1.2 Global Semiconductor Package Substrates Forecasted Sales by Type (2025-2030)
5.1.3 Global Semiconductor Package Substrates Sales Market Share by Type (2019-2030)
5.2 Global Semiconductor Package Substrates Revenue by Type
5.2.1 Global Semiconductor Package Substrates Historical Revenue by Type (2019-2024)
5.2.2 Global Semiconductor Package Substrates Forecasted Revenue by Type (2025-2030)
5.2.3 Global Semiconductor Package Substrates Revenue Market Share by Type (2019-2030)
5.3 Global Semiconductor Package Substrates Price by Type
5.3.1 Global Semiconductor Package Substrates Price by Type (2019-2024)
5.3.2 Global Semiconductor Package Substrates Price Forecast by Type (2025-2030)
6 Market Size by Application
6.1 Global Semiconductor Package Substrates Sales by Application
6.1.1 Global Semiconductor Package Substrates Historical Sales by Application (2019-2024)
6.1.2 Global Semiconductor Package Substrates Forecasted Sales by Application (2025-2030)
6.1.3 Global Semiconductor Package Substrates Sales Market Share by Application (2019-2030)
6.2 Global Semiconductor Package Substrates Revenue by Application
6.2.1 Global Semiconductor Package Substrates Historical Revenue by Application (2019-2024)
6.2.2 Global Semiconductor Package Substrates Forecasted Revenue by Application (2025-2030)
6.2.3 Global Semiconductor Package Substrates Revenue Market Share by Application (2019-2030)
6.3 Global Semiconductor Package Substrates Price by Application
6.3.1 Global Semiconductor Package Substrates Price by Application (2019-2024)
6.3.2 Global Semiconductor Package Substrates Price Forecast by Application (2025-2030)
7 US & Canada
7.1 US & Canada Semiconductor Package Substrates Market Size by Type
7.1.1 US & Canada Semiconductor Package Substrates Sales by Type (2019-2030)
7.1.2 US & Canada Semiconductor Package Substrates Revenue by Type (2019-2030)
7.2 US & Canada Semiconductor Package Substrates Market Size by Application
7.2.1 US & Canada Semiconductor Package Substrates Sales by Application (2019-2030)
7.2.2 US & Canada Semiconductor Package Substrates Revenue by Application (2019-2030)
7.3 US & Canada Semiconductor Package Substrates Sales by Country
7.3.1 US & Canada Semiconductor Package Substrates Revenue by Country: 2019 VS 2023 VS 2030
7.3.2 US & Canada Semiconductor Package Substrates Sales by Country (2019-2030)
7.3.3 US & Canada Semiconductor Package Substrates Revenue by Country (2019-2030)
7.3.4 U.S.
7.3.5 Canada
8 Europe
8.1 Europe Semiconductor Package Substrates Market Size by Type
8.1.1 Europe Semiconductor Package Substrates Sales by Type (2019-2030)
8.1.2 Europe Semiconductor Package Substrates Revenue by Type (2019-2030)
8.2 Europe Semiconductor Package Substrates Market Size by Application
8.2.1 Europe Semiconductor Package Substrates Sales by Application (2019-2030)
8.2.2 Europe Semiconductor Package Substrates Revenue by Application (2019-2030)
8.3 Europe Semiconductor Package Substrates Sales by Country
8.3.1 Europe Semiconductor Package Substrates Revenue by Country: 2019 VS 2023 VS 2030
8.3.2 Europe Semiconductor Package Substrates Sales by Country (2019-2030)
8.3.3 Europe Semiconductor Package Substrates Revenue by Country (2019-2030)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Semiconductor Package Substrates Market Size by Type
9.1.1 China Semiconductor Package Substrates Sales by Type (2019-2030)
9.1.2 China Semiconductor Package Substrates Revenue by Type (2019-2030)
9.2 China Semiconductor Package Substrates Market Size by Application
9.2.1 China Semiconductor Package Substrates Sales by Application (2019-2030)
9.2.2 China Semiconductor Package Substrates Revenue by Application (2019-2030)
10 Asia (excluding China)
10.1 Asia Semiconductor Package Substrates Market Size by Type
10.1.1 Asia Semiconductor Package Substrates Sales by Type (2019-2030)
10.1.2 Asia Semiconductor Package Substrates Revenue by Type (2019-2030)
10.2 Asia Semiconductor Package Substrates Market Size by Application
10.2.1 Asia Semiconductor Package Substrates Sales by Application (2019-2030)
10.2.2 Asia Semiconductor Package Substrates Revenue by Application (2019-2030)
10.3 Asia Semiconductor Package Substrates Sales by Region
10.3.1 Asia Semiconductor Package Substrates Revenue by Region: 2019 VS 2023 VS 2030
10.3.2 Asia Semiconductor Package Substrates Revenue by Region (2019-2030)
10.3.3 Asia Semiconductor Package Substrates Sales by Region (2019-2030)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Semiconductor Package Substrates Market Size by Type
11.1.1 Middle East, Africa and Latin America Semiconductor Package Substrates Sales by Type (2019-2030)
11.1.2 Middle East, Africa and Latin America Semiconductor Package Substrates Revenue by Type (2019-2030)
11.2 Middle East, Africa and Latin America Semiconductor Package Substrates Market Size by Application
11.2.1 Middle East, Africa and Latin America Semiconductor Package Substrates Sales by Application (2019-2030)
11.2.2 Middle East, Africa and Latin America Semiconductor Package Substrates Revenue by Application (2019-2030)
11.3 Middle East, Africa and Latin America Semiconductor Package Substrates Sales by Country
11.3.1 Middle East, Africa and Latin America Semiconductor Package Substrates Revenue by Country: 2019 VS 2023 VS 2030
11.3.2 Middle East, Africa and Latin America Semiconductor Package Substrates Revenue by Country (2019-2030)
11.3.3 Middle East, Africa and Latin America Semiconductor Package Substrates Sales by Country (2019-2030)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 SIMMTECH
12.1.1 SIMMTECH Company Information
12.1.2 SIMMTECH Overview
12.1.3 SIMMTECH Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.1.4 SIMMTECH Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 SIMMTECH Recent Developments
12.2 KYOCERA
12.2.1 KYOCERA Company Information
12.2.2 KYOCERA Overview
12.2.3 KYOCERA Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.2.4 KYOCERA Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 KYOCERA Recent Developments
12.3 Eastern
12.3.1 Eastern Company Information
12.3.2 Eastern Overview
12.3.3 Eastern Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.3.4 Eastern Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Eastern Recent Developments
12.4 LG Innotek
12.4.1 LG Innotek Company Information
12.4.2 LG Innotek Overview
12.4.3 LG Innotek Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.4.4 LG Innotek Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 LG Innotek Recent Developments
12.5 Samsung Electro-Mechanics
12.5.1 Samsung Electro-Mechanics Company Information
12.5.2 Samsung Electro-Mechanics Overview
12.5.3 Samsung Electro-Mechanics Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.5.4 Samsung Electro-Mechanics Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Samsung Electro-Mechanics Recent Developments
12.6 Daeduck
12.6.1 Daeduck Company Information
12.6.2 Daeduck Overview
12.6.3 Daeduck Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.6.4 Daeduck Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Daeduck Recent Developments
12.7 Unimicron
12.7.1 Unimicron Company Information
12.7.2 Unimicron Overview
12.7.3 Unimicron Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.7.4 Unimicron Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Unimicron Recent Developments
12.8 ASE Group
12.8.1 ASE Group Company Information
12.8.2 ASE Group Overview
12.8.3 ASE Group Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.8.4 ASE Group Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 ASE Group Recent Developments
12.9 TTM Technologies
12.9.1 TTM Technologies Company Information
12.9.2 TTM Technologies Overview
12.9.3 TTM Technologies Semiconductor Package Substrates Sales, Price, Revenue and Gross Margin (2019-2024)
12.9.4 TTM Technologies Semiconductor Package Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 TTM Technologies Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Semiconductor Package Substrates Industry Chain Analysis
13.2 Semiconductor Package Substrates Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Semiconductor Package Substrates Production Mode & Process
13.4 Semiconductor Package Substrates Sales and Marketing
13.4.1 Semiconductor Package Substrates Sales Channels
13.4.2 Semiconductor Package Substrates Distributors
13.5 Semiconductor Package Substrates Customers
14 Semiconductor Package Substrates Market Dynamics
14.1 Semiconductor Package Substrates Industry Trends
14.2 Semiconductor Package Substrates Market Drivers
14.3 Semiconductor Package Substrates Market Challenges
14.4 Semiconductor Package Substrates Market Restraints
15 Key Finding in The Global Semiconductor Package Substrates Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
SIMMTECH
KYOCERA
Eastern
LG Innotek
Samsung Electro-Mechanics
Daeduck
Unimicron
ASE Group
TTM Technologies
听
听
*If Applicable.
