
Market Analysis and Insights: Global Semiconductor Packaging and Testing Service Market
The global Semiconductor Packaging and Testing Service market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.27% year-on-year.
Report Covers:
This report presents an overview of global market for Semiconductor Packaging and Testing Service market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Semiconductor Packaging and Testing Service, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Semiconductor Packaging and Testing Service, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Semiconductor Packaging and Testing Service revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Semiconductor Packaging and Testing Service market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Semiconductor Packaging and Testing Service revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
Intel
Samsung
SK Hynix
Micron
ASE Group
Amkor Technology, Inc.
Huatian Technology
Powertech Technology, Inc.
Chipbond
Presto Engineering
JECT
Siliconware Precision Industries Co., Ltd.
Tongfu Microelectronics
Tower Semiconductor
Qualcomm
MediaTek
UMC
Apple
IBM
Graphcore
ADLINK
Kioxia
Texas Instruments
TSMC
Analog Devices
Sony
Infineon
Bosch
onsemi
Mitsubishi Electric
Micross
UTAC
KYEC
ChipMOS
China Resources Group
Segment by Type
IDM
OSAT
Segment by Application
Communication
Automotive Electronics
Industrial
Consumer Electronics
Computing and Networking
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Semiconductor Packaging and Testing Service in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Packaging and Testing Service companies’ competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Semiconductor Packaging and Testing Service revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor Packaging and Testing Service Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 IDM
1.2.3 OSAT
1.3 Market by Application
1.3.1 Global Semiconductor Packaging and Testing Service Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Communication
1.3.3 Automotive Electronics
1.3.4 Industrial
1.3.5 Consumer Electronics
1.3.6 Computing and Networking
1.3.7 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor Packaging and Testing Service Market Perspective (2019-2030)
2.2 Global Semiconductor Packaging and Testing Service Growth Trends by Region
2.2.1 Semiconductor Packaging and Testing Service Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor Packaging and Testing Service Historic Market Size by Region (2019-2024)
2.2.3 Semiconductor Packaging and Testing Service Forecasted Market Size by Region (2025-2030)
2.3 Semiconductor Packaging and Testing Service Market Dynamics
2.3.1 Semiconductor Packaging and Testing Service Industry Trends
2.3.2 Semiconductor Packaging and Testing Service Market Drivers
2.3.3 Semiconductor Packaging and Testing Service Market Challenges
2.3.4 Semiconductor Packaging and Testing Service Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Semiconductor Packaging and Testing Service by Players
3.1.1 Global Semiconductor Packaging and Testing Service Revenue by Players (2019-2024)
3.1.2 Global Semiconductor Packaging and Testing Service Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor Packaging and Testing Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Semiconductor Packaging and Testing Service, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Semiconductor Packaging and Testing Service Market Concentration Ratio
3.4.1 Global Semiconductor Packaging and Testing Service Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Packaging and Testing Service Revenue in 2023
3.5 Global Key Players of Semiconductor Packaging and Testing Service Head office and Area Served
3.6 Global Key Players of Semiconductor Packaging and Testing Service, Product and Application
3.7 Global Key Players of Semiconductor Packaging and Testing Service, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor Packaging and Testing Service Breakdown Data by Type
4.1 Global Semiconductor Packaging and Testing Service Historic Market Size by Type (2019-2024)
4.2 Global Semiconductor Packaging and Testing Service Forecasted Market Size by Type (2025-2030)
5 Semiconductor Packaging and Testing Service Breakdown Data by Application
5.1 Global Semiconductor Packaging and Testing Service Historic Market Size by Application (2019-2024)
5.2 Global Semiconductor Packaging and Testing Service Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor Packaging and Testing Service Market Size (2019-2030)
6.2 North America Semiconductor Packaging and Testing Service Market Size by Type
6.2.1 North America Semiconductor Packaging and Testing Service Market Size by Type (2019-2024)
6.2.2 North America Semiconductor Packaging and Testing Service Market Size by Type (2025-2030)
6.2.3 North America Semiconductor Packaging and Testing Service Market Share by Type (2019-2030)
6.3 North America Semiconductor Packaging and Testing Service Market Size by Application
6.3.1 North America Semiconductor Packaging and Testing Service Market Size by Application (2019-2024)
6.3.2 North America Semiconductor Packaging and Testing Service Market Size by Application (2025-2030)
6.3.3 North America Semiconductor Packaging and Testing Service Market Share by Application (2019-2030)
6.4 North America Semiconductor Packaging and Testing Service Market Size by Country
6.4.1 North America Semiconductor Packaging and Testing Service Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Semiconductor Packaging and Testing Service Market Size by Country (2019-2024)
6.4.3 North America Semiconductor Packaging and Testing Service Market Size by Country (2025-2030)
6.4.4 United States
6.4.5 Canada
7 Europe
7.1 Europe Semiconductor Packaging and Testing Service Market Size (2019-2030)
7.2 Europe Semiconductor Packaging and Testing Service Market Size by Type
7.2.1 Europe Semiconductor Packaging and Testing Service Market Size by Type (2019-2024)
7.2.2 Europe Semiconductor Packaging and Testing Service Market Size by Type (2025-2030)
7.2.3 Europe Semiconductor Packaging and Testing Service Market Share by Type (2019-2030)
7.3 Europe Semiconductor Packaging and Testing Service Market Size by Application
7.3.1 Europe Semiconductor Packaging and Testing Service Market Size by Application (2019-2024)
7.3.2 Europe Semiconductor Packaging and Testing Service Market Size by Application (2025-2030)
7.3.3 Europe Semiconductor Packaging and Testing Service Market Share by Application (2019-2030)
7.4 Europe Semiconductor Packaging and Testing Service Market Size by Country
7.4.1 Europe Semiconductor Packaging and Testing Service Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Semiconductor Packaging and Testing Service Market Size by Country (2019-2024)
7.4.3 Europe Semiconductor Packaging and Testing Service Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Semiconductor Packaging and Testing Service Market Size (2019-2030)
8.2 China Semiconductor Packaging and Testing Service Market Size by Type
8.2.1 China Semiconductor Packaging and Testing Service Market Size by Type (2019-2024)
8.2.2 China Semiconductor Packaging and Testing Service Market Size by Type (2025-2030)
8.2.3 China Semiconductor Packaging and Testing Service Market Share by Type (2019-2030)
8.3 China Semiconductor Packaging and Testing Service Market Size by Application
8.3.1 China Semiconductor Packaging and Testing Service Market Size by Application (2019-2024)
8.3.2 China Semiconductor Packaging and Testing Service Market Size by Application (2025-2030)
8.3.3 China Semiconductor Packaging and Testing Service Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Semiconductor Packaging and Testing Service Market Size (2019-2030)
9.2 Asia Semiconductor Packaging and Testing Service Market Size by Type
9.2.1 Asia Semiconductor Packaging and Testing Service Market Size by Type (2019-2024)
9.2.2 Asia Semiconductor Packaging and Testing Service Market Size by Type (2025-2030)
9.2.3 Asia Semiconductor Packaging and Testing Service Market Share by Type (2019-2030)
9.3 Asia Semiconductor Packaging and Testing Service Market Size by Application
9.3.1 Asia Semiconductor Packaging and Testing Service Market Size by Application (2019-2024)
9.3.2 Asia Semiconductor Packaging and Testing Service Market Size by Application (2025-2030)
9.3.3 Asia Semiconductor Packaging and Testing Service Market Share by Application (2019-2030)
9.4 Asia Semiconductor Packaging and Testing Service Market Size by Region
9.4.1 Asia Semiconductor Packaging and Testing Service Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Semiconductor Packaging and Testing Service Market Size by Region (2019-2024)
9.4.3 Asia Semiconductor Packaging and Testing Service Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Type
10.2.1 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Application
10.3.1 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Country
10.4.1 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Semiconductor Packaging and Testing Service Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 Intel
11.1.1 Intel Company Details
11.1.2 Intel Business Overview
11.1.3 Intel Semiconductor Packaging and Testing Service Introduction
11.1.4 Intel Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.1.5 Intel Recent Developments
11.2 Samsung
11.2.1 Samsung Company Details
11.2.2 Samsung Business Overview
11.2.3 Samsung Semiconductor Packaging and Testing Service Introduction
11.2.4 Samsung Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.2.5 Samsung Recent Developments
11.3 SK Hynix
11.3.1 SK Hynix Company Details
11.3.2 SK Hynix Business Overview
11.3.3 SK Hynix Semiconductor Packaging and Testing Service Introduction
11.3.4 SK Hynix Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.3.5 SK Hynix Recent Developments
11.4 Micron
11.4.1 Micron Company Details
11.4.2 Micron Business Overview
11.4.3 Micron Semiconductor Packaging and Testing Service Introduction
11.4.4 Micron Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.4.5 Micron Recent Developments
11.5 ASE Group
11.5.1 ASE Group Company Details
11.5.2 ASE Group Business Overview
11.5.3 ASE Group Semiconductor Packaging and Testing Service Introduction
11.5.4 ASE Group Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.5.5 ASE Group Recent Developments
11.6 Amkor Technology, Inc.
11.6.1 Amkor Technology, Inc. Company Details
11.6.2 Amkor Technology, Inc. Business Overview
11.6.3 Amkor Technology, Inc. Semiconductor Packaging and Testing Service Introduction
11.6.4 Amkor Technology, Inc. Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.6.5 Amkor Technology, Inc. Recent Developments
11.7 Huatian Technology
11.7.1 Huatian Technology Company Details
11.7.2 Huatian Technology Business Overview
11.7.3 Huatian Technology Semiconductor Packaging and Testing Service Introduction
11.7.4 Huatian Technology Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.7.5 Huatian Technology Recent Developments
11.8 Powertech Technology, Inc.
11.8.1 Powertech Technology, Inc. Company Details
11.8.2 Powertech Technology, Inc. Business Overview
11.8.3 Powertech Technology, Inc. Semiconductor Packaging and Testing Service Introduction
11.8.4 Powertech Technology, Inc. Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.8.5 Powertech Technology, Inc. Recent Developments
11.9 Chipbond
11.9.1 Chipbond Company Details
11.9.2 Chipbond Business Overview
11.9.3 Chipbond Semiconductor Packaging and Testing Service Introduction
11.9.4 Chipbond Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.9.5 Chipbond Recent Developments
11.10 Presto Engineering
11.10.1 Presto Engineering Company Details
11.10.2 Presto Engineering Business Overview
11.10.3 Presto Engineering Semiconductor Packaging and Testing Service Introduction
11.10.4 Presto Engineering Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.10.5 Presto Engineering Recent Developments
11.11 JECT
11.11.1 JECT Company Details
11.11.2 JECT Business Overview
11.11.3 JECT Semiconductor Packaging and Testing Service Introduction
11.11.4 JECT Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.11.5 JECT Recent Developments
11.12 Siliconware Precision Industries Co., Ltd.
11.12.1 Siliconware Precision Industries Co., Ltd. Company Details
11.12.2 Siliconware Precision Industries Co., Ltd. Business Overview
11.12.3 Siliconware Precision Industries Co., Ltd. Semiconductor Packaging and Testing Service Introduction
11.12.4 Siliconware Precision Industries Co., Ltd. Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.12.5 Siliconware Precision Industries Co., Ltd. Recent Developments
11.13 Tongfu Microelectronics
11.13.1 Tongfu Microelectronics Company Details
11.13.2 Tongfu Microelectronics Business Overview
11.13.3 Tongfu Microelectronics Semiconductor Packaging and Testing Service Introduction
11.13.4 Tongfu Microelectronics Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.13.5 Tongfu Microelectronics Recent Developments
11.14 Tower Semiconductor
11.14.1 Tower Semiconductor Company Details
11.14.2 Tower Semiconductor Business Overview
11.14.3 Tower Semiconductor Semiconductor Packaging and Testing Service Introduction
11.14.4 Tower Semiconductor Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.14.5 Tower Semiconductor Recent Developments
11.15 Qualcomm
11.15.1 Qualcomm Company Details
11.15.2 Qualcomm Business Overview
11.15.3 Qualcomm Semiconductor Packaging and Testing Service Introduction
11.15.4 Qualcomm Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.15.5 Qualcomm Recent Developments
11.16 MediaTek
11.16.1 MediaTek Company Details
11.16.2 MediaTek Business Overview
11.16.3 MediaTek Semiconductor Packaging and Testing Service Introduction
11.16.4 MediaTek Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.16.5 MediaTek Recent Developments
11.17 UMC
11.17.1 UMC Company Details
11.17.2 UMC Business Overview
11.17.3 UMC Semiconductor Packaging and Testing Service Introduction
11.17.4 UMC Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.17.5 UMC Recent Developments
11.18 Apple
11.18.1 Apple Company Details
11.18.2 Apple Business Overview
11.18.3 Apple Semiconductor Packaging and Testing Service Introduction
11.18.4 Apple Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.18.5 Apple Recent Developments
11.19 IBM
11.19.1 IBM Company Details
11.19.2 IBM Business Overview
11.19.3 IBM Semiconductor Packaging and Testing Service Introduction
11.19.4 IBM Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.19.5 IBM Recent Developments
11.20 Graphcore
11.20.1 Graphcore Company Details
11.20.2 Graphcore Business Overview
11.20.3 Graphcore Semiconductor Packaging and Testing Service Introduction
11.20.4 Graphcore Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.20.5 Graphcore Recent Developments
11.21 ADLINK
11.21.1 ADLINK Company Details
11.21.2 ADLINK Business Overview
11.21.3 ADLINK Semiconductor Packaging and Testing Service Introduction
11.21.4 ADLINK Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.21.5 ADLINK Recent Developments
11.22 Kioxia
11.22.1 Kioxia Company Details
11.22.2 Kioxia Business Overview
11.22.3 Kioxia Semiconductor Packaging and Testing Service Introduction
11.22.4 Kioxia Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.22.5 Kioxia Recent Developments
11.23 Texas Instruments
11.23.1 Texas Instruments Company Details
11.23.2 Texas Instruments Business Overview
11.23.3 Texas Instruments Semiconductor Packaging and Testing Service Introduction
11.23.4 Texas Instruments Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.23.5 Texas Instruments Recent Developments
11.24 TSMC
11.24.1 TSMC Company Details
11.24.2 TSMC Business Overview
11.24.3 TSMC Semiconductor Packaging and Testing Service Introduction
11.24.4 TSMC Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.24.5 TSMC Recent Developments
11.25 Analog Devices
11.25.1 Analog Devices Company Details
11.25.2 Analog Devices Business Overview
11.25.3 Analog Devices Semiconductor Packaging and Testing Service Introduction
11.25.4 Analog Devices Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.25.5 Analog Devices Recent Developments
11.26 Sony
11.26.1 Sony Company Details
11.26.2 Sony Business Overview
11.26.3 Sony Semiconductor Packaging and Testing Service Introduction
11.26.4 Sony Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.26.5 Sony Recent Developments
11.27 Infineon
11.27.1 Infineon Company Details
11.27.2 Infineon Business Overview
11.27.3 Infineon Semiconductor Packaging and Testing Service Introduction
11.27.4 Infineon Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.27.5 Infineon Recent Developments
11.28 Bosch
11.28.1 Bosch Company Details
11.28.2 Bosch Business Overview
11.28.3 Bosch Semiconductor Packaging and Testing Service Introduction
11.28.4 Bosch Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.28.5 Bosch Recent Developments
11.29 onsemi
11.29.1 onsemi Company Details
11.29.2 onsemi Business Overview
11.29.3 onsemi Semiconductor Packaging and Testing Service Introduction
11.29.4 onsemi Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.29.5 onsemi Recent Developments
11.30 Mitsubishi Electric
11.30.1 Mitsubishi Electric Company Details
11.30.2 Mitsubishi Electric Business Overview
11.30.3 Mitsubishi Electric Semiconductor Packaging and Testing Service Introduction
11.30.4 Mitsubishi Electric Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.30.5 Mitsubishi Electric Recent Developments
11.31 Micross
11.31.1 Micross Company Details
11.31.2 Micross Business Overview
11.31.3 Micross Semiconductor Packaging and Testing Service Introduction
11.31.4 Micross Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.31.5 Micross Recent Developments
11.32 UTAC
11.32.1 UTAC Company Details
11.32.2 UTAC Business Overview
11.32.3 UTAC Semiconductor Packaging and Testing Service Introduction
11.32.4 UTAC Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.32.5 UTAC Recent Developments
11.33 KYEC
11.33.1 KYEC Company Details
11.33.2 KYEC Business Overview
11.33.3 KYEC Semiconductor Packaging and Testing Service Introduction
11.33.4 KYEC Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.33.5 KYEC Recent Developments
11.34 ChipMOS
11.34.1 ChipMOS Company Details
11.34.2 ChipMOS Business Overview
11.34.3 ChipMOS Semiconductor Packaging and Testing Service Introduction
11.34.4 ChipMOS Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.34.5 ChipMOS Recent Developments
11.35 China Resources Group
11.35.1 China Resources Group Company Details
11.35.2 China Resources Group Business Overview
11.35.3 China Resources Group Semiconductor Packaging and Testing Service Introduction
11.35.4 China Resources Group Revenue in Semiconductor Packaging and Testing Service Business (2019-2024)
11.35.5 China Resources Group Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Intel
Samsung
SK Hynix
Micron
ASE Group
Amkor Technology, Inc.
Huatian Technology
Powertech Technology, Inc.
Chipbond
Presto Engineering
JECT
Siliconware Precision Industries Co., Ltd.
Tongfu Microelectronics
Tower Semiconductor
Qualcomm
MediaTek
UMC
Apple
IBM
Graphcore
ADLINK
Kioxia
Texas Instruments
TSMC
Analog Devices
Sony
Infineon
Bosch
onsemi
Mitsubishi Electric
Micross
UTAC
KYEC
ChipMOS
China Resources Group
Ìý
Ìý
*If Applicable.
