Market Analysis and Insights: Global Semiconductor Packaging Service Market
The global Semiconductor Packaging Service market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Covers:
This report presents an overview of global market for Semiconductor Packaging Service market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Semiconductor Packaging Service, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Semiconductor Packaging Service, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Semiconductor Packaging Service revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Semiconductor Packaging Service market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Semiconductor Packaging Service revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
SPIL
ASE
TFME
TSMC
Nepes
Unisem
JCET
IMEC
UTAC
eSilicon
Huatian
Chipbond
Chipmos
Formosa
Carsem
J-Devices
Stats Chippac
Amkor Technology
Lingsen Precision
MegaChips Technology
Powertech Technology
Integra Technologies
China Wafer Level CSP
King Yuan Electronics
Advanced Micro Devices
Walton Advanced Engineering
Tianshui Huatian Technology
Siliconware Precision Industries
Segment by Type
Wafer Level Packages
System in Package (SiP)
Others
Segment by Application
Commercial Use
Military Use
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Semiconductor Packaging Service in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Packaging Service companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Semiconductor Packaging Service revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor Packaging Service Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Wafer Level Packages
1.2.3 System in Package (SiP)
1.2.4 Others
1.3 Market by Application
1.3.1 Global Semiconductor Packaging Service Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Commercial Use
1.3.3 Military Use
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor Packaging Service Market Perspective (2019-2030)
2.2 Global Semiconductor Packaging Service Growth Trends by Region
2.2.1 Semiconductor Packaging Service Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor Packaging Service Historic Market Size by Region (2019-2024)
2.2.3 Semiconductor Packaging Service Forecasted Market Size by Region (2025-2030)
2.3 Semiconductor Packaging Service Market Dynamics
2.3.1 Semiconductor Packaging Service Industry Trends
2.3.2 Semiconductor Packaging Service Market Drivers
2.3.3 Semiconductor Packaging Service Market Challenges
2.3.4 Semiconductor Packaging Service Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Semiconductor Packaging Service by Players
3.1.1 Global Semiconductor Packaging Service Revenue by Players (2019-2024)
3.1.2 Global Semiconductor Packaging Service Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor Packaging Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Semiconductor Packaging Service, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Semiconductor Packaging Service Market Concentration Ratio
3.4.1 Global Semiconductor Packaging Service Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Packaging Service Revenue in 2023
3.5 Global Key Players of Semiconductor Packaging Service Head office and Area Served
3.6 Global Key Players of Semiconductor Packaging Service, Product and Application
3.7 Global Key Players of Semiconductor Packaging Service, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor Packaging Service Breakdown Data by Type
4.1 Global Semiconductor Packaging Service Historic Market Size by Type (2019-2024)
4.2 Global Semiconductor Packaging Service Forecasted Market Size by Type (2025-2030)
5 Semiconductor Packaging Service Breakdown Data by Application
5.1 Global Semiconductor Packaging Service Historic Market Size by Application (2019-2024)
5.2 Global Semiconductor Packaging Service Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor Packaging Service Market Size (2019-2030)
6.2 North America Semiconductor Packaging Service Market Size by Type
6.2.1 North America Semiconductor Packaging Service Market Size by Type (2019-2024)
6.2.2 North America Semiconductor Packaging Service Market Size by Type (2025-2030)
6.2.3 North America Semiconductor Packaging Service Market Share by Type (2019-2030)
6.3 North America Semiconductor Packaging Service Market Size by Application
6.3.1 North America Semiconductor Packaging Service Market Size by Application (2019-2024)
6.3.2 North America Semiconductor Packaging Service Market Size by Application (2025-2030)
6.3.3 North America Semiconductor Packaging Service Market Share by Application (2019-2030)
6.4 North America Semiconductor Packaging Service Market Size by Country
6.4.1 North America Semiconductor Packaging Service Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Semiconductor Packaging Service Market Size by Country (2019-2024)
6.4.3 North America Semiconductor Packaging Service Market Size by Country (2025-2030)
6.4.4 U.S.
6.4.5 Canada
7 Europe
7.1 Europe Semiconductor Packaging Service Market Size (2019-2030)
7.2 Europe Semiconductor Packaging Service Market Size by Type
7.2.1 Europe Semiconductor Packaging Service Market Size by Type (2019-2024)
7.2.2 Europe Semiconductor Packaging Service Market Size by Type (2025-2030)
7.2.3 Europe Semiconductor Packaging Service Market Share by Type (2019-2030)
7.3 Europe Semiconductor Packaging Service Market Size by Application
7.3.1 Europe Semiconductor Packaging Service Market Size by Application (2019-2024)
7.3.2 Europe Semiconductor Packaging Service Market Size by Application (2025-2030)
7.3.3 Europe Semiconductor Packaging Service Market Share by Application (2019-2030)
7.4 Europe Semiconductor Packaging Service Market Size by Country
7.4.1 Europe Semiconductor Packaging Service Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Semiconductor Packaging Service Market Size by Country (2019-2024)
7.4.3 Europe Semiconductor Packaging Service Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Semiconductor Packaging Service Market Size (2019-2030)
8.2 China Semiconductor Packaging Service Market Size by Type
8.2.1 China Semiconductor Packaging Service Market Size by Type (2019-2024)
8.2.2 China Semiconductor Packaging Service Market Size by Type (2025-2030)
8.2.3 China Semiconductor Packaging Service Market Share by Type (2019-2030)
8.3 China Semiconductor Packaging Service Market Size by Application
8.3.1 China Semiconductor Packaging Service Market Size by Application (2019-2024)
8.3.2 China Semiconductor Packaging Service Market Size by Application (2025-2030)
8.3.3 China Semiconductor Packaging Service Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Semiconductor Packaging Service Market Size (2019-2030)
9.2 Asia Semiconductor Packaging Service Market Size by Type
9.2.1 Asia Semiconductor Packaging Service Market Size by Type (2019-2024)
9.2.2 Asia Semiconductor Packaging Service Market Size by Type (2025-2030)
9.2.3 Asia Semiconductor Packaging Service Market Share by Type (2019-2030)
9.3 Asia Semiconductor Packaging Service Market Size by Application
9.3.1 Asia Semiconductor Packaging Service Market Size by Application (2019-2024)
9.3.2 Asia Semiconductor Packaging Service Market Size by Application (2025-2030)
9.3.3 Asia Semiconductor Packaging Service Market Share by Application (2019-2030)
9.4 Asia Semiconductor Packaging Service Market Size by Region
9.4.1 Asia Semiconductor Packaging Service Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Semiconductor Packaging Service Market Size by Region (2019-2024)
9.4.3 Asia Semiconductor Packaging Service Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Type
10.2.1 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Application
10.3.1 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Country
10.4.1 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Semiconductor Packaging Service Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 SPIL
11.1.1 SPIL Company Details
11.1.2 SPIL Business Overview
11.1.3 SPIL Semiconductor Packaging Service Introduction
11.1.4 SPIL Revenue in Semiconductor Packaging Service Business (2019-2024)
11.1.5 SPIL Recent Developments
11.2 ASE
11.2.1 ASE Company Details
11.2.2 ASE Business Overview
11.2.3 ASE Semiconductor Packaging Service Introduction
11.2.4 ASE Revenue in Semiconductor Packaging Service Business (2019-2024)
11.2.5 ASE Recent Developments
11.3 TFME
11.3.1 TFME Company Details
11.3.2 TFME Business Overview
11.3.3 TFME Semiconductor Packaging Service Introduction
11.3.4 TFME Revenue in Semiconductor Packaging Service Business (2019-2024)
11.3.5 TFME Recent Developments
11.4 TSMC
11.4.1 TSMC Company Details
11.4.2 TSMC Business Overview
11.4.3 TSMC Semiconductor Packaging Service Introduction
11.4.4 TSMC Revenue in Semiconductor Packaging Service Business (2019-2024)
11.4.5 TSMC Recent Developments
11.5 Nepes
11.5.1 Nepes Company Details
11.5.2 Nepes Business Overview
11.5.3 Nepes Semiconductor Packaging Service Introduction
11.5.4 Nepes Revenue in Semiconductor Packaging Service Business (2019-2024)
11.5.5 Nepes Recent Developments
11.6 Unisem
11.6.1 Unisem Company Details
11.6.2 Unisem Business Overview
11.6.3 Unisem Semiconductor Packaging Service Introduction
11.6.4 Unisem Revenue in Semiconductor Packaging Service Business (2019-2024)
11.6.5 Unisem Recent Developments
11.7 JCET
11.7.1 JCET Company Details
11.7.2 JCET Business Overview
11.7.3 JCET Semiconductor Packaging Service Introduction
11.7.4 JCET Revenue in Semiconductor Packaging Service Business (2019-2024)
11.7.5 JCET Recent Developments
11.8 IMEC
11.8.1 IMEC Company Details
11.8.2 IMEC Business Overview
11.8.3 IMEC Semiconductor Packaging Service Introduction
11.8.4 IMEC Revenue in Semiconductor Packaging Service Business (2019-2024)
11.8.5 IMEC Recent Developments
11.9 UTAC
11.9.1 UTAC Company Details
11.9.2 UTAC Business Overview
11.9.3 UTAC Semiconductor Packaging Service Introduction
11.9.4 UTAC Revenue in Semiconductor Packaging Service Business (2019-2024)
11.9.5 UTAC Recent Developments
11.10 eSilicon
11.10.1 eSilicon Company Details
11.10.2 eSilicon Business Overview
11.10.3 eSilicon Semiconductor Packaging Service Introduction
11.10.4 eSilicon Revenue in Semiconductor Packaging Service Business (2019-2024)
11.10.5 eSilicon Recent Developments
11.11 Huatian
11.11.1 Huatian Company Details
11.11.2 Huatian Business Overview
11.11.3 Huatian Semiconductor Packaging Service Introduction
11.11.4 Huatian Revenue in Semiconductor Packaging Service Business (2019-2024)
11.11.5 Huatian Recent Developments
11.12 Chipbond
11.12.1 Chipbond Company Details
11.12.2 Chipbond Business Overview
11.12.3 Chipbond Semiconductor Packaging Service Introduction
11.12.4 Chipbond Revenue in Semiconductor Packaging Service Business (2019-2024)
11.12.5 Chipbond Recent Developments
11.13 Chipmos
11.13.1 Chipmos Company Details
11.13.2 Chipmos Business Overview
11.13.3 Chipmos Semiconductor Packaging Service Introduction
11.13.4 Chipmos Revenue in Semiconductor Packaging Service Business (2019-2024)
11.13.5 Chipmos Recent Developments
11.14 Formosa
11.14.1 Formosa Company Details
11.14.2 Formosa Business Overview
11.14.3 Formosa Semiconductor Packaging Service Introduction
11.14.4 Formosa Revenue in Semiconductor Packaging Service Business (2019-2024)
11.14.5 Formosa Recent Developments
11.15 Carsem
11.15.1 Carsem Company Details
11.15.2 Carsem Business Overview
11.15.3 Carsem Semiconductor Packaging Service Introduction
11.15.4 Carsem Revenue in Semiconductor Packaging Service Business (2019-2024)
11.15.5 Carsem Recent Developments
11.16 J-Devices
11.16.1 J-Devices Company Details
11.16.2 J-Devices Business Overview
11.16.3 J-Devices Semiconductor Packaging Service Introduction
11.16.4 J-Devices Revenue in Semiconductor Packaging Service Business (2019-2024)
11.16.5 J-Devices Recent Developments
11.17 Stats Chippac
11.17.1 Stats Chippac Company Details
11.17.2 Stats Chippac Business Overview
11.17.3 Stats Chippac Semiconductor Packaging Service Introduction
11.17.4 Stats Chippac Revenue in Semiconductor Packaging Service Business (2019-2024)
11.17.5 Stats Chippac Recent Developments
11.18 Amkor Technology
11.18.1 Amkor Technology Company Details
11.18.2 Amkor Technology Business Overview
11.18.3 Amkor Technology Semiconductor Packaging Service Introduction
11.18.4 Amkor Technology Revenue in Semiconductor Packaging Service Business (2019-2024)
11.18.5 Amkor Technology Recent Developments
11.19 Lingsen Precision
11.19.1 Lingsen Precision Company Details
11.19.2 Lingsen Precision Business Overview
11.19.3 Lingsen Precision Semiconductor Packaging Service Introduction
11.19.4 Lingsen Precision Revenue in Semiconductor Packaging Service Business (2019-2024)
11.19.5 Lingsen Precision Recent Developments
11.20 MegaChips Technology
11.20.1 MegaChips Technology Company Details
11.20.2 MegaChips Technology Business Overview
11.20.3 MegaChips Technology Semiconductor Packaging Service Introduction
11.20.4 MegaChips Technology Revenue in Semiconductor Packaging Service Business (2019-2024)
11.20.5 MegaChips Technology Recent Developments
11.21 Powertech Technology
11.21.1 Powertech Technology Company Details
11.21.2 Powertech Technology Business Overview
11.21.3 Powertech Technology Semiconductor Packaging Service Introduction
11.21.4 Powertech Technology Revenue in Semiconductor Packaging Service Business (2019-2024)
11.21.5 Powertech Technology Recent Developments
11.22 Integra Technologies
11.22.1 Integra Technologies Company Details
11.22.2 Integra Technologies Business Overview
11.22.3 Integra Technologies Semiconductor Packaging Service Introduction
11.22.4 Integra Technologies Revenue in Semiconductor Packaging Service Business (2019-2024)
11.22.5 Integra Technologies Recent Developments
11.23 China Wafer Level CSP
11.23.1 China Wafer Level CSP Company Details
11.23.2 China Wafer Level CSP Business Overview
11.23.3 China Wafer Level CSP Semiconductor Packaging Service Introduction
11.23.4 China Wafer Level CSP Revenue in Semiconductor Packaging Service Business (2019-2024)
11.23.5 China Wafer Level CSP Recent Developments
11.24 King Yuan Electronics
11.24.1 King Yuan Electronics Company Details
11.24.2 King Yuan Electronics Business Overview
11.24.3 King Yuan Electronics Semiconductor Packaging Service Introduction
11.24.4 King Yuan Electronics Revenue in Semiconductor Packaging Service Business (2019-2024)
11.24.5 King Yuan Electronics Recent Developments
11.25 Advanced Micro Devices
11.25.1 Advanced Micro Devices Company Details
11.25.2 Advanced Micro Devices Business Overview
11.25.3 Advanced Micro Devices Semiconductor Packaging Service Introduction
11.25.4 Advanced Micro Devices Revenue in Semiconductor Packaging Service Business (2019-2024)
11.25.5 Advanced Micro Devices Recent Developments
11.26 Walton Advanced Engineering
11.26.1 Walton Advanced Engineering Company Details
11.26.2 Walton Advanced Engineering Business Overview
11.26.3 Walton Advanced Engineering Semiconductor Packaging Service Introduction
11.26.4 Walton Advanced Engineering Revenue in Semiconductor Packaging Service Business (2019-2024)
11.26.5 Walton Advanced Engineering Recent Developments
11.27 Tianshui Huatian Technology
11.27.1 Tianshui Huatian Technology Company Details
11.27.2 Tianshui Huatian Technology Business Overview
11.27.3 Tianshui Huatian Technology Semiconductor Packaging Service Introduction
11.27.4 Tianshui Huatian Technology Revenue in Semiconductor Packaging Service Business (2019-2024)
11.27.5 Tianshui Huatian Technology Recent Developments
11.28 Siliconware Precision Industries
11.28.1 Siliconware Precision Industries Company Details
11.28.2 Siliconware Precision Industries Business Overview
11.28.3 Siliconware Precision Industries Semiconductor Packaging Service Introduction
11.28.4 Siliconware Precision Industries Revenue in Semiconductor Packaging Service Business (2019-2024)
11.28.5 Siliconware Precision Industries Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
SPIL
ASE
TFME
TSMC
Nepes
Unisem
JCET
IMEC
UTAC
eSilicon
Huatian
Chipbond
Chipmos
Formosa
Carsem
J-Devices
Stats Chippac
Amkor Technology
Lingsen Precision
MegaChips Technology
Powertech Technology
Integra Technologies
China Wafer Level CSP
King Yuan Electronics
Advanced Micro Devices
Walton Advanced Engineering
Tianshui Huatian Technology
Siliconware Precision Industries
听
听
*If Applicable.
