The global market for Semiconductor Plastic Encapsulation Press was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Semiconductor plastic packaging press is a kind of equipment used in the packaging process of semiconductor chips. During semiconductor packaging, chips are usually encapsulated in plastic encapsulation materials to provide protection and connect circuits. The plastic packaging press is used to press the chip and packaging material to ensure that the packaging material is firmly fixed on the chip and to ensure the reliability of the circuit connection. These presses typically include heating and cooling functions to control the temperature of the potting material, as well as a pressure control system to ensure proper press force. Semiconductor plastic packaging presses play a key role in the semiconductor industry and are used to produce various types of packaged chips, such as QFP (Quad Flat Package), BGA (Ball Grid Array), etc.
North American market for Semiconductor Plastic Encapsulation Press is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Semiconductor Plastic Encapsulation Press is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Semiconductor Plastic Encapsulation Press include TOWA Corporation, ASM Pacific Technology Ltd., Shinkawa Ltd., Kulicke & Soffa Industries, Inc., Besi N.V., Hesse Mechatronics, Inc., Palomar Technologies, Inc., Fico Molding Solutions B.V., West Bond, Inc., Hybond, Inc., etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Plastic Encapsulation Press, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Plastic Encapsulation Press.
The Semiconductor Plastic Encapsulation Press market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Semiconductor Plastic Encapsulation Press market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Plastic Encapsulation Press manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TOWA Corporation
ASM Pacific Technology Ltd.
Shinkawa Ltd.
Kulicke & Soffa Industries, Inc.
Besi N.V.
Hesse Mechatronics, Inc.
Palomar Technologies, Inc.
Fico Molding Solutions B.V.
West Bond, Inc.
Hybond, Inc.
GPD Global, Inc.
ESEC SA
Unitemp GmbH
Mech-El Industries, Inc.
Orthodyne Electronics Corporation
by Type
Compression Molding Plastic Sealing Press
Injection Molding Plastic Sealing Press
by Application
Semiconductor Industry
Electronic Industry
New Energy Industry
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Plastic Encapsulation Press manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Plastic Encapsulation Press by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Plastic Encapsulation Press in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Semiconductor Plastic Encapsulation Press Market Overview
1.1 Product Definition
1.2 Semiconductor Plastic Encapsulation Press by Type
1.2.1 Global Semiconductor Plastic Encapsulation Press Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Compression Molding Plastic Sealing Press
1.2.3 Injection Molding Plastic Sealing Press
1.3 Semiconductor Plastic Encapsulation Press by Application
1.3.1 Global Semiconductor Plastic Encapsulation Press Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Semiconductor Industry
1.3.3 Electronic Industry
1.3.4 New Energy Industry
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Plastic Encapsulation Press Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Semiconductor Plastic Encapsulation Press Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Semiconductor Plastic Encapsulation Press Production Estimates and Forecasts (2020-2031)
1.4.4 Global Semiconductor Plastic Encapsulation Press Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Plastic Encapsulation Press Production Market Share by Manufacturers (2020-2025)
2.2 Global Semiconductor Plastic Encapsulation Press Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Semiconductor Plastic Encapsulation Press, Industry Ranking, 2023 VS 2024
2.4 Global Semiconductor Plastic Encapsulation Press Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Semiconductor Plastic Encapsulation Press Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Semiconductor Plastic Encapsulation Press, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Plastic Encapsulation Press, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Plastic Encapsulation Press, Date of Enter into This Industry
2.9 Semiconductor Plastic Encapsulation Press Market Competitive Situation and Trends
2.9.1 Semiconductor Plastic Encapsulation Press Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Plastic Encapsulation Press Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Plastic Encapsulation Press Production by Region
3.1 Global Semiconductor Plastic Encapsulation Press Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Semiconductor Plastic Encapsulation Press Production Value by Region (2020-2031)
3.2.1 Global Semiconductor Plastic Encapsulation Press Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Semiconductor Plastic Encapsulation Press by Region (2026-2031)
3.3 Global Semiconductor Plastic Encapsulation Press Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Semiconductor Plastic Encapsulation Press Production Volume by Region (2020-2031)
3.4.1 Global Semiconductor Plastic Encapsulation Press Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Semiconductor Plastic Encapsulation Press by Region (2026-2031)
3.5 Global Semiconductor Plastic Encapsulation Press Market Price Analysis by Region (2020-2025)
3.6 Global Semiconductor Plastic Encapsulation Press Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Plastic Encapsulation Press Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Semiconductor Plastic Encapsulation Press Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Semiconductor Plastic Encapsulation Press Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Semiconductor Plastic Encapsulation Press Production Value Estimates and Forecasts (2020-2031)
4 Semiconductor Plastic Encapsulation Press Consumption by Region
4.1 Global Semiconductor Plastic Encapsulation Press Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Semiconductor Plastic Encapsulation Press Consumption by Region (2020-2031)
4.2.1 Global Semiconductor Plastic Encapsulation Press Consumption by Region (2020-2025)
4.2.2 Global Semiconductor Plastic Encapsulation Press Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Semiconductor Plastic Encapsulation Press Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Semiconductor Plastic Encapsulation Press Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Plastic Encapsulation Press Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Semiconductor Plastic Encapsulation Press Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Plastic Encapsulation Press Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Semiconductor Plastic Encapsulation Press Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Plastic Encapsulation Press Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Semiconductor Plastic Encapsulation Press Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Semiconductor Plastic Encapsulation Press Production by Type (2020-2031)
5.1.1 Global Semiconductor Plastic Encapsulation Press Production by Type (2020-2025)
5.1.2 Global Semiconductor Plastic Encapsulation Press Production by Type (2026-2031)
5.1.3 Global Semiconductor Plastic Encapsulation Press Production Market Share by Type (2020-2031)
5.2 Global Semiconductor Plastic Encapsulation Press Production Value by Type (2020-2031)
5.2.1 Global Semiconductor Plastic Encapsulation Press Production Value by Type (2020-2025)
5.2.2 Global Semiconductor Plastic Encapsulation Press Production Value by Type (2026-2031)
5.2.3 Global Semiconductor Plastic Encapsulation Press Production Value Market Share by Type (2020-2031)
5.3 Global Semiconductor Plastic Encapsulation Press Price by Type (2020-2031)
6 Segment by Application
6.1 Global Semiconductor Plastic Encapsulation Press Production by Application (2020-2031)
6.1.1 Global Semiconductor Plastic Encapsulation Press Production by Application (2020-2025)
6.1.2 Global Semiconductor Plastic Encapsulation Press Production by Application (2026-2031)
6.1.3 Global Semiconductor Plastic Encapsulation Press Production Market Share by Application (2020-2031)
6.2 Global Semiconductor Plastic Encapsulation Press Production Value by Application (2020-2031)
6.2.1 Global Semiconductor Plastic Encapsulation Press Production Value by Application (2020-2025)
6.2.2 Global Semiconductor Plastic Encapsulation Press Production Value by Application (2026-2031)
6.2.3 Global Semiconductor Plastic Encapsulation Press Production Value Market Share by Application (2020-2031)
6.3 Global Semiconductor Plastic Encapsulation Press Price by Application (2020-2031)
7 Key Companies Profiled
7.1 TOWA Corporation
7.1.1 TOWA Corporation Semiconductor Plastic Encapsulation Press Company Information
7.1.2 TOWA Corporation Semiconductor Plastic Encapsulation Press Product Portfolio
7.1.3 TOWA Corporation Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.1.4 TOWA Corporation Main Business and Markets Served
7.1.5 TOWA Corporation Recent Developments/Updates
7.2 ASM Pacific Technology Ltd.
7.2.1 ASM Pacific Technology Ltd. Semiconductor Plastic Encapsulation Press Company Information
7.2.2 ASM Pacific Technology Ltd. Semiconductor Plastic Encapsulation Press Product Portfolio
7.2.3 ASM Pacific Technology Ltd. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.2.4 ASM Pacific Technology Ltd. Main Business and Markets Served
7.2.5 ASM Pacific Technology Ltd. Recent Developments/Updates
7.3 Shinkawa Ltd.
7.3.1 Shinkawa Ltd. Semiconductor Plastic Encapsulation Press Company Information
7.3.2 Shinkawa Ltd. Semiconductor Plastic Encapsulation Press Product Portfolio
7.3.3 Shinkawa Ltd. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Shinkawa Ltd. Main Business and Markets Served
7.3.5 Shinkawa Ltd. Recent Developments/Updates
7.4 Kulicke & Soffa Industries, Inc.
7.4.1 Kulicke & Soffa Industries, Inc. Semiconductor Plastic Encapsulation Press Company Information
7.4.2 Kulicke & Soffa Industries, Inc. Semiconductor Plastic Encapsulation Press Product Portfolio
7.4.3 Kulicke & Soffa Industries, Inc. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Kulicke & Soffa Industries, Inc. Main Business and Markets Served
7.4.5 Kulicke & Soffa Industries, Inc. Recent Developments/Updates
7.5 Besi N.V.
7.5.1 Besi N.V. Semiconductor Plastic Encapsulation Press Company Information
7.5.2 Besi N.V. Semiconductor Plastic Encapsulation Press Product Portfolio
7.5.3 Besi N.V. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Besi N.V. Main Business and Markets Served
7.5.5 Besi N.V. Recent Developments/Updates
7.6 Hesse Mechatronics, Inc.
7.6.1 Hesse Mechatronics, Inc. Semiconductor Plastic Encapsulation Press Company Information
7.6.2 Hesse Mechatronics, Inc. Semiconductor Plastic Encapsulation Press Product Portfolio
7.6.3 Hesse Mechatronics, Inc. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Hesse Mechatronics, Inc. Main Business and Markets Served
7.6.5 Hesse Mechatronics, Inc. Recent Developments/Updates
7.7 Palomar Technologies, Inc.
7.7.1 Palomar Technologies, Inc. Semiconductor Plastic Encapsulation Press Company Information
7.7.2 Palomar Technologies, Inc. Semiconductor Plastic Encapsulation Press Product Portfolio
7.7.3 Palomar Technologies, Inc. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Palomar Technologies, Inc. Main Business and Markets Served
7.7.5 Palomar Technologies, Inc. Recent Developments/Updates
7.8 Fico Molding Solutions B.V.
7.8.1 Fico Molding Solutions B.V. Semiconductor Plastic Encapsulation Press Company Information
7.8.2 Fico Molding Solutions B.V. Semiconductor Plastic Encapsulation Press Product Portfolio
7.8.3 Fico Molding Solutions B.V. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Fico Molding Solutions B.V. Main Business and Markets Served
7.8.5 Fico Molding Solutions B.V. Recent Developments/Updates
7.9 West Bond, Inc.
7.9.1 West Bond, Inc. Semiconductor Plastic Encapsulation Press Company Information
7.9.2 West Bond, Inc. Semiconductor Plastic Encapsulation Press Product Portfolio
7.9.3 West Bond, Inc. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.9.4 West Bond, Inc. Main Business and Markets Served
7.9.5 West Bond, Inc. Recent Developments/Updates
7.10 Hybond, Inc.
7.10.1 Hybond, Inc. Semiconductor Plastic Encapsulation Press Company Information
7.10.2 Hybond, Inc. Semiconductor Plastic Encapsulation Press Product Portfolio
7.10.3 Hybond, Inc. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Hybond, Inc. Main Business and Markets Served
7.10.5 Hybond, Inc. Recent Developments/Updates
7.11 GPD Global, Inc.
7.11.1 GPD Global, Inc. Semiconductor Plastic Encapsulation Press Company Information
7.11.2 GPD Global, Inc. Semiconductor Plastic Encapsulation Press Product Portfolio
7.11.3 GPD Global, Inc. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.11.4 GPD Global, Inc. Main Business and Markets Served
7.11.5 GPD Global, Inc. Recent Developments/Updates
7.12 ESEC SA
7.12.1 ESEC SA Semiconductor Plastic Encapsulation Press Company Information
7.12.2 ESEC SA Semiconductor Plastic Encapsulation Press Product Portfolio
7.12.3 ESEC SA Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.12.4 ESEC SA Main Business and Markets Served
7.12.5 ESEC SA Recent Developments/Updates
7.13 Unitemp GmbH
7.13.1 Unitemp GmbH Semiconductor Plastic Encapsulation Press Company Information
7.13.2 Unitemp GmbH Semiconductor Plastic Encapsulation Press Product Portfolio
7.13.3 Unitemp GmbH Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Unitemp GmbH Main Business and Markets Served
7.13.5 Unitemp GmbH Recent Developments/Updates
7.14 Mech-El Industries, Inc.
7.14.1 Mech-El Industries, Inc. Semiconductor Plastic Encapsulation Press Company Information
7.14.2 Mech-El Industries, Inc. Semiconductor Plastic Encapsulation Press Product Portfolio
7.14.3 Mech-El Industries, Inc. Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Mech-El Industries, Inc. Main Business and Markets Served
7.14.5 Mech-El Industries, Inc. Recent Developments/Updates
7.15 Orthodyne Electronics Corporation
7.15.1 Orthodyne Electronics Corporation Semiconductor Plastic Encapsulation Press Company Information
7.15.2 Orthodyne Electronics Corporation Semiconductor Plastic Encapsulation Press Product Portfolio
7.15.3 Orthodyne Electronics Corporation Semiconductor Plastic Encapsulation Press Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Orthodyne Electronics Corporation Main Business and Markets Served
7.15.5 Orthodyne Electronics Corporation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Plastic Encapsulation Press Industry Chain Analysis
8.2 Semiconductor Plastic Encapsulation Press Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Plastic Encapsulation Press Production Mode & Process Analysis
8.4 Semiconductor Plastic Encapsulation Press Sales and Marketing
8.4.1 Semiconductor Plastic Encapsulation Press Sales Channels
8.4.2 Semiconductor Plastic Encapsulation Press Distributors
8.5 Semiconductor Plastic Encapsulation Press Customer Analysis
9 Semiconductor Plastic Encapsulation Press Market Dynamics
9.1 Semiconductor Plastic Encapsulation Press Industry Trends
9.2 Semiconductor Plastic Encapsulation Press Market Drivers
9.3 Semiconductor Plastic Encapsulation Press Market Challenges
9.4 Semiconductor Plastic Encapsulation Press Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
TOWA Corporation
ASM Pacific Technology Ltd.
Shinkawa Ltd.
Kulicke & Soffa Industries, Inc.
Besi N.V.
Hesse Mechatronics, Inc.
Palomar Technologies, Inc.
Fico Molding Solutions B.V.
West Bond, Inc.
Hybond, Inc.
GPD Global, Inc.
ESEC SA
Unitemp GmbH
Mech-El Industries, Inc.
Orthodyne Electronics Corporation
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*If Applicable.