
The global market for SiC Wafer Processing was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
According to our Semiconductor Research Center, in 2022, the global SiC wafer was valued at US$ 750 million, will grow rapidly in next six years, driven by the strong demand from electric vehicle (EV). Currently the 6 inch SiC substrates are dominating this market, and in next six years, more players will put into production the 8 inch SiC wafers. Currently the key players of SiC are mainly located headquartered United States, Europe, Japan and China, especially in China, more companies are entering the SiC market. It is predicted that, Chinese companies will play key roles in the SiC market in next ten years.
This report aims to provide a comprehensive presentation of the global market for SiC Wafer Processing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Processing.
The SiC Wafer Processing market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global SiC Wafer Processing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the SiC Wafer Processing companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
American Dicing
X-Trinsic
NADA Technologies
PAM-XIAMEN
Clas-SiC
Wolfspeed
Pureon
Micro Reclaim Technologies
Scientech
Premaeon
Roper Technologies
SVM
TOPCO Scientific
Segment by Type
Slicing
Edge Grinding
Lapping
Polishing
Segment by Application
Power Device
Electronics & Optoelectronics
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of SiC Wafer Processing company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global SiC Wafer Processing Market Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 Slicing
1.2.3 Edge Grinding
1.2.4 Lapping
1.2.5 Polishing
1.3 Market by Application
1.3.1 Global SiC Wafer Processing Market Growth by Application: 2020 VS 2024 VS 2031
1.3.2 Power Device
1.3.3 Electronics & Optoelectronics
1.3.4 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global SiC Wafer Processing Market Perspective (2020-2031)
2.2 Global SiC Wafer Processing Growth Trends by Region
2.2.1 Global SiC Wafer Processing Market Size by Region: 2020 VS 2024 VS 2031
2.2.2 SiC Wafer Processing Historic Market Size by Region (2020-2025)
2.2.3 SiC Wafer Processing Forecasted Market Size by Region (2026-2031)
2.3 SiC Wafer Processing Market Dynamics
2.3.1 SiC Wafer Processing Industry Trends
2.3.2 SiC Wafer Processing Market Drivers
2.3.3 SiC Wafer Processing Market Challenges
2.3.4 SiC Wafer Processing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top SiC Wafer Processing Players by Revenue
3.1.1 Global Top SiC Wafer Processing Players by Revenue (2020-2025)
3.1.2 Global SiC Wafer Processing Revenue Market Share by Players (2020-2025)
3.2 Global SiC Wafer Processing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by SiC Wafer Processing Revenue
3.4 Global SiC Wafer Processing Market Concentration Ratio
3.4.1 Global SiC Wafer Processing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by SiC Wafer Processing Revenue in 2024
3.5 Global Key Players of SiC Wafer Processing Head office and Area Served
3.6 Global Key Players of SiC Wafer Processing, Product and Application
3.7 Global Key Players of SiC Wafer Processing, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 SiC Wafer Processing Breakdown Data by Type
4.1 Global SiC Wafer Processing Historic Market Size by Type (2020-2025)
4.2 Global SiC Wafer Processing Forecasted Market Size by Type (2026-2031)
5 SiC Wafer Processing Breakdown Data by Application
5.1 Global SiC Wafer Processing Historic Market Size by Application (2020-2025)
5.2 Global SiC Wafer Processing Forecasted Market Size by Application (2026-2031)
6 North America
6.1 North America SiC Wafer Processing Market Size (2020-2031)
6.2 North America SiC Wafer Processing Market Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America SiC Wafer Processing Market Size by Country (2020-2025)
6.4 North America SiC Wafer Processing Market Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe SiC Wafer Processing Market Size (2020-2031)
7.2 Europe SiC Wafer Processing Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe SiC Wafer Processing Market Size by Country (2020-2025)
7.4 Europe SiC Wafer Processing Market Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific SiC Wafer Processing Market Size (2020-2031)
8.2 Asia-Pacific SiC Wafer Processing Market Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific SiC Wafer Processing Market Size by Region (2020-2025)
8.4 Asia-Pacific SiC Wafer Processing Market Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America SiC Wafer Processing Market Size (2020-2031)
9.2 Latin America SiC Wafer Processing Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America SiC Wafer Processing Market Size by Country (2020-2025)
9.4 Latin America SiC Wafer Processing Market Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa SiC Wafer Processing Market Size (2020-2031)
10.2 Middle East & Africa SiC Wafer Processing Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa SiC Wafer Processing Market Size by Country (2020-2025)
10.4 Middle East & Africa SiC Wafer Processing Market Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 American Dicing
11.1.1 American Dicing Company Details
11.1.2 American Dicing Business Overview
11.1.3 American Dicing SiC Wafer Processing Introduction
11.1.4 American Dicing Revenue in SiC Wafer Processing Business (2020-2025)
11.1.5 American Dicing Recent Development
11.2 X-Trinsic
11.2.1 X-Trinsic Company Details
11.2.2 X-Trinsic Business Overview
11.2.3 X-Trinsic SiC Wafer Processing Introduction
11.2.4 X-Trinsic Revenue in SiC Wafer Processing Business (2020-2025)
11.2.5 X-Trinsic Recent Development
11.3 NADA Technologies
11.3.1 NADA Technologies Company Details
11.3.2 NADA Technologies Business Overview
11.3.3 NADA Technologies SiC Wafer Processing Introduction
11.3.4 NADA Technologies Revenue in SiC Wafer Processing Business (2020-2025)
11.3.5 NADA Technologies Recent Development
11.4 PAM-XIAMEN
11.4.1 PAM-XIAMEN Company Details
11.4.2 PAM-XIAMEN Business Overview
11.4.3 PAM-XIAMEN SiC Wafer Processing Introduction
11.4.4 PAM-XIAMEN Revenue in SiC Wafer Processing Business (2020-2025)
11.4.5 PAM-XIAMEN Recent Development
11.5 Clas-SiC
11.5.1 Clas-SiC Company Details
11.5.2 Clas-SiC Business Overview
11.5.3 Clas-SiC SiC Wafer Processing Introduction
11.5.4 Clas-SiC Revenue in SiC Wafer Processing Business (2020-2025)
11.5.5 Clas-SiC Recent Development
11.6 Wolfspeed
11.6.1 Wolfspeed Company Details
11.6.2 Wolfspeed Business Overview
11.6.3 Wolfspeed SiC Wafer Processing Introduction
11.6.4 Wolfspeed Revenue in SiC Wafer Processing Business (2020-2025)
11.6.5 Wolfspeed Recent Development
11.7 Pureon
11.7.1 Pureon Company Details
11.7.2 Pureon Business Overview
11.7.3 Pureon SiC Wafer Processing Introduction
11.7.4 Pureon Revenue in SiC Wafer Processing Business (2020-2025)
11.7.5 Pureon Recent Development
11.8 Micro Reclaim Technologies
11.8.1 Micro Reclaim Technologies Company Details
11.8.2 Micro Reclaim Technologies Business Overview
11.8.3 Micro Reclaim Technologies SiC Wafer Processing Introduction
11.8.4 Micro Reclaim Technologies Revenue in SiC Wafer Processing Business (2020-2025)
11.8.5 Micro Reclaim Technologies Recent Development
11.9 Scientech
11.9.1 Scientech Company Details
11.9.2 Scientech Business Overview
11.9.3 Scientech SiC Wafer Processing Introduction
11.9.4 Scientech Revenue in SiC Wafer Processing Business (2020-2025)
11.9.5 Scientech Recent Development
11.10 Premaeon
11.10.1 Premaeon Company Details
11.10.2 Premaeon Business Overview
11.10.3 Premaeon SiC Wafer Processing Introduction
11.10.4 Premaeon Revenue in SiC Wafer Processing Business (2020-2025)
11.10.5 Premaeon Recent Development
11.11 Roper Technologies
11.11.1 Roper Technologies Company Details
11.11.2 Roper Technologies Business Overview
11.11.3 Roper Technologies SiC Wafer Processing Introduction
11.11.4 Roper Technologies Revenue in SiC Wafer Processing Business (2020-2025)
11.11.5 Roper Technologies Recent Development
11.12 SVM
11.12.1 SVM Company Details
11.12.2 SVM Business Overview
11.12.3 SVM SiC Wafer Processing Introduction
11.12.4 SVM Revenue in SiC Wafer Processing Business (2020-2025)
11.12.5 SVM Recent Development
11.13 TOPCO Scientific
11.13.1 TOPCO Scientific Company Details
11.13.2 TOPCO Scientific Business Overview
11.13.3 TOPCO Scientific SiC Wafer Processing Introduction
11.13.4 TOPCO Scientific Revenue in SiC Wafer Processing Business (2020-2025)
11.13.5 TOPCO Scientific Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
American Dicing
X-Trinsic
NADA Technologies
PAM-XIAMEN
Clas-SiC
Wolfspeed
Pureon
Micro Reclaim Technologies
Scientech
Premaeon
Roper Technologies
SVM
TOPCO Scientific
Ìý
Ìý
*If Applicable.
