Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip and the external circuit, it carries the chip's electrical connection and mechanical support functions. It is composed of multiple layers of materials, including metal layers, insulating layers, and conductive layers, and is used to connect the chip's tiny pins to larger external connectors or circuit boards, while providing the necessary electrical isolation and mechanical protection.
The global Solid State Memory Chip Packaging Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Solid State Memory Chip Packaging Substrate is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Solid State Memory Chip Packaging Substrate is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Solid State Memory Chip Packaging Substrate include LG Innotek, Samsung Electro Mechanics, Simmtech, IBIDEN, Shinko Electric, AT&S, Kyocera, Hemei Jingyi Technology, Shennan Circuit, Newsen Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Solid State Memory Chip Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solid State Memory Chip Packaging Substrate.
The Solid State Memory Chip Packaging Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Solid State Memory Chip Packaging Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Solid State Memory Chip Packaging Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
LG Innotek
Samsung Electro Mechanics
Simmtech
IBIDEN
Shinko Electric
AT&S
Kyocera
Hemei Jingyi Technology
Shennan Circuit
Newsen Technology
V&G Information System
ASE Group
Unimicron
KINSUS
by Type
WB-CSP Process
WB-BGA Process
by Application
DRAM
NAND Flash
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Solid State Memory Chip Packaging Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Solid State Memory Chip Packaging Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Solid State Memory Chip Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Solid State Memory Chip Packaging Substrate Market Overview
1.1 Product Definition
1.2 Solid State Memory Chip Packaging Substrate by Type
1.2.1 Global Solid State Memory Chip Packaging Substrate Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 WB-CSP Process
1.2.3 WB-BGA Process
1.3 Solid State Memory Chip Packaging Substrate by Application
1.3.1 Global Solid State Memory Chip Packaging Substrate Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 DRAM
1.3.3 NAND Flash
1.4 Global Market Growth Prospects
1.4.1 Global Solid State Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Solid State Memory Chip Packaging Substrate Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Solid State Memory Chip Packaging Substrate Production Estimates and Forecasts (2019-2030)
1.4.4 Global Solid State Memory Chip Packaging Substrate Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Solid State Memory Chip Packaging Substrate Production Market Share by Manufacturers (2019-2024)
2.2 Global Solid State Memory Chip Packaging Substrate Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Solid State Memory Chip Packaging Substrate, Industry Ranking, 2022 VS 2023
2.4 Global Solid State Memory Chip Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Solid State Memory Chip Packaging Substrate Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Solid State Memory Chip Packaging Substrate, Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Solid State Memory Chip Packaging Substrate, Product Type & Application
2.8 Global Key Manufacturers of Solid State Memory Chip Packaging Substrate, Date of Enter into This Industry
2.9 Global Solid State Memory Chip Packaging Substrate Market Competitive Situation and Trends
2.9.1 Global Solid State Memory Chip Packaging Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Solid State Memory Chip Packaging Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Solid State Memory Chip Packaging Substrate Production by Region
3.1 Global Solid State Memory Chip Packaging Substrate Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Solid State Memory Chip Packaging Substrate Production Value by Region (2019-2030)
3.2.1 Global Solid State Memory Chip Packaging Substrate Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Solid State Memory Chip Packaging Substrate by Region (2025-2030)
3.3 Global Solid State Memory Chip Packaging Substrate Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Solid State Memory Chip Packaging Substrate Production by Region (2019-2030)
3.4.1 Global Solid State Memory Chip Packaging Substrate Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Solid State Memory Chip Packaging Substrate by Region (2025-2030)
3.5 Global Solid State Memory Chip Packaging Substrate Market Price Analysis by Region (2019-2024)
3.6 Global Solid State Memory Chip Packaging Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Solid State Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Solid State Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Solid State Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Solid State Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Solid State Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2019-2030)
4 Solid State Memory Chip Packaging Substrate Consumption by Region
4.1 Global Solid State Memory Chip Packaging Substrate Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Solid State Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.2.1 Global Solid State Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.2.2 Global Solid State Memory Chip Packaging Substrate Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Solid State Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Solid State Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Solid State Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Solid State Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Solid State Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Solid State Memory Chip Packaging Substrate Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Solid State Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Solid State Memory Chip Packaging Substrate Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Solid State Memory Chip Packaging Substrate Production by Type (2019-2030)
5.1.1 Global Solid State Memory Chip Packaging Substrate Production by Type (2019-2024)
5.1.2 Global Solid State Memory Chip Packaging Substrate Production by Type (2025-2030)
5.1.3 Global Solid State Memory Chip Packaging Substrate Production Market Share by Type (2019-2030)
5.2 Global Solid State Memory Chip Packaging Substrate Production Value by Type (2019-2030)
5.2.1 Global Solid State Memory Chip Packaging Substrate Production Value by Type (2019-2024)
5.2.2 Global Solid State Memory Chip Packaging Substrate Production Value by Type (2025-2030)
5.2.3 Global Solid State Memory Chip Packaging Substrate Production Value Market Share by Type (2019-2030)
5.3 Global Solid State Memory Chip Packaging Substrate Price by Type (2019-2030)
6 Segment by Application
6.1 Global Solid State Memory Chip Packaging Substrate Production by Application (2019-2030)
6.1.1 Global Solid State Memory Chip Packaging Substrate Production by Application (2019-2024)
6.1.2 Global Solid State Memory Chip Packaging Substrate Production by Application (2025-2030)
6.1.3 Global Solid State Memory Chip Packaging Substrate Production Market Share by Application (2019-2030)
6.2 Global Solid State Memory Chip Packaging Substrate Production Value by Application (2019-2030)
6.2.1 Global Solid State Memory Chip Packaging Substrate Production Value by Application (2019-2024)
6.2.2 Global Solid State Memory Chip Packaging Substrate Production Value by Application (2025-2030)
6.2.3 Global Solid State Memory Chip Packaging Substrate Production Value Market Share by Application (2019-2030)
6.3 Global Solid State Memory Chip Packaging Substrate Price by Application (2019-2030)
7 Key Companies Profiled
7.1 LG Innotek
7.1.1 LG Innotek Solid State Memory Chip Packaging Substrate Company Information
7.1.2 LG Innotek Solid State Memory Chip Packaging Substrate Product Portfolio
7.1.3 LG Innotek Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.1.4 LG Innotek Main Business and Markets Served
7.1.5 LG Innotek Recent Developments/Updates
7.2 Samsung Electro Mechanics
7.2.1 Samsung Electro Mechanics Solid State Memory Chip Packaging Substrate Company Information
7.2.2 Samsung Electro Mechanics Solid State Memory Chip Packaging Substrate Product Portfolio
7.2.3 Samsung Electro Mechanics Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Samsung Electro Mechanics Main Business and Markets Served
7.2.5 Samsung Electro Mechanics Recent Developments/Updates
7.3 Simmtech
7.3.1 Simmtech Solid State Memory Chip Packaging Substrate Company Information
7.3.2 Simmtech Solid State Memory Chip Packaging Substrate Product Portfolio
7.3.3 Simmtech Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Simmtech Main Business and Markets Served
7.3.5 Simmtech Recent Developments/Updates
7.4 IBIDEN
7.4.1 IBIDEN Solid State Memory Chip Packaging Substrate Company Information
7.4.2 IBIDEN Solid State Memory Chip Packaging Substrate Product Portfolio
7.4.3 IBIDEN Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.4.4 IBIDEN Main Business and Markets Served
7.4.5 IBIDEN Recent Developments/Updates
7.5 Shinko Electric
7.5.1 Shinko Electric Solid State Memory Chip Packaging Substrate Company Information
7.5.2 Shinko Electric Solid State Memory Chip Packaging Substrate Product Portfolio
7.5.3 Shinko Electric Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Shinko Electric Main Business and Markets Served
7.5.5 Shinko Electric Recent Developments/Updates
7.6 AT&S
7.6.1 AT&S Solid State Memory Chip Packaging Substrate Company Information
7.6.2 AT&S Solid State Memory Chip Packaging Substrate Product Portfolio
7.6.3 AT&S Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.6.4 AT&S Main Business and Markets Served
7.6.5 AT&S Recent Developments/Updates
7.7 Kyocera
7.7.1 Kyocera Solid State Memory Chip Packaging Substrate Company Information
7.7.2 Kyocera Solid State Memory Chip Packaging Substrate Product Portfolio
7.7.3 Kyocera Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Kyocera Main Business and Markets Served
7.7.5 Kyocera Recent Developments/Updates
7.8 Hemei Jingyi Technology
7.8.1 Hemei Jingyi Technology Solid State Memory Chip Packaging Substrate Company Information
7.8.2 Hemei Jingyi Technology Solid State Memory Chip Packaging Substrate Product Portfolio
7.8.3 Hemei Jingyi Technology Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Hemei Jingyi Technology Main Business and Markets Served
7.8.5 Hemei Jingyi Technology Recent Developments/Updates
7.9 Shennan Circuit
7.9.1 Shennan Circuit Solid State Memory Chip Packaging Substrate Company Information
7.9.2 Shennan Circuit Solid State Memory Chip Packaging Substrate Product Portfolio
7.9.3 Shennan Circuit Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Shennan Circuit Main Business and Markets Served
7.9.5 Shennan Circuit Recent Developments/Updates
7.10 Newsen Technology
7.10.1 Newsen Technology Solid State Memory Chip Packaging Substrate Company Information
7.10.2 Newsen Technology Solid State Memory Chip Packaging Substrate Product Portfolio
7.10.3 Newsen Technology Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Newsen Technology Main Business and Markets Served
7.10.5 Newsen Technology Recent Developments/Updates
7.11 V&G Information System
7.11.1 V&G Information System Solid State Memory Chip Packaging Substrate Company Information
7.11.2 V&G Information System Solid State Memory Chip Packaging Substrate Product Portfolio
7.11.3 V&G Information System Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.11.4 V&G Information System Main Business and Markets Served
7.11.5 V&G Information System Recent Developments/Updates
7.12 ASE Group
7.12.1 ASE Group Solid State Memory Chip Packaging Substrate Company Information
7.12.2 ASE Group Solid State Memory Chip Packaging Substrate Product Portfolio
7.12.3 ASE Group Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.12.4 ASE Group Main Business and Markets Served
7.12.5 ASE Group Recent Developments/Updates
7.13 Unimicron
7.13.1 Unimicron Solid State Memory Chip Packaging Substrate Company Information
7.13.2 Unimicron Solid State Memory Chip Packaging Substrate Product Portfolio
7.13.3 Unimicron Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Unimicron Main Business and Markets Served
7.13.5 Unimicron Recent Developments/Updates
7.14 KINSUS
7.14.1 KINSUS Solid State Memory Chip Packaging Substrate Company Information
7.14.2 KINSUS Solid State Memory Chip Packaging Substrate Product Portfolio
7.14.3 KINSUS Solid State Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2019-2024)
7.14.4 KINSUS Main Business and Markets Served
7.14.5 KINSUS Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Solid State Memory Chip Packaging Substrate Industry Chain Analysis
8.2 Solid State Memory Chip Packaging Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Solid State Memory Chip Packaging Substrate Production Mode & Process
8.4 Solid State Memory Chip Packaging Substrate Sales and Marketing
8.4.1 Solid State Memory Chip Packaging Substrate Sales Channels
8.4.2 Solid State Memory Chip Packaging Substrate Distributors
8.5 Solid State Memory Chip Packaging Substrate Customers
9 Solid State Memory Chip Packaging Substrate Market Dynamics
9.1 Solid State Memory Chip Packaging Substrate Industry Trends
9.2 Solid State Memory Chip Packaging Substrate Market Drivers
9.3 Solid State Memory Chip Packaging Substrate Market Challenges
9.4 Solid State Memory Chip Packaging Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
LG Innotek
Samsung Electro Mechanics
Simmtech
IBIDEN
Shinko Electric
AT&S
Kyocera
Hemei Jingyi Technology
Shennan Circuit
Newsen Technology
V&G Information System
ASE Group
Unimicron
KINSUS
听
听
*If Applicable.
