SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
Highlights
The global System-in-Package market was valued at US$ 57520 million in 2022 and is anticipated to reach US$ 78420 million by 2029, witnessing a CAGR of 5.3% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The emergence of advanced and compact consumer electronic devices as one of the primary growth factors for this semiconductor packaging market. The consumer electronics devices industry has witnessed a massive transformation in the recent years, where feature phones were replaced by smartphones and personal computers by laptops and tablets. Furthermore, the adoption of the smart homes concept, where electronic devices can be monitored and controlled with the help of mobile applications, will further transition this industry. This will induce electronic device manufacturers to constantly upgrade their products in terms of several factors such as design, processing power, power consumption, and user-interface, that will require the use of robust technology and develop compact devices. This demand for compact electronic devices will compel semiconductor manufacturers to develop denser ICs with increased circuitry, which will boost the demand for advanced IC packagingtechniques such as SiP.
Report Scope
This report aims to provide a comprehensive presentation of the global market for System-in-Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding System-in-Package.
The System-in-Package market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global System-in-Package market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the System-in-Package companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
Segment by Type
2D IC
2.5D IC
3D IC
Segment by Application
Consumer Electronics
Communications
Automotive & Transportation
Aerospace & Defense
Healthcare
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of System-in-Package companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global System-in-Package Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 2D IC
1.2.3 2.5D IC
1.2.4 3D IC
1.3 Market by Application
1.3.1 Global System-in-Package Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Communications
1.3.4 Automotive & Transportation
1.3.5 Aerospace & Defense
1.3.6 Healthcare
1.3.7 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global System-in-Package Market Perspective (2018-2029)
2.2 System-in-Package Growth Trends by Region
2.2.1 Global System-in-Package Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 System-in-Package Historic Market Size by Region (2018-2023)
2.2.3 System-in-Package Forecasted Market Size by Region (2024-2029)
2.3 System-in-Package Market Dynamics
2.3.1 System-in-Package Industry Trends
2.3.2 System-in-Package Market Drivers
2.3.3 System-in-Package Market Challenges
2.3.4 System-in-Package Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top System-in-Package Players by Revenue
3.1.1 Global Top System-in-Package Players by Revenue (2018-2023)
3.1.2 Global System-in-Package Revenue Market Share by Players (2018-2023)
3.2 Global System-in-Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by System-in-Package Revenue
3.4 Global System-in-Package Market Concentration Ratio
3.4.1 Global System-in-Package Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by System-in-Package Revenue in 2022
3.5 System-in-Package Key Players Head office and Area Served
3.6 Key Players System-in-Package Product Solution and Service
3.7 Date of Enter into System-in-Package Market
3.8 Mergers & Acquisitions, Expansion Plans
4 System-in-Package Breakdown Data by Type
4.1 Global System-in-Package Historic Market Size by Type (2018-2023)
4.2 Global System-in-Package Forecasted Market Size by Type (2024-2029)
5 System-in-Package Breakdown Data by Application
5.1 Global System-in-Package Historic Market Size by Application (2018-2023)
5.2 Global System-in-Package Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America System-in-Package Market Size (2018-2029)
6.2 North America System-in-Package Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America System-in-Package Market Size by Country (2018-2023)
6.4 North America System-in-Package Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe System-in-Package Market Size (2018-2029)
7.2 Europe System-in-Package Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe System-in-Package Market Size by Country (2018-2023)
7.4 Europe System-in-Package Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific System-in-Package Market Size (2018-2029)
8.2 Asia-Pacific System-in-Package Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific System-in-Package Market Size by Region (2018-2023)
8.4 Asia-Pacific System-in-Package Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America System-in-Package Market Size (2018-2029)
9.2 Latin America System-in-Package Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America System-in-Package Market Size by Country (2018-2023)
9.4 Latin America System-in-Package Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa System-in-Package Market Size (2018-2029)
10.2 Middle East & Africa System-in-Package Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa System-in-Package Market Size by Country (2018-2023)
10.4 Middle East & Africa System-in-Package Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor Technology
11.1.1 Amkor Technology Company Detail
11.1.2 Amkor Technology Business Overview
11.1.3 Amkor Technology System-in-Package Introduction
11.1.4 Amkor Technology Revenue in System-in-Package Business (2018-2023)
11.1.5 Amkor Technology Recent Development
11.2 ASE
11.2.1 ASE Company Detail
11.2.2 ASE Business Overview
11.2.3 ASE System-in-Package Introduction
11.2.4 ASE Revenue in System-in-Package Business (2018-2023)
11.2.5 ASE Recent Development
11.3 Jiangsu Changjiang Electronics Technology (JCET)
11.3.1 Jiangsu Changjiang Electronics Technology (JCET) Company Detail
11.3.2 Jiangsu Changjiang Electronics Technology (JCET) Business Overview
11.3.3 Jiangsu Changjiang Electronics Technology (JCET) System-in-Package Introduction
11.3.4 Jiangsu Changjiang Electronics Technology (JCET) Revenue in System-in-Package Business (2018-2023)
11.3.5 Jiangsu Changjiang Electronics Technology (JCET) Recent Development
11.4 Siliconware Precision Industries (SPIL)
11.4.1 Siliconware Precision Industries (SPIL) Company Detail
11.4.2 Siliconware Precision Industries (SPIL) Business Overview
11.4.3 Siliconware Precision Industries (SPIL) System-in-Package Introduction
11.4.4 Siliconware Precision Industries (SPIL) Revenue in System-in-Package Business (2018-2023)
11.4.5 Siliconware Precision Industries (SPIL) Recent Development
11.5 United Test and Assembly Center (UTAC)
11.5.1 United Test and Assembly Center (UTAC) Company Detail
11.5.2 United Test and Assembly Center (UTAC) Business Overview
11.5.3 United Test and Assembly Center (UTAC) System-in-Package Introduction
11.5.4 United Test and Assembly Center (UTAC) Revenue in System-in-Package Business (2018-2023)
11.5.5 United Test and Assembly Center (UTAC) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
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*If Applicable.
