SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
Market Analysis and Insights: Global System in Package (SiP) Technology Market
The global System in Package (SiP) Technology market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Covers:
This report presents an overview of global market for System in Package (SiP) Technology market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of System in Package (SiP) Technology, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for System in Package (SiP) Technology, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the System in Package (SiP) Technology revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global System in Package (SiP) Technology market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for System in Package (SiP) Technology revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
NXP
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
Hana Micron
Hella
IMEC
Inari Berhad
Infineon
ams
Apple
ARM
Fitbit
Fujitsu
GaN Systems
Huawei
Qualcomm
SONY
Segment by Type
2-D IC Packaging
2.5-D IC Packaging
3-D IC Packaging
Segment by Application
Consumer Electronics
Automotive
Telecommunication
Industrial System
Aerospace & Defense
Others (Traction & Medical)
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of System in Package (SiP) Technology in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of System in Package (SiP) Technology companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, System in Package (SiP) Technology revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global System in Package (SiP) Technology Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 2-D IC Packaging
1.2.3 2.5-D IC Packaging
1.2.4 3-D IC Packaging
1.3 Market by Application
1.3.1 Global System in Package (SiP) Technology Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Telecommunication
1.3.5 Industrial System
1.3.6 Aerospace & Defense
1.3.7 Others (Traction & Medical)
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global System in Package (SiP) Technology Market Perspective (2019-2030)
2.2 Global System in Package (SiP) Technology Growth Trends by Region
2.2.1 System in Package (SiP) Technology Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 System in Package (SiP) Technology Historic Market Size by Region (2019-2024)
2.2.3 System in Package (SiP) Technology Forecasted Market Size by Region (2025-2030)
2.3 System in Package (SiP) Technology Market Dynamics
2.3.1 System in Package (SiP) Technology Industry Trends
2.3.2 System in Package (SiP) Technology Market Drivers
2.3.3 System in Package (SiP) Technology Market Challenges
2.3.4 System in Package (SiP) Technology Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue System in Package (SiP) Technology by Players
3.1.1 Global System in Package (SiP) Technology Revenue by Players (2019-2024)
3.1.2 Global System in Package (SiP) Technology Revenue Market Share by Players (2019-2024)
3.2 Global System in Package (SiP) Technology Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of System in Package (SiP) Technology, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global System in Package (SiP) Technology Market Concentration Ratio
3.4.1 Global System in Package (SiP) Technology Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by System in Package (SiP) Technology Revenue in 2023
3.5 Global Key Players of System in Package (SiP) Technology Head office and Area Served
3.6 Global Key Players of System in Package (SiP) Technology, Product and Application
3.7 Global Key Players of System in Package (SiP) Technology, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 System in Package (SiP) Technology Breakdown Data by Type
4.1 Global System in Package (SiP) Technology Historic Market Size by Type (2019-2024)
4.2 Global System in Package (SiP) Technology Forecasted Market Size by Type (2025-2030)
5 System in Package (SiP) Technology Breakdown Data by Application
5.1 Global System in Package (SiP) Technology Historic Market Size by Application (2019-2024)
5.2 Global System in Package (SiP) Technology Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America System in Package (SiP) Technology Market Size (2019-2030)
6.2 North America System in Package (SiP) Technology Market Size by Type
6.2.1 North America System in Package (SiP) Technology Market Size by Type (2019-2024)
6.2.2 North America System in Package (SiP) Technology Market Size by Type (2025-2030)
6.2.3 North America System in Package (SiP) Technology Market Share by Type (2019-2030)
6.3 North America System in Package (SiP) Technology Market Size by Application
6.3.1 North America System in Package (SiP) Technology Market Size by Application (2019-2024)
6.3.2 North America System in Package (SiP) Technology Market Size by Application (2025-2030)
6.3.3 North America System in Package (SiP) Technology Market Share by Application (2019-2030)
6.4 North America System in Package (SiP) Technology Market Size by Country
6.4.1 North America System in Package (SiP) Technology Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America System in Package (SiP) Technology Market Size by Country (2019-2024)
6.4.3 North America System in Package (SiP) Technology Market Size by Country (2025-2030)
6.4.4 U.S.
6.4.5 Canada
7 Europe
7.1 Europe System in Package (SiP) Technology Market Size (2019-2030)
7.2 Europe System in Package (SiP) Technology Market Size by Type
7.2.1 Europe System in Package (SiP) Technology Market Size by Type (2019-2024)
7.2.2 Europe System in Package (SiP) Technology Market Size by Type (2025-2030)
7.2.3 Europe System in Package (SiP) Technology Market Share by Type (2019-2030)
7.3 Europe System in Package (SiP) Technology Market Size by Application
7.3.1 Europe System in Package (SiP) Technology Market Size by Application (2019-2024)
7.3.2 Europe System in Package (SiP) Technology Market Size by Application (2025-2030)
7.3.3 Europe System in Package (SiP) Technology Market Share by Application (2019-2030)
7.4 Europe System in Package (SiP) Technology Market Size by Country
7.4.1 Europe System in Package (SiP) Technology Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe System in Package (SiP) Technology Market Size by Country (2019-2024)
7.4.3 Europe System in Package (SiP) Technology Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China System in Package (SiP) Technology Market Size (2019-2030)
8.2 China System in Package (SiP) Technology Market Size by Type
8.2.1 China System in Package (SiP) Technology Market Size by Type (2019-2024)
8.2.2 China System in Package (SiP) Technology Market Size by Type (2025-2030)
8.2.3 China System in Package (SiP) Technology Market Share by Type (2019-2030)
8.3 China System in Package (SiP) Technology Market Size by Application
8.3.1 China System in Package (SiP) Technology Market Size by Application (2019-2024)
8.3.2 China System in Package (SiP) Technology Market Size by Application (2025-2030)
8.3.3 China System in Package (SiP) Technology Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia System in Package (SiP) Technology Market Size (2019-2030)
9.2 Asia System in Package (SiP) Technology Market Size by Type
9.2.1 Asia System in Package (SiP) Technology Market Size by Type (2019-2024)
9.2.2 Asia System in Package (SiP) Technology Market Size by Type (2025-2030)
9.2.3 Asia System in Package (SiP) Technology Market Share by Type (2019-2030)
9.3 Asia System in Package (SiP) Technology Market Size by Application
9.3.1 Asia System in Package (SiP) Technology Market Size by Application (2019-2024)
9.3.2 Asia System in Package (SiP) Technology Market Size by Application (2025-2030)
9.3.3 Asia System in Package (SiP) Technology Market Share by Application (2019-2030)
9.4 Asia System in Package (SiP) Technology Market Size by Region
9.4.1 Asia System in Package (SiP) Technology Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia System in Package (SiP) Technology Market Size by Region (2019-2024)
9.4.3 Asia System in Package (SiP) Technology Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Type
10.2.1 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Application
10.3.1 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Country
10.4.1 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America System in Package (SiP) Technology Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 NXP
11.1.1 NXP Company Details
11.1.2 NXP Business Overview
11.1.3 NXP System in Package (SiP) Technology Introduction
11.1.4 NXP Revenue in System in Package (SiP) Technology Business (2019-2024)
11.1.5 NXP Recent Developments
11.2 Amkor Technology
11.2.1 Amkor Technology Company Details
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology System in Package (SiP) Technology Introduction
11.2.4 Amkor Technology Revenue in System in Package (SiP) Technology Business (2019-2024)
11.2.5 Amkor Technology Recent Developments
11.3 ASE
11.3.1 ASE Company Details
11.3.2 ASE Business Overview
11.3.3 ASE System in Package (SiP) Technology Introduction
11.3.4 ASE Revenue in System in Package (SiP) Technology Business (2019-2024)
11.3.5 ASE Recent Developments
11.4 Jiangsu Changjiang Electronics Technology (JCET)
11.4.1 Jiangsu Changjiang Electronics Technology (JCET) Company Details
11.4.2 Jiangsu Changjiang Electronics Technology (JCET) Business Overview
11.4.3 Jiangsu Changjiang Electronics Technology (JCET) System in Package (SiP) Technology Introduction
11.4.4 Jiangsu Changjiang Electronics Technology (JCET) Revenue in System in Package (SiP) Technology Business (2019-2024)
11.4.5 Jiangsu Changjiang Electronics Technology (JCET) Recent Developments
11.5 Siliconware Precision Industries (SPIL)
11.5.1 Siliconware Precision Industries (SPIL) Company Details
11.5.2 Siliconware Precision Industries (SPIL) Business Overview
11.5.3 Siliconware Precision Industries (SPIL) System in Package (SiP) Technology Introduction
11.5.4 Siliconware Precision Industries (SPIL) Revenue in System in Package (SiP) Technology Business (2019-2024)
11.5.5 Siliconware Precision Industries (SPIL) Recent Developments
11.6 United Test and Assembly Center (UTAC)
11.6.1 United Test and Assembly Center (UTAC) Company Details
11.6.2 United Test and Assembly Center (UTAC) Business Overview
11.6.3 United Test and Assembly Center (UTAC) System in Package (SiP) Technology Introduction
11.6.4 United Test and Assembly Center (UTAC) Revenue in System in Package (SiP) Technology Business (2019-2024)
11.6.5 United Test and Assembly Center (UTAC) Recent Developments
11.7 Hana Micron
11.7.1 Hana Micron Company Details
11.7.2 Hana Micron Business Overview
11.7.3 Hana Micron System in Package (SiP) Technology Introduction
11.7.4 Hana Micron Revenue in System in Package (SiP) Technology Business (2019-2024)
11.7.5 Hana Micron Recent Developments
11.8 Hella
11.8.1 Hella Company Details
11.8.2 Hella Business Overview
11.8.3 Hella System in Package (SiP) Technology Introduction
11.8.4 Hella Revenue in System in Package (SiP) Technology Business (2019-2024)
11.8.5 Hella Recent Developments
11.9 IMEC
11.9.1 IMEC Company Details
11.9.2 IMEC Business Overview
11.9.3 IMEC System in Package (SiP) Technology Introduction
11.9.4 IMEC Revenue in System in Package (SiP) Technology Business (2019-2024)
11.9.5 IMEC Recent Developments
11.10 Inari Berhad
11.10.1 Inari Berhad Company Details
11.10.2 Inari Berhad Business Overview
11.10.3 Inari Berhad System in Package (SiP) Technology Introduction
11.10.4 Inari Berhad Revenue in System in Package (SiP) Technology Business (2019-2024)
11.10.5 Inari Berhad Recent Developments
11.11 Infineon
11.11.1 Infineon Company Details
11.11.2 Infineon Business Overview
11.11.3 Infineon System in Package (SiP) Technology Introduction
11.11.4 Infineon Revenue in System in Package (SiP) Technology Business (2019-2024)
11.11.5 Infineon Recent Developments
11.12 ams
11.12.1 ams Company Details
11.12.2 ams Business Overview
11.12.3 ams System in Package (SiP) Technology Introduction
11.12.4 ams Revenue in System in Package (SiP) Technology Business (2019-2024)
11.12.5 ams Recent Developments
11.13 Apple
11.13.1 Apple Company Details
11.13.2 Apple Business Overview
11.13.3 Apple System in Package (SiP) Technology Introduction
11.13.4 Apple Revenue in System in Package (SiP) Technology Business (2019-2024)
11.13.5 Apple Recent Developments
11.14 ARM
11.14.1 ARM Company Details
11.14.2 ARM Business Overview
11.14.3 ARM System in Package (SiP) Technology Introduction
11.14.4 ARM Revenue in System in Package (SiP) Technology Business (2019-2024)
11.14.5 ARM Recent Developments
11.15 Fitbit
11.15.1 Fitbit Company Details
11.15.2 Fitbit Business Overview
11.15.3 Fitbit System in Package (SiP) Technology Introduction
11.15.4 Fitbit Revenue in System in Package (SiP) Technology Business (2019-2024)
11.15.5 Fitbit Recent Developments
11.16 Fujitsu
11.16.1 Fujitsu Company Details
11.16.2 Fujitsu Business Overview
11.16.3 Fujitsu System in Package (SiP) Technology Introduction
11.16.4 Fujitsu Revenue in System in Package (SiP) Technology Business (2019-2024)
11.16.5 Fujitsu Recent Developments
11.17 GaN Systems
11.17.1 GaN Systems Company Details
11.17.2 GaN Systems Business Overview
11.17.3 GaN Systems System in Package (SiP) Technology Introduction
11.17.4 GaN Systems Revenue in System in Package (SiP) Technology Business (2019-2024)
11.17.5 GaN Systems Recent Developments
11.18 Huawei
11.18.1 Huawei Company Details
11.18.2 Huawei Business Overview
11.18.3 Huawei System in Package (SiP) Technology Introduction
11.18.4 Huawei Revenue in System in Package (SiP) Technology Business (2019-2024)
11.18.5 Huawei Recent Developments
11.19 Qualcomm
11.19.1 Qualcomm Company Details
11.19.2 Qualcomm Business Overview
11.19.3 Qualcomm System in Package (SiP) Technology Introduction
11.19.4 Qualcomm Revenue in System in Package (SiP) Technology Business (2019-2024)
11.19.5 Qualcomm Recent Developments
11.20 SONY
11.20.1 SONY Company Details
11.20.2 SONY Business Overview
11.20.3 SONY System in Package (SiP) Technology Introduction
11.20.4 SONY Revenue in System in Package (SiP) Technology Business (2019-2024)
11.20.5 SONY Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
NXP
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)
Hana Micron
Hella
IMEC
Inari Berhad
Infineon
ams
Apple
ARM
Fitbit
Fujitsu
GaN Systems
Huawei
Qualcomm
SONY
听
听
*If Applicable.
