Global System On Package (SOP) Market Research Report 2024

Publication ID:

PB502240837

Publication Date:

February 23, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

System on package (SOP) refers to technology that places an entire system with computing, communications, and consumer functions all in a single chip.
The global System On Package (SOP) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for System On Package (SOP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding System On Package (SOP).
Report Scope
The System On Package (SOP) market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global System On Package (SOP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the System On Package (SOP) companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung Electronics Co., Ltd.
ASE Group
Amkor Technology
Toshiba Corporation
Qualcomm Incorporated
ChipMOS Technologies Inc
Powertech Technologies Inc.
Fujitsu
Renesas Electronics Corporation
Siliconware Precision Industries Co.
NXP
Jiangsu Changjiang Electronics Technology Co. Ltd.
Segment by Type
Fine-Pitch
High Bandwidth Wiring
Advanced Microchannel Cooling
Others
Segment by Application
Consumer Electronics
Wireless Communication
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of System On Package (SOP) companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global System On Package (SOP) Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Fine-Pitch
1.2.3 High Bandwidth Wiring
1.2.4 Advanced Microchannel Cooling
1.2.5 Others
1.3 Market by Application
1.3.1 Global System On Package (SOP) Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Wireless Communication
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global System On Package (SOP) Market Perspective (2019-2030)
2.2 System On Package (SOP) Growth Trends by Region
2.2.1 Global System On Package (SOP) Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 System On Package (SOP) Historic Market Size by Region (2019-2024)
2.2.3 System On Package (SOP) Forecasted Market Size by Region (2025-2030)
2.3 System On Package (SOP) Market Dynamics
2.3.1 System On Package (SOP) Industry Trends
2.3.2 System On Package (SOP) Market Drivers
2.3.3 System On Package (SOP) Market Challenges
2.3.4 System On Package (SOP) Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top System On Package (SOP) Players by Revenue
3.1.1 Global Top System On Package (SOP) Players by Revenue (2019-2024)
3.1.2 Global System On Package (SOP) Revenue Market Share by Players (2019-2024)
3.2 Global System On Package (SOP) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by System On Package (SOP) Revenue
3.4 Global System On Package (SOP) Market Concentration Ratio
3.4.1 Global System On Package (SOP) Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by System On Package (SOP) Revenue in 2023
3.5 System On Package (SOP) Key Players Head office and Area Served
3.6 Key Players System On Package (SOP) Product Solution and Service
3.7 Date of Enter into System On Package (SOP) Market
3.8 Mergers & Acquisitions, Expansion Plans
4 System On Package (SOP) Breakdown Data by Type
4.1 Global System On Package (SOP) Historic Market Size by Type (2019-2024)
4.2 Global System On Package (SOP) Forecasted Market Size by Type (2025-2030)
5 System On Package (SOP) Breakdown Data by Application
5.1 Global System On Package (SOP) Historic Market Size by Application (2019-2024)
5.2 Global System On Package (SOP) Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America System On Package (SOP) Market Size (2019-2030)
6.2 North America System On Package (SOP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America System On Package (SOP) Market Size by Country (2019-2024)
6.4 North America System On Package (SOP) Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe System On Package (SOP) Market Size (2019-2030)
7.2 Europe System On Package (SOP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe System On Package (SOP) Market Size by Country (2019-2024)
7.4 Europe System On Package (SOP) Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific System On Package (SOP) Market Size (2019-2030)
8.2 Asia-Pacific System On Package (SOP) Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific System On Package (SOP) Market Size by Region (2019-2024)
8.4 Asia-Pacific System On Package (SOP) Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America System On Package (SOP) Market Size (2019-2030)
9.2 Latin America System On Package (SOP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America System On Package (SOP) Market Size by Country (2019-2024)
9.4 Latin America System On Package (SOP) Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa System On Package (SOP) Market Size (2019-2030)
10.2 Middle East & Africa System On Package (SOP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa System On Package (SOP) Market Size by Country (2019-2024)
10.4 Middle East & Africa System On Package (SOP) Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Samsung Electronics Co., Ltd.
11.1.1 Samsung Electronics Co., Ltd. Company Detail
11.1.2 Samsung Electronics Co., Ltd. Business Overview
11.1.3 Samsung Electronics Co., Ltd. System On Package (SOP) Introduction
11.1.4 Samsung Electronics Co., Ltd. Revenue in System On Package (SOP) Business (2019-2024)
11.1.5 Samsung Electronics Co., Ltd. Recent Development
11.2 ASE Group
11.2.1 ASE Group Company Detail
11.2.2 ASE Group Business Overview
11.2.3 ASE Group System On Package (SOP) Introduction
11.2.4 ASE Group Revenue in System On Package (SOP) Business (2019-2024)
11.2.5 ASE Group Recent Development
11.3 Amkor Technology
11.3.1 Amkor Technology Company Detail
11.3.2 Amkor Technology Business Overview
11.3.3 Amkor Technology System On Package (SOP) Introduction
11.3.4 Amkor Technology Revenue in System On Package (SOP) Business (2019-2024)
11.3.5 Amkor Technology Recent Development
11.4 Toshiba Corporation
11.4.1 Toshiba Corporation Company Detail
11.4.2 Toshiba Corporation Business Overview
11.4.3 Toshiba Corporation System On Package (SOP) Introduction
11.4.4 Toshiba Corporation Revenue in System On Package (SOP) Business (2019-2024)
11.4.5 Toshiba Corporation Recent Development
11.5 Qualcomm Incorporated
11.5.1 Qualcomm Incorporated Company Detail
11.5.2 Qualcomm Incorporated Business Overview
11.5.3 Qualcomm Incorporated System On Package (SOP) Introduction
11.5.4 Qualcomm Incorporated Revenue in System On Package (SOP) Business (2019-2024)
11.5.5 Qualcomm Incorporated Recent Development
11.6 ChipMOS Technologies Inc
11.6.1 ChipMOS Technologies Inc Company Detail
11.6.2 ChipMOS Technologies Inc Business Overview
11.6.3 ChipMOS Technologies Inc System On Package (SOP) Introduction
11.6.4 ChipMOS Technologies Inc Revenue in System On Package (SOP) Business (2019-2024)
11.6.5 ChipMOS Technologies Inc Recent Development
11.7 Powertech Technologies Inc.
11.7.1 Powertech Technologies Inc. Company Detail
11.7.2 Powertech Technologies Inc. Business Overview
11.7.3 Powertech Technologies Inc. System On Package (SOP) Introduction
11.7.4 Powertech Technologies Inc. Revenue in System On Package (SOP) Business (2019-2024)
11.7.5 Powertech Technologies Inc. Recent Development
11.8 Fujitsu
11.8.1 Fujitsu Company Detail
11.8.2 Fujitsu Business Overview
11.8.3 Fujitsu System On Package (SOP) Introduction
11.8.4 Fujitsu Revenue in System On Package (SOP) Business (2019-2024)
11.8.5 Fujitsu Recent Development
11.9 Renesas Electronics Corporation
11.9.1 Renesas Electronics Corporation Company Detail
11.9.2 Renesas Electronics Corporation Business Overview
11.9.3 Renesas Electronics Corporation System On Package (SOP) Introduction
11.9.4 Renesas Electronics Corporation Revenue in System On Package (SOP) Business (2019-2024)
11.9.5 Renesas Electronics Corporation Recent Development
11.10 Siliconware Precision Industries Co.
11.10.1 Siliconware Precision Industries Co. Company Detail
11.10.2 Siliconware Precision Industries Co. Business Overview
11.10.3 Siliconware Precision Industries Co. System On Package (SOP) Introduction
11.10.4 Siliconware Precision Industries Co. Revenue in System On Package (SOP) Business (2019-2024)
11.10.5 Siliconware Precision Industries Co. Recent Development
11.11 NXP
11.11.1 NXP Company Detail
11.11.2 NXP Business Overview
11.11.3 NXP System On Package (SOP) Introduction
11.11.4 NXP Revenue in System On Package (SOP) Business (2019-2024)
11.11.5 NXP Recent Development
11.12 Jiangsu Changjiang Electronics Technology Co. Ltd.
11.12.1 Jiangsu Changjiang Electronics Technology Co. Ltd. Company Detail
11.12.2 Jiangsu Changjiang Electronics Technology Co. Ltd. Business Overview
11.12.3 Jiangsu Changjiang Electronics Technology Co. Ltd. System On Package (SOP) Introduction
11.12.4 Jiangsu Changjiang Electronics Technology Co. Ltd. Revenue in System On Package (SOP) Business (2019-2024)
11.12.5 Jiangsu Changjiang Electronics Technology Co. Ltd. Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

Samsung Electronics Co., Ltd.
ASE Group
Amkor Technology
Toshiba Corporation
Qualcomm Incorporated
ChipMOS Technologies Inc
Powertech Technologies Inc.
Fujitsu
Renesas Electronics Corporation
Siliconware Precision Industries Co.
NXP
Jiangsu Changjiang Electronics Technology Co. Ltd.

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